Advanced packaging

Rogers, J. A. Baldwin, K. Bao, Z. Dodabalapur, A. Raju, V. R. Ewing, J. Amundson, K. 2001. Rubber stamped plastic circuits for electronic paper. Proceedings—International Symposium on Advanced Packaging Materials Processes, Properties, and Interfaces, pp. 98-103. 

Over the past two decades MLC technology has been progressively developed for advanced packaging, especially by main frame computer manufacturers, and it is increasingly exploited for microwave communications. Especially significant is the emergence of low temperature co-fired ceramic (LTCC) technology. 

Hayes, D. J., et al., Development and Application by Ink Jet Printing of Advanced Packaging Materials, in Proceedings of the International Symposium on Advanced Materials Process, Properties and Interfaces, 1999, pp. 88-92. 

Kuo A-Y, Mu Z. The IC package missing link between nanometer silicon and multi-gigabit PCB systems. Advanced Packaging Feb 2006. p 16-18. 

Swinnen B, Beyne E. 3-D-stacked ICs with copper nails allows system size reduction. Advanced Packaging Feb 2006. p 27-28. 

Landesberger C, Klink G, Schwinn G, Aschenbrenner R. New dicing and thinning concept improves mechanical reliability of ultra thin silicon. Proceedings of the IEEE International S5nnposium on Advanced Packaging Materials 2001. 

Chambers A, Ashraf H, Hopkins J, Pink J. Through-wafer via etching. Advanced Packaging April 2005. p 16-20. 

S. Krongelb, J. O. Dukovic, M. L. Komsa, S. Mehdizadeh, L. T. Romankiw, P. C. Andricacos, A. T. Pfeiffer, and K. Wong, The Application of Electrodeposition Processes to Advanced Package Fabrication, SPIE International Conference on Advances in Interconnection and Packaging, 1389, 249-256 (1990). 

Yazawa, K., Solbrekken, G.L., and Bar-Cohen, A., 2003, Thermoelectric-Powered Convective Cooling of Microprocessors, IEEE Transactions on Advanced Packaging, accepted for publication. 

R.E.G. Van Hal, Advanced Packaging of ISFETs, Ph.D. Thesis, State University Twente, Enschede, The Netherlands, Ch.3,1994. 

S. A. Kuhn, M. B. Kleiner, P. Ramm, W. Weber. Performance modeling of the interconnect structure of a three-dimensional integrated RISC processor/cache system. IEEE Trans. On Components, Packaging, and Manufacturing Technology, Part B Advanced Packaging, Vol. 19, Nov. 1996, pp. 719 - 727. 

Based on the non-linear plant model, a linear dynamic model is derived, either as a set of transfer functions (identification method), or as a state-space description. The last alternative is offered in advanced packages as ASPEN Dynamics . 

Dynamic controllability analysis. Based on the non-linear plant model, a linear dynamic model is derived, either as a set of transfer functions (identification method), or as a state-space description (matrices A, B, C. D). The last alternative is offered in some advanced packages, as Aspen Dynamics , but the applicability to very large problems should be verified. Then a standard controllability analysis versus frequency can be performed. The main steps are ... 

Chen Y, Chew F, Goodwin C. Determination of curing schedule for advanced packaging materials. Int J Microcircuits Electron Packaging 1997 20(4) 540-544 [4th Quarter]. 

Chanchani R. An overview - advanced packaging for solid state light emitting diode (SSLED) lighting, . Advancing Microelectronics. Jan/Feb. 2010. 

Copyright. PennWell and Advanced Packaging, 1999, reproduced with permission. 

Shi DM, McKeen K, Jensen B. Advances in flip-chip cure rates and reliahility. In Proc. Fourth Int. Symp. and Exhibition on Advanced Packaging Materials, Processes. Properties, and Interfaces. Braselton, GA IMAPS Mar. 1998. 

Technical Data Sheets for Adhesives, Ablestik Electronic Materials Dec. 2003. McNeilly K, Pemice RE. Silver Flake Increases Performance of Conductive Adhesive. Advanced Packaging. Jun./Jul. 1999. 

Micronox MX2628/ Kyzen Environmentally friendly, versatile aqueous solution with long tank life Removes latest lead-free technology from advanced packaging in batch or in-line cleaning machines 170 N/A N/A 93 0.05... 

Advanced Packaging In-line Aqueous Cleaning System (APILACSyStoelting ... 

Adamson SJ. CSP and flip-chip underflU. Advanced Packaging. Jun. 2001. 

Savastiouk S, Siniaguine O, Korczynski E. 3-D Stacked Wafer-Level Packaging. Advanced Packaging. Mar. 2000. 

Chanchani R. An overview - Advanced Packaging for Solid State Light Emitting Diode (SSLED) Lighting. Advancing Microelectronics. January/Fehruary 2010 6-12. 

Zhou H, et al. Packaging of Hber colhmators. Advanced Packaging. Jan. 2002. 

Unterhofer, K., Preu, H.,Walter,J., Lorenz, G., Mack,W, Petzold, M. (2013). Thermo-mechanical material characterization of organic polymer films in advanced packages using nanoindentation. Microelectronics Packaging Conference (EMPC), 2013 European, pp. 1-6. 

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