Electronic packaging technology

Metal-polymer adhesion has been of interest in recent years for the electronic packaging technology. A wide range of studies has been devoted to the understanding of interactions between metals and polymers, mostly on polyimide (1-3). 

In the USA, demand for electronic polymers is expected to grown annually 6.4% through 2005 [5]. Growth will be driven by a shift to new electronic packaging technologies such as direct chip attachment as well as higher-cost specialty resins. Silicones can offer several functions to microelectronics ... 

A brief description of the main electronic packaging technologies is provided to assist the reader in understanding how and where adhesives are being used. The large number of packaging approaches and variations for each approach precludes a thorough discussion here. The literamre, however, is replete with hundreds of technical articles and several books for each approach. ... 

Zang Q, Song B, Wang S, Xu L, Liu S. Cute kinetics analysis and simulation of silicone adhesives. Electronic Packaging Technology and High Density Packaging Inti. Conf. Aug. 2009 692 94. 

Unno Y. High density, low-mass hybrid and associated technologies, Proc. Sixth Workshop on Electronics for LHC Experiments, Krakow, Poland (Sep. 2000) Japan Institute of Electronic Packaging (JIEP) Dictionary of Electronic Packaging Technology, ISBN 4-7693-7089-X 63555. 

The possibility of creating a robust, low-cost microsystem enabled with the aforementioned capabilities and packed into one single device that manages to combine the so-called micro-electro-mechanical systems (MEMS) with advanced electronic packaging technologies played a very important role for the development of such systems [23]. In addition, the large number of scenarios where wearables can contribute to increase the quality of everyday life, eg, health, physical exercise, or elder monitoring, has increased the attention and interest in the field. 

In electronic packaging technology, metal-polymer adhesion has been important for some years. Many studies have been devoted to the in-... 

Shipton, R.D., Robertson, C.J., Gray D.R., High definition components manufactured by mu-Screen technology, EuPac 98 3rd European Conference on Electronic Packaging Technology and 9th International Conference on Interconnection Technology in Electronics, 1998, pp. 192-193. 

Higher operating speeds and frequencies have had a dramatic effect on electronic packaging technology as a whole, but in particular on PBs and PBAs. Higher operating speeds have... 

Nakamura, Tomoko, Miyamoto, Yoshimasa, Hosoi, Yoshihiro, and Newman, Keith, Solder Joint Integrity of Various Surface Finished Build-Up Flip Chip Packages by 4-Point Monotonic Bending Test, Electronics Packaging Technology Conference,2005,pp. 465 70. 

Stoeckl, Stephan, Yeo, Alfred, Lee, Charles, and Pape, Heinz, Impact of Fatigue Modeling on 2d Level Joint Reliability of EGA Packages with SnAgCu Solder Bails, Electronics Packaging Technology Conference,2005, pp. 857-862. 

L. C. Tsao, 10th International Conference on Electronic Packaging. Technology High... 

Soldering Reaction in 3.5wt.% NaCl Solution, 2009 International Conference on Electronic Packaging Technology High Density Packaging (ICEPT-HDP), (2009) 1164-1166. 

Cao, K Cheng, K and Wang, Z. (2006). Optimization of Screen Printing Process. Proceedings of 7 International Conference on Electronics Packaging Technology, pp. 1-4... 

Study of the Rheological Behaviours of Sn-Ag-Cu Solder Pastes and their Correlation with Printing Performance. Proceedings of the 11 Electronics Packaging Technology Conference, Singapore, December 2009, pp. 869-874. 

Vasudivan, S. Zhiping, W. (2010). Fine Line Screen Printed Electrodes for Polymer Microfluidics, Proceedings of 12 Electronic Packaging Technology Conference, Singapore, December 2010, pp. 89-93. 

Premkumar, J., Srikanth, N. (2006), Moisture absorption mechanism in epoxy molding compounds used in 1C encapsulation. Eighth Electronic Packaging Technology Conference 2006,1, 60-2. 

The synthetic route of sulfite-linked cycloaliphatic epoxy resin is presented in Figure 8.13 [38]. The synthesis of intermediate is achieved via the nucleophilic substitution reaction of thionyl chloride with cyclohex-3-enyl-1-methanol. Subsequently, Epo-S is obtained by epoxidation with OXONE oxidant. Epo-S is liquid at room temperature which is favorable for the underfilling encapsulation for high-density electronic packaging technologies such as flip chip plastic ball grid array (FC-PBGA) and MCM. 

D. Shangguan and G. Gao, Environmentally Conscious Manufacturing Technologies for Automotive Electronics, Proceedings of the Second International Symposium on Electronic Packaging Technology (ISEPT 96), Dec 1996, p 391 2... 

ISEPT International Symposium on Electronics Packaging Technology TSOP UBM thin small-outline package under bump metallization... 

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