Bond wires

When a tank is emptied of Class I liquid, there is left a mixture of vapor and air, which can be, and often is, within the flammable range. When such a tank is refilled with a Class I liquid, any charge that reaches the tank shell will be bled off by the required bond wire. Also, there will be no flammable mixture at the surface of the rising oil level because the Class I liquid produces at its surface a mixture too rich to be ignitable. 

That reduces the ground bounce caused by the internal bond wires of the IC, but getting the entire converter to work properly requires a deep understanding of the role played by the PCB, its contribution to ground bounce, noise, and so on. 

Monolithic sensor systems, however, offer advantages such as low power consumption or reduced packaging efforts. Integration of an on-chip serial interface reduces the number of bonding wires, especially in the case of an integrated multisensor array. Taking into account the mass-production facilities with estabhshed microelectronic and microtechnological processes, commercialization of monoHthic... 

As part of the electrostatic analysis, potentials of 10 kV to 15 kV were applied to the metal lead, bond wires, and metallized top surface of the SiC die. In all scenarios, the base plate was maintained at zero potential. The ambient environment was varied among several materials including air, epoxy, Fluorinert, and SF in order to evaluate them as encapsulants. Table 3.3 gives the permittivities and electric field strengths of the package materials and the ambient environments used in the simulations. 

One of the most frequent failures encountered in the encapsulated micro devices is the so-called open circuit, which results from a break of the bonding wire between circuitry. The breakage is primarily due to corrosion. This is initiated by the impurities in epoxy resins, such as halogen, which upon exposure to heat and moisture generate a corrosive acid. 

Whether or not this rejection, and hence a differential connection, are needed depends on the application. Chips containing multiple sensors or two-chip solutions in which the interface between the sensor and the electronics passes over bond-wires are obvious candidates to gain from this arrangement The relative size of parasitics in the differential versus the single-ended arrangement should also be considered when deciding which topology to use. 

The pressure-sensing element is protected by a three-layer protection structure comprising a SiN passivation film with superior moisture resistance, a parylene film for protecting the bonding wire, and gel for protecting the whole element. This structure makes it possible to achieve the creation of a surface-detection intake pressure sensor with high contamination immunity. 

The TAC module of a Becker Hiekl SPC-830 TCSPC deviee is shown in Fig. 4.6. The module is built in chip-and-wire hybrid technique. Most of the semi-eonduetor ehips are inserted as bare diee eonnected to the signal lines on the substrate by bond wires. 

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