Coating cresol

Substituted heat-reactive resins are most widely used in contact-adhesive appHcations and, to a lesser extent, in coatings (77,78) -butylphenol, cresol, and nonylphenol are most frequendy used. The alkyl group increases compatibiHty with oleoresinous varnishes and alkyds. In combination with these resins, phenoHcs reduce water sensitivity. Common appHcations include baked-on and electrical insulation varnishes, and as modifiers for baking alkyds, rosin, and ester gum systems. Substituted heat-reactive resins are not used for air-dry coatings because of theh soft, tacky nature in the uncured state substituted nonheat-reactive phenoHcs are the modifying resin of choice in this case. 

Laminates. Laminate manufacture involves the impregnation of a web with a Hquid phenoHc resin in a dip-coating operation. Solvent type, resin concentration, and viscosity determine the degree of fiber penetration. The treated web is dried in an oven and the resin cures, sometimes to the B-stage (semicured). Final resin content is between 30 and 70%. The dry sheet is cut and stacked, ready for lamination. In the curing step, multilayers of laminate are stacked or laid up in a press and cured at 150—175°C for several hours. The resins are generally low molecular weight resoles, which have been neutralized with the salt removed. Common carrier solvents for the varnish include acetone, alcohol, and toluene. Alkylated phenols such as cresols improve flexibiUty and moisture resistance in the fused products. 

Methylphenol is converted to 6-/ f2 -butyl-2-methylphenol [2219-82-1] by alkylation with isobutylene under aluminum catalysis. A number of phenoHc anti-oxidants used to stabilize mbber and plastics against thermal oxidative degradation are based on this compound. The condensation of 6-/ f2 -butyl-2-methylphenol with formaldehyde yields 4,4 -methylenebis(2-methyl-6-/ f2 butylphenol) [96-65-17, reaction with sulfur dichloride yields 4,4 -thiobis(2-methyl-6-/ f2 butylphenol) [96-66-2] and reaction with methyl acrylate under base catalysis yields the corresponding hydrocinnamate. Transesterification of the hydrocinnamate with triethylene glycol yields triethylene glycol-bis[3-(3-/ f2 -butyl-5-methyl-4-hydroxyphenyl)propionate] [36443-68-2] (39). 2-Methylphenol is also a component of cresyHc acids, blends of phenol, cresols, and xylenols. CresyHc acids are used as solvents in a number of coating appHcations (see Table 3). 

Substituted phenols such as cresols, p-fcrf-butylphenol, / -phcnylphenol, resorcinol, and cardanol (derived from cashew nut shells) have also been used as precursors for phenolic resins. Alkylphenols with at least three carbons in the substituent lead to more hydrophobic phenolic resins that are compatible with many oils, natural resins, and rubbers.7 Such alkylphenolic resins are used as modifying and crosslinking agents for oil varnishes, as coatings and printing inks, and as antioxidants and stabilizers. Bisphenol-A (2,2-p-hydroxyphenylpropane),... 

See also Epoxy coatings Epoxy chalcone, 10 450 12,13-Epoxy-cis-9-octadecenoic (vernolic) acid, physical properties, 5 35t Epoxy coatings, 10 436 450 17 845. See also Epoxy can coatings for corrosion protection, 7 199 markets for, 10 442-449 performance of, 10 423 waterborne, 10 439 Epoxy composites, 10 450, 451 Epoxy compounds, photoinitiated polymerization of, 23 716 Epoxy content analysis, 10 385 Epoxy cresol novolac (ECN) resins, 10 367, 369... 

Negative two-layer resist. A cresol novolac resin (Alnovol PN-430) was spin-coated on a silicon wafer and baked at 80V, for one minute on a hot plate. The silicon wafer was set on a spin-coater and a photosensitive solution consisting of D1 (3 wtlfc), PVP (5 wt%), acetic acid (46 wt%), and water (46 wt%) was... 

A few comments on toluene Toluene (C6H5CH3) is extensively used in gasoline to boost the octane number it is also the raw material in the production of other chemicals such as benzene, benzyl chloride, phenol, cresols, vinyl toluene, and TNT. It also finds use in the production of paints, coatings, adhesives, etc. 

The preparation method is similar to that for the cresol-formaldehyde Novolak resin with a molar ratio of cresol/benzaldehyde = 1.1 in acidic conditions. We have prepared varieties of substituted m-cresol-benzaldehyde Novolak resins, and 1-, and 2-naphthol-4-hydroxybenzaldehyde Novolak resins in the same manner. Almost all of these benzaldehyde Novolak resins give excellent resist films when spin-coated onto silicon or silicon dioxide substrates after being dissolved, together with a photoactive compound, in a solvent like 2-... 

V.I. Chikunov, Ibid 1967(63/20), 169-77 CA 69, 4080y(1968) [Resite-salt coatings (sheaths) for increasing safety of expls in gaseous and dusty coal mines were tested and found to be satisfactory. The sheaths were made of a mixt of 32% phenol-cresol-aniline-HCHO resite, 27% kaolin, 35% KCl,... 

Regarding item 6) above on electrocatalysis, the coexistence of tyrosine residue model, p-cresol (p-Crej, enhanced remarkably the catalytic activity of Ru-red confined in a Nafion membrane coated on an electrode (Fig. 19.3).20) This was attributed to the nearly twofold lengthening of the charge hopping distance by p-cresol from 1.28 nm to 2.25nm). 

The substituted phenols and cresols constitute about half the total volume of this group. Para-t-butylphenol is produced by the alkylation of phenol with isobutylene. The principal applications for this derivative are in the manufacture of modified phenolic resins for the rubber industry and in surface coatings. BHT is obtained from isobutylene and p-cresol. Technical-grade BHT is an antioxidant for plastics and elastomers, and is a gum inhibitor in gasoline. Food-grade BHT is an antioxidant in edible oils, preserves, and many other foods. 2,6-Di-t-butylphenol is used to produce a wide range of plastics additives, antioxidants, and gasoline additives. 

Besides the most important area of surface coatings, the use of photopolymers as photoresists in the manufacture of printed circuits is well established. Photoimaging with aryldiazonium salt photoinitiators and multifunctional cresol-novolac epoxides was first described by Schlesinger Crivello has mentioned several new photoresists based on the photopolymerization of epoxides with onium initiators Meier and Zweifel have shown that iron arene salts in combination with multifunctional cresol-novolac epoxides yield photoresists with high resolution and contrast. Dual functional epoxides (cf. Sect. 5) containing chalcone groups as light-sensitive units have been described as suitable photoresists especially... 

An alternative method is to dissolve away the fabric substrate and leave the coating behind. Nylon can be dissolved in cold meta-cresol in about 1 min, or 90%v/v formic acid. Polyester (polyethylene terephthalate) will dissolve in hot meta-cresol, but PVC may also be affected. Alternatives are ort/zo-cresol and chloroform or ort/zo-chlorophenol. 

Polyaniline is less tolerant of preparation conditions than polypyrrole, and the list of anion dopants used in the preparation is more limited. However, subsequent replacement of the anion used in preparation by a dodecylben-zene sulfonate makes polyaniline become soluble in solvents such as Af-methyl pyrrolidone (NMP), or zn-cresol, and it can be spin-coated or otherwise solution-processed. In a similar way derivatives of aniline, such as... 

In the breakdown by chemical composition, phenol-formaldehyde protective coating resins are broken out from 1941 through 1946. Cresol-formaldehyde (cresylic acid-formaldehyde) protective coating resins are broken out for 1941 through 1943. p-tert-Amy -phenol-formaldehyde is shown separately for 1945 and 1946. Phenol and cresol-aldehyde resins are shown in 1941 and 1952. Mixed phenolic resins are shown for protective coatings in 1945 and 1946 (71). 

Ea, above and below Tg. Three case studies illustrate the range of applicability of the bending beam setup and factors contributing to the stress state. The first is a comparison of two polymers for interlayer dielectrics PMDA-ODA (pyromellitic acid dianhydride - oxydiamine) and a bis-benzocyclobutene. The second is of a neat epoxy resin commonly used for microelectronics encapsulation (epoxidized ortho-cresol novolac cured with a phenolic novolac). The third is a screen-printable polyimide coating used for protection of the integrated-circuit chip. An outline of our stress model is sketched, and example results are presented. 

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