Weak interface-bond layer

Several serious cracks are visible in Figure 3, which is an extended view of the interconnect and bond layer interface. These and similar types of fractures will need to be analysed in future studies by examining cross-sections of several stack layers that are carefully preserved during stack disassembly. In any case, these fractures identify a weakness that may be a significant cause of stack degradation. 

Once it is cured, concrete has several surface characteristics that are problems for bonding or sealing. The concrete surface is extremely alkaline and will destroy any hydrolysis-sensitive materials that are present at the interface. It often has a weak, porous surface layer that must be penetrated or removed before being bonded. Thus, sealers and primers are commonly used to moisture-proof and strengthen the concrete surface prior to bonding. 

Pattern of half-life was similar to that of initial phase, but there must be another factor that could affect life-time. There are some assumed mechanisms for luminance decrease or device degradation [31],[32]. For example, degra- dation of the interface between deposited layers, shift of exdton recombination zone from emitting layer, intrinsically weak chemical bond of used materials and there must be a lot of possible degradation mechanism we could not conceive. 

Let us consider some of the most common problems in an adhesively bonded joint. Bonding problems in a three-layer step-lap joint, for example, are illustrated in Fig. 1. Ultrasonic techniques to find voids, weak cohesive properties, and delaminations are available and are quite reliable. The weak interface or kissing bond detection situation, on the other hand, has a limited number of solutions useful only in special situations. No generalized technique is yet available to depict a weak interface or kissing bond reliably, although a number of promising techniques have emeiged. 

Loss of adhesion occurs at the silicone substrate interface and two main mechanisms can be outlined the formation of a weak boundary layer (WBL) and the breaking of adhesive bonds. 

Weak boundary layer. WBL theory proposes that a cohesively weak region is present at the adhesive-substrate interface, which leads to poor adhesion. This layer can prevent the formation of adhesive bonds, or the adhesive can preferentially form bonds with the boundary layer rather that the surface it was intended for. Typically, the locus of failure is interfacial or in close proximity to the silicone-substrate interface. One of the most common causes of a WBL being formed is the presence of contaminants on the surface of the substrate. The formation of a WBL can also result from migration of additives from the bulk of the substrate, to the silicone-substrate interface. Alternatively, molecular... 

Owing to their strong bond on Ru(OOOl), mixed COa 0.55 V, the shift of the equilibrium between water and adsorbed OHad/Oad towards the latter increases the density of the respective species in the intermixed adlayer, which increases the repulsions between the adsorbed species and hence leads to more weakly bound OHad/Oad and COad species. These latter species are less stable against COOHad or CO2 formation, because of the reduced reaction barrier ( Brpnsted-Polanyi-Evans relation [Bronstedt, 1928]), and can support a reaction via (14.9) or (14.12), respectively, at low rates. (Note that the total density of the adlayer does not need to remain constant, although also this is possible.)... 

In contrast, the pentavalent Sb-119 ions at the interfaces are weakly bonded to the oxide ion layer of the hematite surfaces in neutral and slightly acidic region, while in the acidic region most of the adsorbed Sb-119 ions are in the zeroth or first metal ion layers of the substrate forming Sb-O-Fe bonds. The pentavalent Sb-119 ions having once been incorporated into the surface metal ion sites retain their chemical form, even when the pH of the aqueous phase is raised above 7. Heating of suspensions at 98°C results in chemical rearrangement of the hematite surfaces to yield pentavalent Sb-119 ions in the second or deeper metal ion layers. 

Moisture acts as a debonding agent through one of or a combination of the following mechanisms 1) attack of the metallic surface to form a weak, hydrated oxide interface, 2) moisture assisted chemical bond breakdown, or 3) attack of the adhesive. (2 ) A primary drawback to good durability of metal/adhesive bonds in wet environments is the ever present substrate surface oxide. Under normal circumstances, the oxide layer can be altered, but not entirely removed. Since both metal oxides and water are relatively polar, water will preferentially adsorb onto the oxide surface, and so create a weak boundary layer at the adhesive/metal interface. For the purposes of this work, the detrimental effects of moisture upon the adhesive itself will be neglected. The nitrile rubber modified adhesive used here contains few hydrolyzable ester linkages and therefore will be considered to remain essentially stable. 

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