Strength flexural

ASTM D1184-98 Standard test method for flexural strength of adhesive bonded laminated assemblies. 

ASTM D3111-99 Standard practice for flexibility determination of hot melt adhesives by mandrel bend test method. 

Federal Test Method Std. 175B, Method 1081 Rexibility of adhesives. 

2 Thermophvsical Profile. Typical 181 B-glass (A-llOO finish) PABM laminate mechanicals are shovm in T le I. Room temperature flexural strength and modulus are 70,000 psi and 4,000,000 psi, respectively. These laminates retain 709 and 80 i, respectively of their room temperature flexural strength and modulus at 480°F. 

To allow a more meaningful comparison of PABM s with competitive resin systems, typical room ten e-rature, 400°F, and 480°P laminate flexural strengths are tabulated below. Percentage figures in parenthesis represent the retention of room temperature properties. 

85 of initial flexural strength (either ro xn or elevated temperature) is maintained after 10,000 hours of aging at 355 F. Using as laminate half-life criterion, 5096 retention of initial flexural strength, the following values are obtained for PABM s  

ACS Symposium Series American Chemical Society Washington, DC, 1974. 

WPC decking and railing systems brands and mannfactnrers are given in Table 1.1. 

The magazine has also noted that the following two deck board brands provide with the greatest range in styles  

The rest of the deck board materials were (in the order of residual rating) 

The most obvious requirement is that the deck should not collapse under a certain reasonable weight (load). What is a reasonable weight though The code specihes it as service load and employs a fail term rather than collapse. The ICC requirement 

However, the ICC code also requires a 2.5X safety factor, on top of the 100 Ib/ft. requirement, that is, a deck should hold a live uniform load of 250 Ib/sq.ft. Pretty stringent, isn t it  

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The properties of SAN resins depend on their acrylonittile content. Both melt viscosity and hardness increase with increasing acrylonittile level. Unnotched impact and flexural strengths depict dramatic maxima at ca 87.5 mol % (78 wt %) acrylonitrile (8). With increasing acrylonitrile content, copolymers show continuous improvements in barrier properties and chemical and uv resistance, but thermal stabiUty deteriorates (9). The glass-transition... 

Properties of Dense Silicon Carbide. Properties of the SiC stmctural ceramics are shown in Table 1. These properties are for representative materials. Variations can exist within a given form depending on the manufacturer. Figure 2 shows the flexure strength of the SiC as a function of temperature. Sintered or sinter/HIP SiC is the preferred material for appHcations at temperatures over 1400°C and the Hquid-phase densified materials show best performance at low temperatures. The reaction-bonded form is utilized primarily for its ease of manufacture and not for superior mechanical properties. 

Those stmctural variables most important to the tensile properties are polymer composition, density, and cell shape. Variation with use temperature has also been characterized (157). Flexural strength and modulus of rigid foams both increase with increasing density in the same manner as the compressive and tensile properties. More specific data on particular foams are available from manufacturers Hterature and in References 22,59,60,131 and 156. Shear strength and modulus of rigid foams depend on the polymer composition and state, density, and cell shape. The shear properties increase with increasing density and with decreasing temperature (157). 

Grade XPC is primarily intended for cold punching and shearing. It is more flexible and shows higher cold flow but is lower in flexural strength than... 

Glass-Based Grades. Grade G-3 is glass fabric with phenohc resin binder which shows high impact and flexural strength. It is used for thermal and mechanical apphcations and has good dimensional stabihty. 

Grade G-11, glass fabric with heat-resistant epoxy resin binder, has properties similar to those of Grade G-10 at room temperature and, in addition, has high retention of flexural strength at elevated temperatures. 

Alumina, or aluminum oxide [1344-28-17, has a thermal conductivity 20 times higher than that of most oxides (5). The flexural strength of commercial high alumina ceramics is two to four times greater than those of most oxide ceramics. The drawbacks of alumina ceramics are their relatively high thermal expansion compared to the chip material (siUcon) and their moderately high dielectric constant. 

Heat resistance is an important characteristic of the bond. The strength of typical abrasive stmctures is tested at RT and at 300°C. Flexural strengths are between 24.1 and 34.4 MPa (3500—5000 psi). An unmodified phenoHc resin bond loses about one-third of its room temperature strength at 298°C. Novolak phenoHc resins are used almost exclusively because these offer heat resistance and because the moisture given off during the cure of resole resins results in undesirable porosity. Some novolaks modified with epoxy or poly(vinyl butyral) resin are used for softer grinding action. 

Waferboard, a more recent wood constmction product, competes more with plywood than particle board. Waferboard and strand board are bonded with soHd, rather than Hquid, phenoHc resins. Both pulverized and spray-dried, rapid-curing resins have been successfully appHed. Wafers are dried, dusted with powdered resin and wax, and formed on a caul plate. A top caul plate is added and the wafers are bonded in a press at ca 180°C for 5—10 min. Physical properties such as flexural strength, modulus, and internal bond are similar to those of a plywood of equivalent thickness. 

Matrix resin Flexural strength, MPa Elongation, % Notched Izod, T/m" UL-94... 

Carbon-Fiber Composites. Cured laminates of phenoHc resins and carbon-fiber reinforcement provide superior flammabiHty resistance and thermal resistance compared to unsaturated polyester and epoxy. Table 15 shows the dependence of flexural strength and modulus on phenoHc—carbon-fiber composites at 30—40% phenoHc resin (91). These composites also exhibit long-term elevated temperature stabiHty up to 230°C. 

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