Packaging approaches

The packaging approach utilized for tliis battery is similar to that for nickel—hydrogen single cylindrical cells as shown in Figure 23. The sdv er electrode is typically the sintered type used in rechargeable sdv er—zinc cells. The hydrogen electrode is a Teflon-bonded platinum black gas difhision electrode. 

Novel packaging approaches using active materials or new packaging technologies for a desired sensory effect within the food system, or those that enhance product sensory quality and improve shelf-life, do not fit into any of the prior categories. This area of literature is emerging. 

Most silicon accelerometers are based on a micromachined variable capacitance element (g-cell) that is converted to a voltage using a C-V converter and then amplified, filtered, and buffered to provide an analog output as shown in Fig. 7.1.4. To date, open-loop implementations for capacitive read-out circuits are more widely employed than closed-loop systems, primarily as a result of the stability of such systems [16]. Interface electronics for micromachined sensors depend not only upon the transduction technique (input specification) and the product requirements (output specification) but also on the packaging approach, as parasit-ics are introduced when a multiple-die packaging technique is used. 

A brief description of the main electronic packaging technologies is provided to assist the reader in understanding how and where adhesives are being used. The large number of packaging approaches and variations for each approach precludes a thorough discussion here. The literamre, however, is replete with hundreds of technical articles and several books for each approach. ... 

Once the die are attached and electrically connected, a large variety of packages and packaging approaches is available ranging from low-cost transfer-molded plastic... 

Beaudry, R.M., Gran, C. D. (1993). Using a modified-atmosphere packaging approach to answer some post harvest questions Factors affecting the lower oxygen limit. Acta Hort., Vol. 362, pp. 203-212... 

FIGURE 6 Two packaging approaches for hybrid GaAs/Si smart pixels, (a) Both chips flip-chip bonded side-by-side on a transparent substrate with interchip electrical connections provided by metal conductors patterned on the substrate, (b) One chip flip-chip bonded to the other, followed by substrate removal. 

In addition to these, there has been considerable amount of research danonstrat-ing the use of NCD thin film in packaging and thermal applications [47]. Active devices, like transistors, have been mounted on diamond carriers thereby improving their performance due to better thermal management. The high thermal conductivity exhibited by thin film diamond has been a positive impact in packaging approaches in the MEMS devices, as well. Furthermore, NCD has been used for many optical applications to fabricate resonators [48], two-dimensional photonic crystals [49], UV transparent electrodes on SiC [50] and in some sensor applications [51],... 

Based on this conclusion, a new or different packaging approach for microelectronic devices was sought. It was one that used relatively low temperatures and was amenable to repair processes. One probable solution which was studied was applying the moisture barrier to the surface of all the various materials/devices within the package. Surface passivation or interface modification with a reactive species which would not be subsequently desorbed by moisture was the focus for the balance of the research presented here. 

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