Epoxy high temperature

Polysulfides and stability, and compatibility with epoxies high temperature resistance RT rapid cure times Poor performance at Consumer adhesives ... 

Uses. 3-Pentenenitrile, 3PN, is used entirely by the manufacturers to make adiponitrile. i7j -2-Pentenenitrile, 2PN, can be cycli2ed catalyticaHy at high temperature to produce pyndine, a solvent and agncultural chemical intermediate. 2PN is also chlorinated to manufacture pentachloropyndine, an intermediate in the insecticide Dursban produced by Dow. Addition of ammonia to 2PN foUowed by reduction leads to 1,3-pentadiamine (Dytek ep), which is used as a curing agent for epoxy coatings and as a chain modifier in polyurethanes. 

Fiber-reiaforced panels covered with PVF have been used for greenhouses. Transparent PVF film is used as the cover for flat-plate solar collectors (114) and photovoltaic cells (qv) (115). White PVF pigmented film is used as the bottom surface of photovoltaic cells. Nonadhering film is used as a release sheet ia plastics processiag, particularly ia high temperature pressing of epoxy resias for circuit boards (116—118) and aerospace parts. Dispersions of PVF are coated on the exterior of steel hydrauHc brake tubes and fuel lines for corrosion protection. 

Thermosetting-encapsulation compounds, based on epoxy resins (qv) or, in some niche appHcations, organosiHcon polymers, are widely used to encase electronic devices. Polyurethanes, polyimides, and polyesters are used to encase modules and hybrids intended for use under low temperature, low humidity conditions. Modified polyimides have the advantages of thermal and moisture stabiHty, low coefficients of thermal expansion, and high material purity. Thermoplastics are rarely used for PEMs, because they are low in purity, requHe unacceptably high temperature and pressure processing conditions. 

Titanium alkoxides are used for the hardening and cross-linking of epoxy, siUcon, urea, melamine, and terephthalate resins in the manufacture of noncorrodable, high temperature lacquers in the sol-gel process as water repellents and adhesive agents (especially with foils) to improve glass surfaces as catalyst in olefin polymeri2ation, and for condensation and esterification. 

Phenohc resins (qv), once a popular matrix material for composite materials, have in recent years been superseded by polyesters and epoxies. Nevertheless, phenohc resins stiU find considerable use in appHcations where high temperature stabiHty and fire resistance are of paramount importance. Typical examples of the use of phenoHc resins in the marine industry include internal bulkheads, decks, and certain finishings. The curing process involves significant production of water, often resulting in the formation of voids within the volume of the material. Further, the fact that phenoHcs are prone to absorb water in humid or aqueous conditions somewhat limits their widespread appHcation. PhenoHc resins are also used as the adhesive in plywood, and phenohc molding compounds have wide use in household appliances and in the automotive, aerospace, and electrical industries (12). 

Adhesives. Because of exceUent adhesion to many substrates, epoxy resins are extensively used for high performance adhesives. These can be categorized into high temperature curing systems (soHds and Hquids) and room temperature curing systems (Hquids). 

Despite all precautions, urethanes can be used most effectively within certain thermal and oxidation limits. Outside these parameters, other adhesives, such as certain epoxies, cyanate esters, and other high-temperature adhesives, should be considered. 

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