Direct chip attach

In the USA, demand for electronic polymers is expected to grown annually 6.4% through 2005 [5]. Growth will be driven by a shift to new electronic packaging technologies such as direct chip attachment as well as higher-cost specialty resins. Silicones can offer several functions to microelectronics ... 

Further miniaturization is enabled by direct assembly of bare dies onto circuit carriers. This kind of component is electrically connected by wire bonding. Other methods for direct chip attachment are flip chip and tape automated bonding. All three methods require special equipment for processing and inspection. 

From Blackwell, G.R., Direct chip attach, in The Electronic Packaging Handbook, Blackwell, G.R., Ed., CRC Press, Boca Raton, FL, 2000, p. 4-5. 

The relentless pressures of size, weight, and volume reduction of electronic products have resulted in a growth in interest in direct chip attach (DCA) methods, where bare IC chips are mounted directly to the substrate. These methods are extensively used on chip-on-board (COB) and multichip module (MCM) assemblies, as shown in Fig. 2.4. 

C. Becker, R. Brooks,T. Kirby, K. Moore, C. Raleigh,J. Stafford, and K.Wasko, Motorola, Inc., Direct Chip Attach (DCA), the Introduction of a New Packaging Concept for Portable Electronics, Proceedings of the 1993 International Electronics Packaging Conference, San Diego, CA, September 12-15,1993. 

Part range Part capacity Placement speed Capabilities Full SMT (SOD, SOT, SOIC, PLCC, CCGA, BGA), direct-chip attach (DCA), and odd-form components. Several hundreds 5,000-15,000 CPH 1. Oversized and odd-form parts placed with very high accuracy. 2. Moving gantry, fixed PCB and feeders. 3. Flexibility of using tape, tube, bulk, and tray part supplies. 

Alternatively, a low-melting-temperature solder (e.g., the eutectic Pb-Sn alloy) may be utilized to attach a silicon chip (having high-Pb, Pb-Sn solder bumps) to organic printed circuit boards. The circuit boards are not damaged by the low-temperature solder attachment process. This version of flip chip assembly is referred to as direct chip attach (DCA) or flip chip on board (FCOB) technology. 

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