Present Microelectronics Technology

Silicon wafer has been extensively used in the semiconductor industry. CMP of silicon is one of the key technologies to obtain a smooth, defect-free, and high reflecting silicon surfaces in microelectronic device patterning. Silicon surface qualities have a direct effect on physical properties, such as breakdown point, interface state, and minority carrier lifetime, etc. Cook et al. [54] considered the chemical processes involved in the polishing of glass and extended it to the polishing of silicon wafer. They presented the chemical process which occurs by the interaction of the silicon layer and the... 

The U.S. - Australia Symposium on Radiation Effects on Polymeric Materials contained research presentations on fundamental radiation chemistry and physics as well as on technological applications of polymer irradiation. This paper represents a hybrid contribution of these two areas, examining a field of extensive technological importance. Spin casting of radiation sensitive polymer resists for microelectronic fabrication was studied using photophysical techniques that are sensitive to the fundamental radiation response in the ultraviolet range. 

In this paper, the application of microelectronic processing technology to the fabrication of SnOx and PdAu/SnOx microsensors on silicon wafers is described, sensor responses to various gases in air are presented, and the possible sensing mechanisms are briefly discussed. 

In this paper we present a comprehensive experimental and theoretical description of nanodomain reversal in fe bulk crystals an experimental method for domain switching using hvafm, results on nanodomain switching using hvafm and under indirect electron beam exposure, theory of fe domain breakdown and our last development of the fabrication of nanodomain gratings by the use of multiple tip arrays. We show that fdb is a new physical phenomenon observed in bulk fe crystals, and is the basis for the development of nanodomain technology in bulk fe crystals. This technology is required for future photonic, acoustic and microelectronic devices. 

To our knowledge, the present polyimide monolayer films possess the minimum thickness ever produced. We believe that this simple and efficient method for the preparation of polyimide mono- and multilayer films will bring about new technology especially in microelectronics. 

Microfabrication technology used to manufacture microreactors also introduces many advantages, most notably the ability to rapidly and cheaply mass-produce devices. The low cost of microfabricated devices makes it possible for these devices to be disposable, a characteristic desirable for many medical applications. Rapid scale-up of production by operating many microreactors in parallel can also be accomplished. Microfabrication also presents the opportunity for complete systems in a single monolithic device or systems on a chip as microreactors are incorporated with chemical sensors and analysis devices, microseparation systems, microfluidic components, and/or microelectronics. 

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