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Solid polyamide resins properties

Chemistry of Dimer-Based Polyamide Resins Solid Polyamide Resins Properties... [Pg.963]

Properties. The solid polyamide resins are alcohol soluble and if properly formulated can supply some degree of hydrocarbon compatibility. Thus, they can be applied from solvent solution. However, they also can be applied as hot melts or from water dispersions. Water-based forms known as suspensoids have been described (12). Solid polyamides also may be finely divided for use as powders. The films are characterized by resistance to moisture, moisture vapor transmission, grease, and oils. They are resistant to many solvents and chemicals including aliphatic hydrocarbons and mineral and vegetable oils. They do not resist lacquer-type solvents and alcohols. They have a high degree of flexibility and maintain their flexibility upon aging. Also, they are heat sealable at relatively low temperatures and adhere to an unusually wide variety of substrates. [Pg.967]

Because of this steep viscosity drop, solid polyamide resins are useful as hot melt adhesives. The resins may tend to "skin" or oxidize when exposed to air and high temperatures for long periods. However, this negative property can be circumvented by the use of antioxidants and by proper application equipment design. [Pg.967]

In 1971, Sheppard proposed that peptide synthesis would proceed more efficiently if the polymeric support was designed to have solvation properties similar to those of the peptide product.This line of reasoning led to the development of polyamide resins.The most successful of this type of support is based on cross-linked poly(dimethylacrylamide) (Pep-syn). Polyamide resins swell up to 10 times their dry volume in dimethylformamide and even more in water. On the other hand, they swell much less in dichloromethane. The few comparative studies that have been carried out between polystyrene and polyamide resins indicate that both give very similar results in routine solid-phase peptide synthesis. [Pg.669]

The reactive dimer polyamides and fatty amido amines are liquid resins with many of the properties described above for solid polyamides. In addition, they are amine-like in that they are basic and form salts. They are more soluble than solid resins, although alcohols are still primary solvents. [Pg.972]

Chem. Descrip. o,p-Toluenesulfonamide-formaldehyde resin CAS 1338-51-8 EINECS/ELINCS 215-667-5 Uses Modifier and adhesion promoter for syn. and natural resins used in adhesives and coatings applies. extender in polyamide resins food pkg. adhesives, paper, cellophane Reguiatory FDA 21CFR 175.105,176.170,177.1200 Properties Pract. colorless hard solid particles, faint formaldehyde odor sol. in usual lacquer soivs. Insol. In water, aliphatic hydrocarbons, veg. oils sp.gr. 1.35 soften, pt. 62 C ref. index 1.4275-1.4325 (25 g/75 g butyl acetate)... [Pg.892]

Trade Name Synonyms Aztec CHP-50-P1 T[Aztec Peroxides] Aztec CHP-90-W1 T[Aztec Peroxides] Aztec CHP-HA-1 T[Aztec Peroxides] Cyclonox BT-50 T[Akzo Nobel http //www.akzonobel.com]] Luperox K4CE [At ofi n a http //www. atofinachemicals. com] Perhexa H j[NOF http //www.nof.co.jp] Cyclohexanone resin Synonyms Ketone resin Properties Colorless to pale yel. solid sol. in oxygenated solvs. insol. in aliphatic solvs. and water acid no. 0 hyd. no. 0 Uses Adhesion promoter in printing inks modifier for clear metal cellulose lacquers tackifier for polyamide hot-melt adhesives in food-pkg. adhesives floor paints Regulatory FDA 21CFR 175.105... [Pg.1122]

The bisphenol A-derived epoxy resins are most frequently cured with anhydrides, aliphatic amines, or polyamides, depending on desired end properties. Some of the outstanding properties are superior electrical properties, chemical resistance, heat resistance, and adhesion. Conventional epoxy resins range from low viscosity liquids to solid resins. [Pg.363]

Our approach has been to synthesize the dleplsulflde resin corresponding to the normal blsphenol A type dlepoxlde resins. A polyamide type curing agent (Versamlde 140) was used because of our particular Interest In orthopedic adhesives, l.e. "bone cement". Some of the properties were therefore tailored to be optimum near body temperature. We have found very little prior literature on dleplsulflde resins. As prepared, the dleplsulflde resin analog of DGEBA Is a crystalline solid which must be heated above Its melting temperature for reaction. Charlesworth (2) has reported mechanical relaxation behavior of epoxy-episulfide poly-... [Pg.153]

Features Curing agent for maintenance and marine coatings, overprint varnishes, masonry and pool coatings, adhesives, caulks, grouts flexibilizer for thermoplastic polyamides Properties Gardner 9 max. sol n. dens. 7.6 Ib/gal vise. (G-H) W-Y amine no. 51-57 pot life 18 h (250 g) 59-61% solids in IPA/toluene Use Level 100 phr with epoxy resin of EEW=525 Epikure 3100-HX-60 [Resolution Perl. Prods.]... [Pg.323]

Uses Mfg. of block copolymers incl. polyamides, PU, PC mfg. of silicone-modified epoxy resins in corrosion-resist, coatings and polishes Features Improved adhesion to painted and unpainted metal surfs. Properties Liq. sp.gr. 0.98 vise. 50 cSt 98% solids PS513 [United Chem. Tech.]... [Pg.671]

Uses Polyamide for inks, coalings, adhesives Features Inks fonnulated with this prod, show exc. adhesion to various substrates, good resist, props., gloss Regulatory FDA 21 CFR 175.105,175.300,176.170 Properties Amber solid sol. in a cosolv. system (alcohol and hydrocarbon) sp. gr. 0.970 vise. 21 -27 poise p 60 C) soften, pt. (B R) 100-115 C acid no. 5 max. (mg KOH/g of resin)... [Pg.907]

Classification Thermoplastic polyamide Formula [NH(CH2)6NHCO(CH2)7CO]n Properties Solid dens. 1.080 m.p. 205 C Uses Thermoplastic resin for inj. molding and extrusion applies., film, extruded stock for machining brush bristles industrial monofilament cable/wire jacketing elec./automotive parts Manuf./Distrib. Aldrich http //www.sigma-aldrich.com... [Pg.2908]

CAS 24936-74-1 26098-55-5 Synonyms Nylon 6/12 PA 612 Polyamide 612 Poly (hexamethylenedodecanediamide) Classification Thermoplastic polyamide Formula [NH(CH2)6NHCO(CH2)ioCO]n Properties Solid dens. 1.07 kg/l m.p. 210 C tens, str. ( yield) 60 MPa Uses Thermoplastic resin for molding, extrusion, films, brush bristles, industrial monofilament, cable/wire jacketing, elec./automotive parts food pkg. [Pg.2908]

Polyamides and Polyamidoamines obtained by the condensation of dimerized fatty acids with aliphatic diamines are used in solid form as hot-melt adhesives with particularly pronounced adhesion properties. The low molecular mass condensates, some of which are still liquid and contain free amino groups (amine equivalent ca. 3000 -12 000), are used widely as hardeners for epoxy resins. [Pg.13]

Polymer waste has been increasing at city landfills tremendously [1]. Thus the best solution in overcoming the buildup of plastic solid waste is recycling. The demand for recycling has increased further, especially for expensive engineering resins such as polyamide (PA-6), because it possesses a lot of excellent properties. Previous studies have shown that unmodified PA-6s are excellently suitable for utilization in mechanical recycling processes [2]. [Pg.48]


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See also in sourсe #XX -- [ Pg.967 , Pg.968 , Pg.969 , Pg.970 ]




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