Thin small outline package

The assembled stacks are then attached to a leadframe or substrate again with conductive epoxy or wire bonds, and encapsulated with epoxy. Alternately, they may be packaged in thin, small-outline packages (TSOP) or EGA packages. If multiple die are used on each layer, as many as 64 die may be incorporated in one stacked module." ... 

Aramid. A better solution for CTE match is to use a non-woven aramid mat material that is resin-impregnated it is available with either modified epoxy or polyimide resins. Non-woven aramid has lower in-plane expansion under heat input, and is closer to the in-plane expansion of leadless ceramic chip carriers (LCCCs) or thin small outline packages (TSOPs). A low in-plane expansion reduces the strain on the solder joint, which in turn improves assembly yields and long-term field reliability. 

D. Noctor, F.E. Bader, A.P. Viera, P. Boy-san, S. Golwalkar, and R. Foehringer, Solder Joint Attachment Reliability Evaluation and Failure Analysis of Thin Small Outline Packages (TSOPs) with Alloy 42 Leads, IEEE Transactions on Components, Hybrids and Manufacturing Technology, Vol 16, No. 8, Dec 1993, p 961-971... 

The bottom leadless package (BLP) is a peripheral package for replacing the thin small outline package (TSOP) for dynamic random access memory (DRAM) applications. This package uses a custom-designed lead-frame with wire bond interconnection at the chip level. A package with 46 I/O, 0.5 mm (0.02 in.) pitch, was subjected to numerous thermal cycles to determine the cycles-to-failure and the failure mechanisms (Ref 10). 

ISEPT International Symposium on Electronics Packaging Technology TSOP UBM thin small-outline package under bump metallization... 

The PCBA (Printed Circuit Board Assembly) Operations Division of MSM in Singapore deals with the assembly of RAM chips using TSOP (Thin Small Outline Package), DRAMs, PCBs (Printed Circuit Board) and other discrete components. A typical module consists of a number of memory components that are attached to a printed circuit board. The gold or tin pins on e bottom of the module provide a connection between the module and a socket on another larger PCB. There are also some eapaeitors and resistors soldered onto the PCB. 

B. Plastic BGA (PBGA), Thin Small Outline Package (TSOP), and Other Components Mounted with Sn-Ag-Cu Solder... 

Copper leadframe, low-loop wire bonds or flip-chip interconnect, over-molded 50% size reduction compared to thin-shrink small-outline package (TSSOP) inductance (MicroLeadFrame ) and very low inductance flip-chip MicroLeadFrame MicroLeadFrame (wire bond) and flip-chip MicroLeadFrame (/cMLF) (Amkor) Portable electronics (cell phones and personal data assistants) (PDAs), MicroLeadFrame and high-performance applications in the 5-40 GHz range... 

Rigid laminate substrate (with or without soldermask), wire bonds, over-molded Small outline, low profile (1.0 mm), enhanced electrical performance over 2.4 GHz, JEDEC moisture sensitivity level (MSL) 3 Plastic thin fine pitch quad flat no lead package (P-TFQFN), plastic thin shrink small outline no lead package (P-TSSON), and fine-pitch BGA, FBGA (National) Portable applications, flash memory... 

Dunford et al. investigated the metallurgical and reliability aspects of Pb-free mixed technology electronic assemblies utilizing area array packages, leadless ceramic chip passives, and small outline integrated circuits with conventional Sn-Pb terminations on a thin PWB with Au/Ni surface finish utilizing Sn-Ag-Cu-Sb solder as the interconnection alloy. The Sn-Au and Sn-Ag... 

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