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Plastic ball grid array

M. Jimarez, et al, Technical Evaluation of a Near Chip Scale Size Flip Chip/Plastic Ball Grid Array... [Pg.1395]

The synthetic route of sulfite-linked cycloaliphatic epoxy resin is presented in Figure 8.13 [38]. The synthesis of intermediate is achieved via the nucleophilic substitution reaction of thionyl chloride with cyclohex-3-enyl-1-methanol. Subsequently, Epo-S is obtained by epoxidation with OXONE oxidant. Epo-S is liquid at room temperature which is favorable for the underfilling encapsulation for high-density electronic packaging technologies such as flip chip plastic ball grid array (FC-PBGA) and MCM. [Pg.204]

A. Syed, Thermal Fatigue Reliability Enhancement of Plastic Ball Grid Array (PBGA) Packages, IEEE Electronic Components and Technology Conference, 1996,... [Pg.224]

R. Darveaux, K. Banerji, A. Mawer, and G. Dody, Reliability of Plastic Ball Grid Array Assembly, Ball Grid Array Technology, J. Lau, Ed., McGraw-Hill, 1995, p 379-442... [Pg.224]

DC direct current PBGA plastic ball grid array... [Pg.282]

FPBGA tine pitch plastic ball grid array SAC Sn-Ag-Cu (alloy)... [Pg.282]

The solder balls for area array components (e.g., ceramic ball grid arrays—CBGAs plastic ball grid arrays—PBGAs chip scale packages—CSPs) do have, of course, a processing-related cost that will not have as much effect in blurring the cost differential between lead and lead-free solders as occurs with solder pastes. Like solder bars, the cost of solder will likely track more closely with the raw material cost. [Pg.41]

Zhong, C.H. Yi, S. Maui, Y.C. Howe, C.P. Olsen, D. Chen, W.T. Missing solder ball failure mechanisms in plastic ball grid array packages. Proc. 50th Electronic Components and Technology Conf., Las Vegas, NV May 2000 151-159. [Pg.279]

Darveaux, R. Baneqi, K. Mawer, A. Dody, G. Rehability of plastic ball grid array assembly. In Ball Grid Array Technology Lau, J.H., Ed. McGraw Hill New York, 1995 400-410. [Pg.493]

Anderson, L. Primavera, A. Plastic Ball Grid Array Attachment Assembly and Reliability Performance, International Journal of Microelectronics May 1997 Number 43, 11-15. [Pg.567]

Hill, G. The analysis of manufacturing processes for plastic ball grid arrays (PBGA). Proceedings -NEPCON West, 2 Anaheim, California 1996 38-39. [Pg.568]

See other pages where Plastic ball grid array is mentioned: [Pg.235]    [Pg.47]    [Pg.1087]    [Pg.1366]    [Pg.1395]    [Pg.1411]    [Pg.108]    [Pg.206]    [Pg.231]    [Pg.233]    [Pg.280]    [Pg.280]    [Pg.718]    [Pg.720]    [Pg.809]   
See also in sourсe #XX -- [ Pg.231 ]

See also in sourсe #XX -- [ Pg.47 , Pg.50 ]



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