Epoxy resin room-temperature

Adhesives which are meant to cure at temperatures of 120 or 171°C require curatives which are latent at room temperature, but react quickly at the cure temperatures. Dicyanodiamide [461-58-5], (TH INI is one such latent curative for epoxy resins. It is insoluble in the epoxy at room temperature but rapidly solubilizes at elevated temperatures. Other latent curatives for 171°C are complexes of imidazoles with transition metals, complexes of Lewis acids (eg, boron trifluoride and amines), and diaminodiphenylsulfone, which is also used as a curing agent in high performance composites. For materials which cure at lower temperatures (120°C), these curing agents can be made more soluble by alkylation of dicyanodiamide. Other materials providing latency at room temperature but rapid cure at 120°C are the blocked isocyanates, such as the reaction products of toluene diisocyanate and amines. At 120°C the blocked isocyanate decomposes to regenerate the isocyanate and liberate an amine which can initiate polymerization of the epoxy resin. Materials such as Monuron can also be used to accelerate the cure of dicyanodiamide so that it takes place at 120°C. 

The resin has good adhesion to glass and carbon fibers and shows a lower coefficient of thermal expansion than epoxies and most plastics. As a matrix resin in a carbon composite, PEAR is said to surpass epoxy (Hercules/Hexcel 3501-6) by 48% in tensile, compression, hot/wet, compression-after-impact, and other fiber-dominated properties. Shear strength (matrix-dominated property) is reported at 50% higher than epoxy at room temperature and up to 80% higher under hot-wet conditions. 

On the other hand, following Smith and Smith [89], BF3-MEA is useful because it is a latent catalyst, that is, it is inactive at room temperature and requires elevated temperature (120°C or higher) to be activated. The experimental data obtained by Smith and Smith [89] indicate that BF3-MEA is not a true catalyst at all. At epoxy resin cure temperature (120-150°C), it rapidly converts to fluo-roboric acid, and it is the fluoroboric acid that catalyzes the epoxy cure [89]. Perhaps, the fluoroboric acid is produced as follows ... 

The viscosity curves for uncatalyzed resin samples mixed with different GO concentrations are demonstrated in Figure 9.7. It was evident that the addition of GO nanoparticles enhanced the viscosity as the GO content increased. The viscosity of the GO-modified epoxy system with a GO content of 0.2 wt% was approximately 75% higher than that of pure epoxy at room temperature and was almost 28% higher at 70 °C. This is possibly due to the thermal conductivity of GO nanoparticles to facilitate... 

The two-part epoxy adhesive, readily available in hardware stores or other consumer outlets, comes in two tubes. One tube contains the epoxy resin, the other contains an amine hardener. Common diamine room temperature epoxy curing agents are materials such as the polyamides, available under the trade name Versamid. These polyamides are the reaction products of dimer acids and aUphatic diamines such as diethylenetriamine [111-40-0] ... 

Grade G-10, glass fabric with epoxy resin binder, has extremely high mechanical strength (flexural, impact, and bonding) at room temperature and good dielectric loss and electric strength properties under both dry and humid conditions. 

Grade G-11, glass fabric with heat-resistant epoxy resin binder, has properties similar to those of Grade G-10 at room temperature and, in addition, has high retention of flexural strength at elevated temperatures. 

For many moderate-duty films for operating temperatures below 80 to 120°C, M0S2 is used in combination with acryflcs, alkyds, vinyls, and acetate room temperature curing resins. For improved wear life and temperatures up to 150—300°C, baked coatings are commonly used with thermosetting resins, eg, phenohcs, epoxies, alkyds, siUcones, polyimides, and urethanes. Of these, the MlL-L-8937 phenoHc type is being appHed most extensively. 

Heat resistance is an important characteristic of the bond. The strength of typical abrasive stmctures is tested at RT and at 300°C. Flexural strengths are between 24.1 and 34.4 MPa (3500—5000 psi). An unmodified phenoHc resin bond loses about one-third of its room temperature strength at 298°C. Novolak phenoHc resins are used almost exclusively because these offer heat resistance and because the moisture given off during the cure of resole resins results in undesirable porosity. Some novolaks modified with epoxy or poly(vinyl butyral) resin are used for softer grinding action. 

Bismaleimide Resins via EI E Reaction. The copolymerization of a BMI with o,o -diallylbisphenol A [1745-89-7] (DABA) is a resia coacept that has beea widely accepted by the iadustry because BMI—DABA bleads are tacky soHds at room temperature and therefore provide all the desired properties ia prepregs, such as drape and tack, similar to epoxies. Crystalline BMI can easily be blended with DABA, which is a high viscosity fluid at room temperature. Upon heating BMI—DABA blends copolymerize via complex ENE and Diels-Alder reactions as outlined ia Eigure 8. 

Adhesives. Because of exceUent adhesion to many substrates, epoxy resins are extensively used for high performance adhesives. These can be categorized into high temperature curing systems (soHds and Hquids) and room temperature curing systems (Hquids). 

Meta-phenylenediamine, a crystalline solid with a melting point of about 60°C, gives cured resins with a heat distortion temperature of 150°C and very good chemical resistance. It has a pot life of six hours for a 200 g batch at room temperature whilst complete cures require cure times of four to six hours at 150°C. About 14 pts phr are used with the liquid epoxies. The main disadvantages are the need to heat the components in order to mix them, the irritating nature of the amine and persistent yellow staining that can occur on skin and clothing. The hardener finds use in the manufacture of chemical-resistant laminates. 

Hexahydrophthalic anhydride (Figure 26.10 II) (Mol. Wt. 154) has a melting point of 35-36°C and is soluble in the epoxy resin at room temperature. When 0.5% of a catalyst such as benzyldimethylamine is used the curing times are of the same order as with phthalic anhydride. About 80 phr are required. In addition... 

Nowadays the major thermosetting resins used in conjunction with glass fibre reinforcement are unsaturated polyester resins and to a lesser extent epoxy resins. The most important advantages which these materials can offer are that they do not liberate volatiles during cross-linking and they can be moulded using low pressures at room temperature. Table 3.1 shows typical properties of fibre reinforced epoxy. 

The isocyanate group is more reactive than the epoxy group in that it will react at room temperature with water and hydroxyl groups as well as with amine groups. However, the latter reaction is too fast to be practicable so the standard two-pack coatings are based on isocyanate and polyhydroxyl prepolymers such as hydroxyl terminated polyesters or polyethers as in the last example given in the section on epoxy resins. 

Rigid polyurethane foams were prepared at room temperature using eommercial polyols and polymerie 4,4 -diphenyl methane diisoeyanate, and used to study their reeyeling by aminolysis. The reaction products obtained by treatment with diethylene triamine at 180 C were evaluated as hardeners for epoxy resins. The exothermie heats of euring were determined over the temperature range 60-80 C by differential scanning calorimetry. A reaction order of 2.2-2.4 was obtained. 8 refs. 

Phenol, C6H5OH, is a benzene ring with a hydroxyl group, -OH, in place of a hydrogen. That makes it a member of the alcohol family. Most phenol is made by the oxidation route. At room temperature phenol is a solid but is corrosive like an acid. It is used to make phenolic resins and to make Bisphenol A (feed for epoxy and polycarbonate resins) and caprolactam (feed for Nylon 6). 

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