Stress, mechanical

The SPATE technique is often used to perfonn an experimental validation of the physical behaviour of stressed structures or components. This is the reason why the design activity is usually combined with the SPATE technique used on prototypes in order to provide a good set up of mechanically stressed elements. 

Fligh-tech ceramics withstand great mechanical stresses even thin structures and sharp edges are feasible with high reliability. This allows connecting the HT cables reliably to the ceramic part of the tubes directly. Many available resin systems bond easily to ceramics. 

The measurement of mass using a quartz crystal microbalance is based on the piezoelectric effect.When a piezoelectric material, such as a quartz crystal, experiences a mechanical stress, it generates an electrical potential whose magnitude is proportional to the applied stress. Gonversely, when an alternating electrical field is... 

Electrostrictive materials are materials that exhibit a quadratic relationship between mechanical stress and the square of the electric polari2ation (14,15). Electrostriction can occur in any material. Whenever an electric field is appHed, the induced charges attract each other, thus, causing a compressive force. This attraction is independent of the sign of the electric field and can be approximated by... 

This class of smart materials is the mechanical equivalent of electrostrictive and magnetostrictive materials. Elastorestrictive materials exhibit high hysteresis between strain and stress (14,15). This hysteresis can be caused by motion of ferroelastic domain walls. This behavior is more compHcated and complex near a martensitic phase transformation. At this transformation, both crystal stmctural changes iaduced by mechanical stress and by domain wall motion occur. Martensitic shape memory alloys have broad, diffuse phase transformations and coexisting high and low temperature phases. The domain wall movements disappear with fully transformation to the high temperature austentic (paraelastic) phase. 

Flexural modulus increases by a factor of five as crystallinity increases from 50 to 90% with a void content of 0.2% however, recovery decreases with increasing crystallinity. Therefore, the balance between stiffness and recovery depends on the appHcation requirements. Crystallinity is reduced by rapid cooling but increased by slow cooling. The stress—crack resistance of various PTFE insulations is correlated with the crystallinity and change in density due to thermal mechanical stress (118). 

Processing conditions also significantly affect the lengths and numbers of continuous carbon black chains, therefore the semiconducting shields must be appHed with a minimum of residual mechanical stress. 

Transformations in the Solid State. From a practical standpoint, the most important soHd-state transformation of PB involves the irreversible conversion of its metastable form II developed during melt crystallization into the stable form I. This transformation is affected by the polymer molecular weight and tacticity as well as by temperature, pressure, mechanical stress, and the presence of impurities and additives (38,39). At room temperature, half-times of the transformation range between 4 and 45 h with an average half-time of 22—25 h (39). The process can be significantly accelerated by annealing articles made of PB at temperatures below 90°C, by ultrasonic or y-ray irradiation, and by utilizing various additives. Conversion of... 

Polyamides, like other macromolecules, degrade as a result of mechanical stress either in the melt phase, in solution, or in the soHd state (124). Degradation in the fluid state is usually detected via a change in viscosity or molecular weight distribution (125). However, in the soHd state it is possible to observe the free radicals formed as a result of polymer chains breaking under the appHed stress. If the polymer is protected from oxygen, then alkyl radicals can be observed (126). However, if the sample is exposed to air then the radicals react with oxygen in a manner similar to thermo- and photooxidation. These reactions lead to the formation of microcracks, embrittlement, and fracture, which can eventually result in failure of the fiber, film, or plastic article. 

Physical Properties of PBT. Unlike PET, the polymer PBT exists in two polymorphs called the a- and p-forms, which have distinctly different crystal stmctures. The two forms are interconvertible under mechanical stress (158,159). Both crystal forms are triclinic and the crystal parameters are shown in Table 7. 

Film Adhesion. The adhesion of an inorganic thin film to a surface depends on the deformation and fracture modes associated with the failure (4). The strength of the adhesion depends on the mechanical properties of the substrate surface, fracture toughness of the interfacial material, and the appHed stress. Adhesion failure can occur owiag to mechanical stressing, corrosion, or diffusion of interfacial species away from the interface. The failure can be exacerbated by residual stresses in the film, a low fracture toughness of the interfacial material, or the chemical and thermal environment or species in the substrate, such as gases, that can diffuse to the interface. 

This wear is caused primarily from high thermal and mechanical stress, chemical attack, attack by iron and slag, oxidation, and severe thermal shock. Thus the design of the hearth wall and the concepts employed ate just as important as the carbon or graphite materials chosen for the refractory material. Despite their benefits and properties, no carbon or graphite material can overcome the problems of an improper hearth wall design concept. 

Process simulators stop generally at the process specifications for the equipment. For the detailed mechanical design of the equipment, such as heat exchangers and distillation columns, stand-alone programs are often used. They make process calculations, size the equipment, calculate thermal and mechanical stresses, design mechanical support of the parts of the equipment, design inlet and outlet nozzles, etc. 

The three elements necessary for corrosion are an aggressive environment, an anodic and a cathodic reaction, and an electron conducting path between the anode and the cathode. Other factors such as a mechanical stress also play a role. The thermodynamic and kinetic aspects of corrosion deterrnine, respectively, if corrosion can occur, and the rate at which it does occur. 

Corrosion also occurs as a result of the conjoint action of physical processes and chemical or electrochemical reactions (1 3). The specific manifestation of corrosion is deterrnined by the physical processes involved. Environmentally induced cracking (EIC) is the failure of a metal in a corrosive environment and under a mechanical stress. The observed cracking and subsequent failure would not occur from either the mechanical stress or the corrosive environment alone. Specific chemical agents cause particular metals to undergo EIC, and mechanical failure occurs below the normal strength (5aeld stress) of the metal. Examples are the failure of brasses in ammonia environments and stainless steels in chloride or caustic environments. 

Convection heat transfer is dependent largely on the relative velocity between the warm gas and the drying surface. Interest in pulse combustion heat sources anticipates that high frequency reversals of gas flow direction relative to wet material in dispersed-particle dryers can maintain higher gas velocities around the particles for longer periods than possible ia simple cocurrent dryers. This technique is thus expected to enhance heat- and mass-transfer performance. This is apart from the concept that mechanical stresses iaduced ia material by rapid directional reversals of gas flow promote particle deagglomeration, dispersion, and Hquid stream breakup iato fine droplets. Commercial appHcations are needed to confirm the economic value of pulse combustion for drying. 

Polyimides, both photodefinable and nonphotodefinable, are coming iato iacreased use. AppHcatioas iaclude planarizing iatedayer dielectrics oa iategrated circuits and for interconnects, passivation layers, thermal and mechanical stress buffers ia packagiag, alpha particle barriers oa memory devices, and ion implantation (qv) and dry etching masks. 

Alternatively, reactant and product gases can be distributed to and removed from individual cells through internal pipes in a design analogous to that of filter presses, (iare must be exercised to assure an even flow distribution between the entiv and exit cells. The seals in internally manifolded stacks are generally not subject to electrical, thermal, and mechanical stresses, but are more numerous than in externally manifolded stacks. 

A crack may be defined as a continuous separation in a metal component. The conditions under which cracking occurs are many and varied. However, one condition is necessary, although not necessarily sufficient, for all cracking mechanisms—stress. Stress may be residual andtor applied, static andhr cyclic, and of a high or low level. 

Most cracking problems in cooling water systems result from one of two distinct cracking mechanisms stress-corrosion cracking (SCC) or corrosion fatigue. 

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