Epoxy temperature

Like mechanically fastened metal structures, composites exhibit failure modes in tension, shear and bearing but, because of the complex failure mechanisms of composites, two further modes are possible, namely cleavage and puUout. Environmental degradation of a bolted joint, after exposure to hot, wet environment is most likely to occur in the shear and bearing strength properties. The evidence shows that for fiber reinforced epoxies, temperature has a more significant effect than moisture, but in the presence of both at 127°C, a strength loss of up to 40 percent is possible. 

Epoxy Temperature, K Young s modulus, GPa Ultimate strength, MPa Ultimate strain, %... 

Specimens for (S)TEM have to be transparent to the electron beam. In order to get good contrast and resolution, they have to be thin enough to minimize inelastic scattering. The required thin sections of organic materials can be obtained by ultramicrotomy eitlier after embedding into suitable resms (mostly epoxy- or methacrylate resins [H]) or directly at low temperatures by cryo-ultramicrotomy [12]. 

The steroidal 4/3-acetoxy-5/J,6/l/-epoxy-2-en-l-one system 546 was converted at room temperature into the 6/3-hydroxy-2,4-dien-l-one 547 by reductive elimination of the vicinal oxygen function, and the reaction has been applied to the synthesis of withanolide[352]. 

Epoxy novolac resins are produced by glycidation of the low-molecular-weight reaction products of phenol (or cresol) with formaldehyde. Highly cross-linked systems are formed that have superior performance at elevated temperatures. 

Uses. 3-Pentenenitrile, 3PN, is used entirely by the manufacturers to make adiponitrile. i7j -2-Pentenenitrile, 2PN, can be cycli2ed catalyticaHy at high temperature to produce pyndine, a solvent and agncultural chemical intermediate. 2PN is also chlorinated to manufacture pentachloropyndine, an intermediate in the insecticide Dursban produced by Dow. Addition of ammonia to 2PN foUowed by reduction leads to 1,3-pentadiamine (Dytek ep), which is used as a curing agent for epoxy coatings and as a chain modifier in polyurethanes. 

With aldehydes, primary alcohols readily form acetals, RCH(OR )2. Acetone also forms acetals (often called ketals), (CH2)2C(OR)2, in an exothermic reaction, but the equiUbrium concentration is small at ambient temperature. However, the methyl acetal of acetone, 2,2-dimethoxypropane [77-76-9] was once made commercially by reaction with methanol at low temperature for use as a gasoline additive (5). Isopropenyl methyl ether [116-11-OJ, useful as a hydroxyl blocking agent in urethane and epoxy polymer chemistry (6), is obtained in good yield by thermal pyrolysis of 2,2-dimethoxypropane. With other primary, secondary, and tertiary alcohols, the equiUbrium is progressively less favorable to the formation of ketals, in that order. However, acetals of acetone with other primary and secondary alcohols, and of other ketones, can be made from 2,2-dimethoxypropane by transacetalation procedures (7,8). Because they hydroly2e extensively, ketals of primary and especially secondary alcohols are effective water scavengers. 

The two-part epoxy adhesive, readily available in hardware stores or other consumer outlets, comes in two tubes. One tube contains the epoxy resin, the other contains an amine hardener. Common diamine room temperature epoxy curing agents are materials such as the polyamides, available under the trade name Versamid. These polyamides are the reaction products of dimer acids and aUphatic diamines such as diethylenetriamine [111-40-0] ... 

Epoxy stmctural adhesives are used in an extraordinarily wide range of appHcations. They are available in essentially all of the forms discussed above, except for primer—Hquid combinations or as room temperature curing Hquids. The highest technology appHcation for epoxies is in aerospace stmctural... 

Fiber-reiaforced panels covered with PVF have been used for greenhouses. Transparent PVF film is used as the cover for flat-plate solar collectors (114) and photovoltaic cells (qv) (115). White PVF pigmented film is used as the bottom surface of photovoltaic cells. Nonadhering film is used as a release sheet ia plastics processiag, particularly ia high temperature pressing of epoxy resias for circuit boards (116—118) and aerospace parts. Dispersions of PVF are coated on the exterior of steel hydrauHc brake tubes and fuel lines for corrosion protection. 

Grade G-10, glass fabric with epoxy resin binder, has extremely high mechanical strength (flexural, impact, and bonding) at room temperature and good dielectric loss and electric strength properties under both dry and humid conditions. 

Grade G-11, glass fabric with heat-resistant epoxy resin binder, has properties similar to those of Grade G-10 at room temperature and, in addition, has high retention of flexural strength at elevated temperatures. 

Composite-Based Laminates. Grade CEM-1 are laminates with continuous-filament glass cloth surfaces and a cellulose core, all with a flame-resistant epoxy resin binder. With good punching practice, sheets up to and including 2.4 mm (0.094 in.) in thickness may be punched at temperatures not less than 23°C (73°F). These laminates meet UL94 V-0 when tested in accordance with UL94. 

For many moderate-duty films for operating temperatures below 80 to 120°C, M0S2 is used in combination with acryflcs, alkyds, vinyls, and acetate room temperature curing resins. For improved wear life and temperatures up to 150—300°C, baked coatings are commonly used with thermosetting resins, eg, phenohcs, epoxies, alkyds, siUcones, polyimides, and urethanes. Of these, the MlL-L-8937 phenoHc type is being appHed most extensively. 

Thermosetting-encapsulation compounds, based on epoxy resins (qv) or, in some niche appHcations, organosiHcon polymers, are widely used to encase electronic devices. Polyurethanes, polyimides, and polyesters are used to encase modules and hybrids intended for use under low temperature, low humidity conditions. Modified polyimides have the advantages of thermal and moisture stabiHty, low coefficients of thermal expansion, and high material purity. Thermoplastics are rarely used for PEMs, because they are low in purity, requHe unacceptably high temperature and pressure processing conditions. 

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