Kissing bonds

Joint Line Remnant. A joint line remnant defect (also known as a kissing bond, lazy S, or entrapped oxide defect) is due to a semicontinu-ous layer of oxide through the weld nugget (Fig. 

Let us consider some of the most common problems in an adhesively bonded joint. Bonding problems in a three-layer step-lap joint, for example, are illustrated in Fig. 1. Ultrasonic techniques to find voids, weak cohesive properties, and delaminations are available and are quite reliable. The weak interface or kissing bond detection situation, on the other hand, has a limited number of solutions useful only in special situations. No generalized technique is yet available to depict a weak interface or kissing bond reliably, although a number of promising techniques have emeiged. 

Nagy, P.B., Ultrasonic detection of kissing bonds at adhesive interfaces. J. Adhes., 5,619-630(1991). 

The major problem with nondestructively assessing the strength of adhesively bonded joints remains the so-called kissing bond, in which there is continuity, but little or no strength. Many... 

Jeenjitkaew P, Luklinska Z, Guild FJ (2010) Morphology and surface chemistry of kissing bonds in adhesive joints produced by surface contamination. Int... 

Kim DM, SutliffE (1978) The contact potential difference (CPD) measurement method for prebond nondestructive surface inspection. SAMPE Quart 9 59-63 Lange YV, Teumin II (1971) Dynamic flexibility of dry point contact. Sov J NDT 7 157—165 Lloyd EA, Brown AF (1978) In Allen KW (ed) Adhesion, 2 edn. Applied Science Publishers, L.ondon, 133 pp Marty NP, Desai N, Andersson J (2004) NDT of kissing bond in aeronautical structures. In Proceedings of the 16th world conference for NDT. Montreal, Canada... 

Joffe M, Bisanti L, Apostoli P, Shah N, Kiss P, Dale A, Roeleveld N, Lindbohm ML, Sallmen M, Bonde JP (1999) Time to pregnancy and occupational lead exposure. Asdepios. Scand J Work Environ Health, 26(1) 64-65. 

Horvath, I.T., Kiss, G., Cook, R.A., Bond, J.E., Stevens, P.A., Rabai, J. and Mozeleski, E.J. (1998) Molecular engineering in homogeneous catalysis one-phase catalysis coupled with biphase catalyst separation. The fluorous-soluble HRh(CO) P[CH2CH2(CF2)5CF3]3 3 hydroformylation system. J. Am. Chem. Soc., 120, 3133. 

Micskei, K., Kiss-Szikszai, A., Gyarmati, J., Hajdu, C. Carbon-carbon bond formation in neutral aqueous medium by modification of the Nozaki-Hiyama reaction. Tetrahedron Lett. 2001,42, 7711-7713. 

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