Electronic packaging Density

C-N thin films could be an attractive diamond-like coating material for thermal management in multi-chip modules and micro-scale devices [35]. The field-emission properties of C-N thin films were studied, and indicated an enhancement in the emitted current density [36]. It has been predicted that this material would, as a consequence, have a wide range of potential applications, such as in electronic packaging and wear protective coatings for magnetic storage devices [37]. 

Cole HS, Gorowitz B, Gorczyca T, Wojnarowski R, Lupinski J (1992) Polymeric materials requirements for the GE high-density interconnect process. Mater Res Soc Symp Proc 264 (Electronic Packaging Materials Science VI) 43... 

Flip chip technology is a simple idea of flipping a chip to connect its device I/Os downside directly on the printed circuit boards. The apparent advantages are shorter electron pathways, increased number of I/Os per unit area for increased speed and power, cost reduction, and increased package density [1],... 

Zang Q, Song B, Wang S, Xu L, Liu S. Cute kinetics analysis and simulation of silicone adhesives. Electronic Packaging Technology and High Density Packaging Inti. Conf. Aug. 2009 692 94. 

Unno Y. High density, low-mass hybrid and associated technologies, Proc. Sixth Workshop on Electronics for LHC Experiments, Krakow, Poland (Sep. 2000) Japan Institute of Electronic Packaging (JIEP) Dictionary of Electronic Packaging Technology, ISBN 4-7693-7089-X 63555. 

Adhesion of metals to polymers has been an intensively studied subject over the past decades This is due to the wide application of polymers to electronic packaging and, to a lesser extent, to device inter-connect The increasing demand in density for devices and speed for packaging, in turn, prompts searches for polymers with reduced dielectric constants than that of the widely used polyimide. Some fluorocarbon polymers, notably Teflon, have lower dielectric constants, 2.1, vis-i-vi the values of 3.0-3.5 for polyimides. The fluorocarbon polymers, however, have very weak adhesion to metals. An enhancement in adhesion is thus a primary requirement for the application of such polymers to technologies. A wide range of studies have been made in the past to understand and enhance the adhesion between metals and fluorocarbon polymers In this paper we review some of our earlier work, and present new observations related to the enhanced adhesion between metals and fluorocaiton polymers. We present results address three contributions to enhanced adhesion between metals and fluorocarbon polymers chemical, mechanical, and thermal. 

Polyimides have been widely used in the advanced microelectronics industry such as passivation or stress-relief layers for high-density electronic packaging, interlayer dielectric layers for wafer-level semiconductor fabrication, or alignment layers for liquid crystals in advanced liquid crystal display devices (LCDs) owing to their outstanding thermal, mechanical and good insulation properties with low dielectric constant, good adhesion to common substrates and superior chemical... 

T. Dixon, Multilayer Ceramics The Key to High Density Interconnections pp. 76-82, Electronic Packaging and Production, February 1983. ... 

High-stiffness, low thermal expansion, heat-sink plates for high-density electronic packaging... 

---