Electronic packaging Advanced

Das RN, Lauffer JM, Markovich VR. Polymer Nanocomposites for Electronic Packaging. Advancing Microelectronics. May/June 2009. 

Rahman, M.M. and Gui, F., Experimental Measurements of Fluid Flow and Heat Transfer in MicroChannel Cooling Passages in A Chip Substrate, Advances in Electronic Packaging, ASME EEP-4-2, 1993, 685-692. 

Pautsch, G. and Bar-Cohen, A., 1999, Thermal Management of Multichip Modules with Evaporative Spray Cooling, ASME Publication, EEP-Vol 26-1, Advances in Electronic Packaging -1999, Vol 1, Proceedings, InterPack 99, Maui, Hawaii... 

Application Whiteware Structural clay Refractory Glass Abrasive Advanced Wear Membrane Electronic packaging... 

T. Y. Tom Lee, B. Lytle, and B. Hileman, in Advances in Electronic Packaging, ASME, EBP, Vol. 10-1, American Society of Mechanical Engineers, New York, 1995. MicroCOMPACT Users Manual, Innovative Research, Inc., Minneapolis, MN, 1992. 

G. Motulla and K. Heinricht, "A low cost bumping service based on electroless nickel and solder printing," Advances in Electronic Packaging, 19(1), 57 (1997). 

M. M. Yovanovich and V. W. Antonetti, Application of Thermal Contact Resistance Theory to Electronic Packages, in Advances in Thermal Modeling of Electronic Components and Systems, A. Bar-Cohen and A. D. Kraus eds., Vol. 1, Chap 2, pp. 79-128, Hemisphere Publishing, New York, 1988. 

Chen Y, Chew F, Goodwin C. Determination of curing schedule for advanced packaging materials. Int J Microcircuits Electron Packaging 1997 20(4) 540-544 [4th Quarter]. 

Their choice fell on aluminium nitride, a relatively untned material, which showed thermal conductivity 5 times that of alumina, very close to that of beryllia, whilst avoiding the toxicity of that material. What is more, the thermal expansion of AIN is very close to that of silicon, so that AIN seemed an ideal material for advanced electronic packages. 

Polyimides have been widely used in the advanced microelectronics industry such as passivation or stress-relief layers for high-density electronic packaging, interlayer dielectric layers for wafer-level semiconductor fabrication, or alignment layers for liquid crystals in advanced liquid crystal display devices (LCDs) owing to their outstanding thermal, mechanical and good insulation properties with low dielectric constant, good adhesion to common substrates and superior chemical... 

Chen, Y., Chew, F., and Goodwin, C.,DeterminationofCuring Schedule for Advanced Packaging Materials, Inti. J. Microcircuits and Electronic Packaging, 20(4) 540-544 (4 Quarter 1997)... 

Due to their tailorable combinations of properties, MMCs may play a key role in advanced electronic packaging, e.g., in power semiconductor diodes. In this application, the silicon wafer cannot be directly soldered to the copper electrode, due to a DIE mismatch (a (Si) = 4.1 X 10 a (Cu) = 17 x 10 C ). Under service conditions, interface delamination would occur as the result of thermal stresses arising from temperature changes. In conventional power diodes, the problem is partly solved by using an intermediate molybdenum or tungsten layer with a CTE between those of silicon and copper (a (Mo) = 5.0 x 10 ° and a (W) = 4.6 x 10 °C ). Another concept is the use a carbon fiber reinforced copper electrode. Carbon fibers have negative CTEs with a CTE matching that of Si [50]. 

The possibility of creating a robust, low-cost microsystem enabled with the aforementioned capabilities and packed into one single device that manages to combine the so-called micro-electro-mechanical systems (MEMS) with advanced electronic packaging technologies played a very important role for the development of such systems [23]. In addition, the large number of scenarios where wearables can contribute to increase the quality of everyday life, eg, health, physical exercise, or elder monitoring, has increased the attention and interest in the field. 

In recent years liquid crystalline thermosetting polymers have been the object of extensive research and patent activity (1-8). The interest in these materials lies in their challenging theoretical implications and in the noticeable potential applications. Highly crosslinked liquid crystalline thermosets turned out to be promising candidates for thin film applications in electronic packaging and as matrix materials for advanced composites due to their superior mechanical properties and heat resistance (4-6) on the other hand, lightly crosslinked networks can be easily oriented by mechanical stress and this results in a change of their optical properties (9). Applications as... 

Advances in Electronic Packaging, Transactions of the ASME, American Society of Mechanical Engineers. Circuits Assembly, published monthly, 2000 Powers Ferry Center, Suite 450, Marietta, GA 30067. Electronic Packaging Production, pubhshed monthly, 1350 E. Touhy Ave., Des Plaines, IL 60018-3358. Also annual... 

---