Flip-chip underfill

Anderson B, Bacher B, Gomez M. Development Methodology for a High Performance Snap-cure, Flip-chip Underfill. Dexter Electronic Materials Technical Paper Mar. 1999. Gilleo K., Blumel D. The great underfill race. In Proc. Int. Microelectronics and Packaging Soc. 1998 701-706. [Pg.72]

Babiarz A, Huysmans R Adhesives in dispensing processes for flip chip underfill, Proc. ISHM Nordic 34th Annual Conf. Oslo Norway Sep. 21-24, 1997. [Pg.214]

Lim R, Duck A. Controlhng process parameters for flip-chip underfill. Electronics Engineer. Jul. 2000. [Pg.214]

FC-212B/Hitachi Anisotropic 180 °C, 145 psi, 20 seconds Flip-chip underfill and film electrical coimections... [Pg.238]

Adamson SJ. Review of CSP and flip-chip underfill processes and when to use the right dispensing tools for efficient manufacturing, GlohalRONICS Technology Conference... [Pg.286]

Yaeger, E., and Carson, G., Beyond Flip Chip Underfills Enhance CSP Reliability, Chip Scale Review (Mar. 2001)... [Pg.94]

Babiarz, A., and Fluysmans, F., Adhesives in Dispensing Processes for Flip Chip Underfill, Proc. ISHMNordic 34 Annual Conf., Oslo, Norway (Sep. 21-24,1997)... [Pg.259]

Adamson, S. J., CSP and Flip-Chip Underfill, Advanced Packaging (Jun. [Pg.259]

Lim, R., and Duck, A., Controlling Process Parameters for Flip-Chip Underfill,... [Pg.259]

Loctite 3560/ Loctite Flowable epoxy 3 Sihcon, ceramics, laminates Dispense, capillary underfill Flip-chip underfill in chip carriers and chip-on-board laminates... [Pg.292]

Loctite 3562/ Loctite High-purity epoxy 3 Ceramics, laminate Dispense, capUlary underfill Flip-chip underfill... [Pg.293]

Loctite 3563/ Loctite Rapid-cure, fast-flow, capillary epoxy underfill 1 Ceramics Dispense, capillary underfill Flip-chip underfill in hare-chip protection (memory cards, chip carriers, hybrids and MCMs)... [Pg.293]

Tonapi, S.,andReitz,B., Flip-Chip Underfill Design and Material Challenges, Chip Scale Review (Jan./Feb. 2004)... [Pg.344]

Anderson, B., Bacher, B., and Gomez, M., Development Methodology fora HighPerformance Snap-Cure, Flip-Chip Underfill, Dexter Electronic Nfaterials Technical Paper (Mar. 1999)... [Pg.92]

FP4530/ Loctite Snap cure, last-flow underfill 1 N/A Automated Flip-chip underfill... [Pg.296]

FC-212B/ Hitachi Anisotropic film 180°C, 145 psi, 20 sec Flip-chip underfill and electrical connections... [Pg.300]

Zhang, Z., Wong, C. P. Recent advances in flip-chip underfill materials, process, and reliability. In IEEE Transactions on Advanced Packaging Vol. 27, No. 3 (2004), pp. 515-524. [Pg.320]

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