Diffusion barrier coating

FIGURE 3-11 Structure of the diffusion barrier coating forming on oxidation at the surface of SiBNjC. Source ... 

Gas diffusion barrier coatings, oxygen- and water vapor transmission rates through various polymeric packaging materials, films, as weU as containers, can be significantly reduced by... 

Nelson R. Scale-up of plasma-deposited SiO gas diffusion barrier coatings. Proceedings from the 35th annual technical conference. Society of Vacuum Coaters, Baltimore, MD March 22-27, 1992. 

Narita et al. proposed a Re-based alloy diffusion barrier coating [71]. This diffusion barrier can effectively suppress the inward diffusion of Al to a single crystal superalloy and outward diffusion of Ta, Ti and Ni from the substrate. 

Electrically Functional. Refractory coatings are used in semiconductor devices, capacitors, resistors, magnetic tape, disk memories, superconductors, solar ceUs, and diffusion barriers to impurity contamination from the substrate to the active layer. 

There are three basic types of coatings, thermai barrier coatings, diffusion coatings, and piasma sprayed coatings. The advancements in coating have aiso been essentiai in ensuring that the biade base metai is protected at these... 

Recent applications of e-beam and HF-plasma SNMS have been published in the following areas aerosol particles [3.77], X-ray mirrors [3.78, 3.79], ceramics and hard coatings [3.80-3.84], glasses [3.85], interface reactions [3.86], ion implantations [3.87], molecular beam epitaxy (MBE) layers [3.88], multilayer systems [3.89], ohmic contacts [3.90], organic additives [3.91], perovskite-type and superconducting layers [3.92], steel [3.93, 3.94], surface deposition [3.95], sub-surface diffusion [3.96], sensors [3.97-3.99], soil [3.100], and thermal barrier coatings [3.101]. 

CVD titanium nitride (TiN) is the most important interstitial-nitride coating from an application standpoint. It is used extensively to provide wear resistance and as a diffusion barrier and antireflection coating in semiconductor devices. 1 °]... 

Diffusion barriers and anti-reflection coatings in integrated circuits. 

Titanium Nitride. TiN is chemically stable. TiN forms an excellent diffusion barrier and has a low coefficient of friction. As such, it is well suited for reducing corrosion, erosion, and galling. It is used extensively as a coating for gear components and tube- and wire-drawing dies. 

The adhesive was developed for application to seal food containers with alumina foils and to seal glass plates. In this case, the vinyl polymerization step can be carried out by UV light radiation through the already mounted glass plates with a photoactive radical initiator to cure the viscous adhesive material. Another application of this material is the development of diffusion barrier containing protective coatings on medieval stained glasses (31). 

In planar SOFCs, individual cathode, anode, and electrolyte layers have been deposited by PS [109-111], as well as coatings on interconnect materials and full cells [108, 110, 112]. In addition to the interconnect layers themselves in tubular SOFCs, dense protective layers with good adhesion have also been deposited to protect planar SOFC interconnects from oxidation [110], and diffusion barriers to inhibit inter-diffusion between the interconnects and anodes have been produced by PS [113]. 

In order to establish good electrical contact to the sensitive layer, it was necessary to coat the electrodes with a metal stack of Ti/W (diffusion barrier and adhesion layer) and Pt. The usage of a shadow mask during the metal deposition ensures full compatibility with other MEMS processing steps so that it is possible to fabricate various CMOS-MEMS devices on the same wafer. 

In order to avoid diffusion in the plgment/binder interface, in-terfaclal bonds between lx>th phases should be as water-resistant as possible. If permeability is taken as a measure, properly formulated barrier coatings may coiipare in corrosion protective efficiency with normal coatings, the thickness of vhlch is tvo or three times as high. 

Diffusion barriers are coatings that serve in that role specifically, protection against undesirable diffusion. One of the best examples is that of a 100- tm-thick electrode-posited copper layer that serves as an effective barrier against the diffusion of carbon. Another example is that of nickel and nickel alloys (notably, electrolessly deposited Ni-P) that block diffusion of copper into and through gold overplate. This is achieved by the deposition of a relatively thin Ni-P layer (less than 1 /mm) between the copper and its overlayer. Naturally, the effectiveness of the diffusion barrier increases with its thickness. Other factors in the effectiveness of a diffusion barrier... 

In electronic applications, where it is common to deposit copper and/or copper alloy and tin in sequence, with a nickel diffusion barrier layer, 0.5 fim thick, between the layers present, no failure occurs. Without the nickel layers between bronze/-copper/tin layers themselves, for instance, intermetaUic brittle layer(s) and Kirkendall voids are formed, leading eventually to separation of the coated system and substrate. 

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