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Resole Catalysts

Phenolic Resins. Phenohc resins (qv) are formed by the reaction of phenol [108-95-2] C H O, and formaldehyde [50-00-0] CH2O. If basic conditions and an excess of formaldehyde are used, the result is a resole phenohc resin, which will cure by itself Hberating water. If an acid catalyst and an excess of phenol are used, the result is a novolac phenohc resin, which is not self-curing. Novolac phenohc resins are typically formulated to contain a curing agent which is most often a material known as hexamethylenetetraamine [100-97-0] C H22N4. Phenohc resin adhesives are found in film or solution... [Pg.233]

Most phenohc foams are produced from resoles and acid catalyst suitable water-soluble acid catalysts are mineral acids (such as hydrochloric acid or sulfuric acid) and aromatic sulfonic acids (63). Phenohc foams can be produced from novolacs but with more difficulty than from resoles (59). Novolacs are thermoplastic and require a source of methylene group to permit cure. This is usually suppHed by hexamethylenetetramine (64). [Pg.406]

Alkaline Catalysts, Resoles. Resole-type phenoHc resins are produced with a molar ratio of formaldehyde to phenol of 1.2 1 to 3.0 1. For substituted phenols, the ratio is usually 1.2 1 to 1.8 1. Common alkaline catalysts are NaOH, Ca(OH)2, and Ba(OH)2. Whereas novolak resins and strong acid catalysis result in a limited number of stmctures and properties, resoles cover a much wider spectmm. Resoles may be soHds or Hquids, water-soluble or -insoluble, alkaline or neutral, slowly curing or highly reactive. In the first step, the phenolate anion is formed by delocali2ation of the negative charge to the ortho and para positions. [Pg.295]

Special resoles are obtained with amine catalysts, which affect chemical and physical properties because amine is incorporated into the resin. For example, the reaction of phenol, formaldehyde, and dimethylamine is essentially quantitative (28). [Pg.296]

Resoles. Like the novolak processes, a typical resole process consists of reaction, dehydration, and finishing. Phenol and formaldehyde solution are added all at once to the reactor at a molar ratio of formaldehyde to phenol of 1.2—3.0 1. Catalyst is added and the pH is checked and adjusted if necessary. The catalyst concentration can range from 1—5% for NaOH, 3—6% for Ba(OH)2, and 6—12% for hexa. A reaction temperature of 80—95°C is used with vacuum-reflux control. The high concentration of water and lower enthalpy compared to novolaks allows better exotherm control. In the reaction phase, the temperature is held at 80—90°C and vacuum-refluxing lasts from 1—3 h as determined in the development phase. SoHd resins and certain hquid resins are dehydrated as quickly as possible to prevent overreacting or gelation. The end point is found by manual determination of a specific hot-plate gel time, which decreases as the polymerization advances. Automation includes on-line viscosity measurement, gc, and gpc. [Pg.298]

The in situ process is simpler because it requires less material handling (35) however, this process has been used only for resole resins. When phenol is used, the reaction system is initially one-phase alkylated phenols and bisphenol A present special problems. As the reaction with formaldehyde progresses at 80—100°C, the resin becomes water-insoluble and phase separation takes place. Catalysts such as hexa produce an early phase separation, whereas NaOH-based resins retain water solubiUty to a higher molecular weight. If the reaction medium contains a protective coUoid at phase separation, a resin-in-water dispersion forms. Alternatively, the protective coUoid can be added later in the reaction sequence, in which case the reaction mass may temporarily be a water-in-resin dispersion. The protective coUoid serves to assist particle formation and stabUizes the final particles against coalescence. Some examples of protective coUoids are poly(vinyl alcohol), gum arabic, and hydroxyethjlceUulose. [Pg.298]

An important aspect of this procedure is the use of latent acid catalysts, such as phenyl hydrogen maleate, phenyl trifluoracetate, and butadiene sulfone. These catalysts reduce the peak exotherm from over 200°C to 130—160°C. The resin catalyst mixture has a working life of up to several days at RT. The elevated temperature of mol ding these latent catalysts generates the corresponding acids, namely, maleic, trifluoracetic, and phenolsulfonic, which cataly2e the resole reaction. Typically, a cycle time of 1—2 min is requited for a mold temperature of - 150° C. [Pg.308]

The importance of the nature of the catalyst on the hardening reaction must also be stressed. Strong acids will sufficiently catalyse a resol to cure thin films at room temperature, but as the pH rises there will be a reduction in activity which passes through a minimum at about pH 7. Under alkaline conditions the rate of reaction is related to the type of catalyst and to its concentration. The effect of pH value on the gelling time of a casting resin (phenol-formaldehyde ratio 1 2.25) is shown in Figure 23.15. [Pg.643]

Two classes of resol are generally distinguished, water-soluble resins prepared using caustic soda as catalyst, and spirit-soluble resins which are catalysed by addition of ammonia. The water-soluble resins are usually only partially dehydrated during manufacture to give an aqueous resin solution with a solids content of about 70%. The solution viscosity can critically affect the success in a given application. Water-soluble resols are used mainly for mechanical grade paper and cloth laminates and in decorative laminates. [Pg.645]

Resoles are usually those phenolics made under alkaline conditions with an excess of aldehyde. The name denotes a phenol alcohol, which is the dominant species in most resoles. The most common catalyst is sodium hydroxide, though lithium, potassium, magnesium, calcium, strontium, and barium hydroxides or oxides are also frequently used. Amine catalysis is also common. Occasionally, a Lewis acid salt, such as zinc acetate or tin chloride will be used to achieve some special property. Due to inclusion of excess aldehyde, resoles are capable of curing without addition of methylene donors. Although cure accelerators are available, it is common to cure resoles by application of heat alone. [Pg.874]

Many applications of novolacs are found in the electronics industry. Examples include microchip module packaging, circuit board adhesives, and photoresists for microchip etching. These applications are very sensitive to trace metal contamination. Therefore the applicable novolacs have stringent metal-content specifications, often in the low ppb range. Low level restrictions may also be applied to free phenol, acid, moisture, and other monomers. There is often a strong interaction between the monomers and catalysts chosen and attainment of low metals levels. These requirements, in combination with the high temperature requirements mentioned above, often dictate special materials be used for reactor vessel construction. Whereas many resoles can be processed in mild steel reactors, novolacs require special alloys (e.g. Inconel ), titanium, or glass for contact surfaces. These materials are very expensive and most have associated maintenance problems as well. [Pg.920]

Resole syntheses entail substitution of formaldehyde (or formaldehyde derivatives) on phenolic ortho and para positions followed by methylol condensation reactions which form dimers and oligomers. Under basic conditions, pheno-late rings are the reactive species for electrophilic aromatic substitution reactions. A simplified mechanism is generally used to depict the formaldehyde substitution on the phenol rings (Fig. 7.21). It should be noted that this mechanism does not account for pH effects, the type of catalyst, or the formation of hemiformals. Mixtures of mono-, di-, and trihydroxymethyl-substituted phenols are produced. [Pg.398]

The reaction conditions, formaldehyde-to-phenol ratios, and concentration and type of catalyst govern the mechanisms and kinetics of resole syntheses. Higher formaldehyde-to-phenol ratios accelerate the reaction rates. This is to be expected since phenol-formaldehyde reactions follow second-order kinetics. Increased hydroxymethyl substitution on phenols due to higher formaldehyde compositions also leads to more condensation products.55... [Pg.404]

Resole resins are generally crosslinked under neutral conditions between 130 and 200° C or in the presence of an acid catalyst such as hydrochloric acid, phosphoric acid, p-toluenesulfonic acid, and phenolsulfonic acid under ambient conditions.3 The mechanisms for crosslinking under acidic conditions are similar to acid-catalyzed novolac formation. Quinone methides are the key reaction intermediates. Further condensation reactions in resole resin syntheses under basic conditions at elevated temperatures also lead to crosslinking. [Pg.406]

Crosslinking resoles in the presence of sodium carbonate or potassium carbonate lead to preferential formation of ortho-ortho methylene linkages.63 Resole networks crosslinked under basic conditions showed that crosslink density depends on the degree of hydroxymethyl substitution, which is affected by the formaldehyde-to-phenol ratio, the reaction time, and the type and concentration of catalyst (uncatalyzed, with 2% NaOH, with 5% NaOH).64 As expected, NaOH accelerated the rates of both hydroxymethyl substitution and methylene ether formation. Significant rate increases were observed for ortho substitutions as die amount of NaOH increased. The para substitution, which does not occur in the absence of the catalyst, formed only in small amounts in the presence of NaOH. [Pg.407]

Phenol-formaldehyde (PF) resins were synthesized to manufacture non-flammable insulating foam. When alkali catalyst, for example, barium hydroxide (Ba(OH)2), was present, lesol resins are produced[l]. In the analj s of molecular species of resol, capillary GC-MS had been used to separate hemiformal-type compoimds(acetylated hydroxybenzylhaniformals)... [Pg.869]

All 10 PF resins were produced with Ba(OH)2 catalyst for 300 min with varying F/P molar ratio, OH/P wt %, and reaction temperatureffable 1). The resins were stored frozen at -18H until analysis. Molecular species in resol were analyzed by GO after trimethylsilylation of sample with N,0-bis(trimethylsilyl)trifluoracetamide in pyridine[2]. A glass column (3 m x 2 mm I.D.) packed with 3% OV-1 on 100-120 mesh Chromosorh W HP was applied. Injection... [Pg.869]

Direct kinetic measurements are not available to show the reactivity of the methylol group in this reaction compared to the initial reaction of formaldehyde. However, the general observation that the amounts of di- and polynuclear compounds present in resole prepolymers differ widely depending on the reaction condition (temperature, pH, specific catalyst used, concentrations of reactants) indicates that the two functional groups of formaldehyde differ in reactivity. [Pg.124]

Phenol-formaldehyde prepolymers, referred to as novolacs, are obtained by using a ratio of formaldehyde to phenol of 0.75-0.85 1, sometimes lower. Since the reaction system is starved for formaldehyde, only low molecular weight polymers can be formed and there is a much narrower range of products compared to the resoles. The reaction is accomplished by heating for 2 1 h at or near reflux temperature in the presence of an acid catalyst. Oxalic and sulfuric acids are used in amounts of 1-2 and <1 part, respectively, per 100 parts phenol. The polymerization involves electrophilic aromatic substitution, first by hydroxymethyl carboca-tion and subsequently by benzyl carbocation—each formed by protonation of OH followed by loss of water. There is much less benzyl ether bridging between benzene rings compared to the resole prepolymers. [Pg.124]

Lignin was chemically modified prior to resinification, and the effect of phenolation was examined on the gluability of the resol resin adhesives (23). The phenolation was performed either with HC1 (80°C, 60 min) or without catalyst (200°C, 60 min). Prior to adhesive testing with three-ply plywood, 5 parts of coconut husk powder were mixed with 100 parts of the resin. [Pg.492]

Figure 1. Comparison of wet-bond adhesion strengths of lignin-resol resin adhesives phenolated with and without acid catalyst. Legend phenola-tion with acid catalyst at 80°C for 60 min Q phenolation without catalyst at 200°C for 60 min. Note Numerical values in parentheses are percentages of wood failure hot-press temperature 120°C. Figure 1. Comparison of wet-bond adhesion strengths of lignin-resol resin adhesives phenolated with and without acid catalyst. Legend phenola-tion with acid catalyst at 80°C for 60 min Q phenolation without catalyst at 200°C for 60 min. Note Numerical values in parentheses are percentages of wood failure hot-press temperature 120°C.
Figure 2. Relationship between hot-press time and wet-bond adhesion strength for lignin-resol resin adhesives with and without alkylresorcinol. Legend Q without alkylresorcinol 0 with 10 parts alkylresorcinol. Note Numerical values in parentheses are percentages of wood failure phenola-tion 200°C, 60 min, without catalyst hot-press 120°C, 6 min. Figure 2. Relationship between hot-press time and wet-bond adhesion strength for lignin-resol resin adhesives with and without alkylresorcinol. Legend Q without alkylresorcinol 0 with 10 parts alkylresorcinol. Note Numerical values in parentheses are percentages of wood failure phenola-tion 200°C, 60 min, without catalyst hot-press 120°C, 6 min.

See other pages where Resole Catalysts is mentioned: [Pg.191]    [Pg.191]    [Pg.295]    [Pg.296]    [Pg.298]    [Pg.303]    [Pg.19]    [Pg.645]    [Pg.646]    [Pg.654]    [Pg.661]    [Pg.891]    [Pg.398]    [Pg.405]    [Pg.409]    [Pg.57]    [Pg.45]    [Pg.265]    [Pg.121]    [Pg.299]    [Pg.71]    [Pg.339]    [Pg.492]    [Pg.507]    [Pg.306]    [Pg.1274]    [Pg.1275]    [Pg.122]    [Pg.281]    [Pg.22]   
See also in sourсe #XX -- [ Pg.600 , Pg.601 , Pg.602 , Pg.603 ]




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