Big Chemical Encyclopedia

Chemical substances, components, reactions, process design ...

Articles Figures Tables About

Thermal limits temperatures

Positive-displacement meters are normally rated for a limited temperature range. Meters can be constmcted for high or low temperature use by adjusting the design clearance to allow for differences in the coefficient of thermal expansion of the parts. Owing to small operating clearances, filters are commonly installed before these meters to minimize seal wear and resulting loss of accuracy. [Pg.58]

Low Expansion Alloys. Binary Fe—Ni alloys as well as several alloys of the type Fe—Ni—X, where X = Cr or Co, are utilized for their low thermal expansion coefficients over a limited temperature range. Other elements also may be added to provide altered mechanical or physical properties. Common trade names include Invar (64%Fe—36%Ni), F.linvar (52%Fe—36%Ni—12%Cr) and super Invar (63%Fe—32%Ni—5%Co). These alloys, which have many commercial appHcations, are typically used at low (25—500°C) temperatures. Exceptions are automotive pistons and components of gas turbines. These alloys are useful to about 650°C while retaining low coefficients of thermal expansion. Alloys 903, 907, and 909, based on 42%Fe—38%Ni—13%Co and having varying amounts of niobium, titanium, and aluminum, are examples of such alloys (2). [Pg.122]

The drawbacks of cellular materials include limited temperature of appHcations, poor flammabiUty characteristics without the addition of fire retardants, possible health ha2ards, uncertain dimensional stabiUty, thermal aging and degradation, friabiUty, and embrittlement due to the effects of uv light (3,6,15). [Pg.332]

On the outlet of the holder tube, the FDV directs the pasteurized product to the regenerator and then to the final cooling section (forward flow). Alternatively, if the product is below the temperature of pasteurization, it is diverted back to the balance tank (diverted flow). The FDV is controlled by the safety thermal-limit recorder. [Pg.356]

Control System. For quaUty control, a complete record of the control and operation of the HTST is kept with a safety thermal-limit recorder—controller (Fig. 9). The temperature of product leaving the holder tube, ahead of the FDV, is recorded and the forward or diverted flow of the FDV is determined. Various visual iadicators, operator temperature caUbration records, and thermometers also are provided. [Pg.358]

Determination of the thermal decomposition temperature by thermal gravimetric analysis (tga) defines the upper limits of processing. The tga for cellulose triacetate is shown in Figure 11. Comparing the melt temperature (289°C) from the dsc in Figure 10 to the onset of decomposition in Figure 11 defines the processing temperature window at which the material can successfully be melt extmded or blended. [Pg.258]

Because of low thermal conductivity, temperature gradients through the pipe wall may he siihstantial. Tabulated limits apply where more than half the wall thickness is at or above the stated temperature. [Pg.948]

To ascertain whether the stator or the rotor would fail first during a stalled condition, the thermal withstand time of the rotor should also be determined separately for the rotor bars and the end rings. The lowest values for the stator or the rotor will be the safe stall time for the entire motor. The limiting temperatures in rotor components may be considered as follows ... [Pg.46]

This is the time taken by the stator or the rotor, whichever is less, to reach the limiting temperature rise, as specified in Table 7.5, when the starting current /s, is pas.sed through the stator windings after the motor has reached thermal equilibrium, underrated conditions. For increa.sed safety motors, this time should not be less than 5 seconds (preferably 10 seconds or more). [Pg.181]

The continuous current rating of a bus system can be defined by the current at which a steady-state thermal condition can be reached. It is a balance between the enclosure and the conductor s heat gain and heat loss. If this temperature is more than the permissible steady-state thermal limit it must be reduced to the desired level by increasing the size of the conductor or the enclosure or both, or by adopting forced cooling. Otherwise the rating of the bus system will have to be reduced accordingly. [Pg.942]

The limiting temperature for graphite use in fusion systems is defined by tliermal sublimation (--1500-2000°C). However, a process which is very similar to thermal sublimation (in cause and in effect) appears to define the current temperature limit. This phenomenon, which is known as radiation enhanced sublimation (RES), is not clearly understood but dominates above a temperature of about 1000°C and increases exponentially with increasing temperatme. [Pg.418]

Plastic s main disadvantages are its lower scratch resistance and, in some systems, comparative intolerance to severe temperature fluctuations. Even if plastic does have less temperature tolerance than glass, most optical systems do not operate in ambient temperatures beyond the thermal limits of plastics or the human body. [Pg.230]

Thus by analyzing the thermal limits of the various materials available, starting with the maximum and minimum environmental temperatures under which a product must operate and adding any thermal increase... [Pg.324]

By the development of hot spots by friction. This is shown particularly by the effect of added materials of a gritty nature. For initiation to occur, the melting point of the grit must be above a limiting temperature dependent on the explosive. Initiation is favoured by a low thermal conductivity and also by a high hardness value. [Pg.27]

As a model system PS-fc-PI exhibits a number of disadvantages The high Tg of polystyrene in conjunction with the thermal instability of PI results in a limited temperature range open for experiments. The chain dynamics of PS is often slow and sluggish, leading to uncertainties in the interpretation of kinetic data. [Pg.150]

A modified superheat theory was proposed by Shick to explain molten salt (smelt)-water thermal explosions in the paper industry (see Section IV). (Smelt temperatures are also above the critical point of water.) In Shick s concept, at the interface, salt difiuses into water and water into the salt to form a continuous concentration gradient between the salt and water phases. In addition, it was hypothesized that the salt solution on the water side had a significantly higher superheat-limit temperature and pressure than pure water. Thicker, hotter saltwater films could then be formed before the layer underwent homogeneous nucleation to form vapor. [Pg.161]

Thermal decomposition temperature determined by TGA. Anodic stability limit determined by cyclic voltammetry. Stainless steel working electrode. Number of fluorine substituents on the aromatic ring. [Pg.145]

A final stability feature is the thermal limit for the polymers. For gas chromatography, these limits range from 150 °C for the acrylates to more than 400 °C for Tenax. These limits are unrealistic for thermal desorption. For example, XAD-2 has an intolerably high blank at the temperature limit of 250 °C quoted for gas chromatography. High blanks at the temperature limits are generally true for all the other polymers. Tenax is the only one having extensive documentation of usefulness in thermal desorption (21, 26, 53, 82, 162, 178, 240, 317, 338, 343-345, 348, 350-353, 356-364, 366, 369, 370, 372, 373). [Pg.219]

The peroxide and azo thermal initiators also are photochemically unstable and have been used as radical sources at well below their normal thermal decomposition temperatures. However, their industrial use as photoinitiators has been limited because their light-absorption characteristics frequently are unsuitable and because of the obvious potential complication owing to their slow thermal decomposition, which leads to poor shelf-life and nonreproducible photoactivity in given formulations (88). Further information on photoinitiators can be found in the literature (92). [Pg.232]


See other pages where Thermal limits temperatures is mentioned: [Pg.672]    [Pg.391]    [Pg.426]    [Pg.474]    [Pg.500]    [Pg.44]    [Pg.688]    [Pg.253]    [Pg.184]    [Pg.26]    [Pg.460]    [Pg.118]    [Pg.78]    [Pg.131]    [Pg.102]    [Pg.270]    [Pg.280]    [Pg.395]    [Pg.396]    [Pg.407]    [Pg.49]    [Pg.283]    [Pg.44]    [Pg.23]    [Pg.474]    [Pg.132]    [Pg.128]    [Pg.115]    [Pg.776]    [Pg.500]   
See also in sourсe #XX -- [ Pg.431 , Pg.432 , Pg.433 ]




SEARCH



Insulation materials, thermal limiting temperatures

Limiting temperatures

Temperature limitations

Temperature limiter

Thermal limited

Thermal limits

Thermal temperature

Thermalization temperature

© 2024 chempedia.info