Microelectronics processing

Jensen, K. F. In Microelectronics Processing, Chemical Engineering Aspects Hess, D. W., and Jensen, K. F., Eds. ACS Advances in Chemistry Series 23 American Chemical Society Washington, DC, 1989 pp. 200-206. 

He has published over 200 papers in the fields of process control, optimization, and mathematical modeling of processes such as separations, combustion, and microelectronics processing. He is coauthor of Process Dynamics and Control, published by Wiley in 1989. Dr. Edgar was chairman of the CAST Division of AIChE in 1986, president of the CACHE Corporation from 1981 to 1984, and president of AIChE in 1997. 

The realization of the MEA is a crucial point for constructing a good fuel cell stack. The method currently used consists in hot-pressing (at 130 °C and 35 kg cm ) the electrode structures on the polymer membrane (Nafion). This gives non-reproducible results (in terms of interface resistance) and this is difficult to industrialize. New concepts must be elaborated, such as the continuous assembly of the three elements in a rolling tape process (as in the magnetic tape industry) or successive deposition of the component layers (microelectronic process) and so on. 

Reactions involving solids are very important in many technologies such as microelectronics processing, ceramics, ore refining, electrochemical deposition and etching, chemical vapor deposition and etching, and food processing. We will consider some of these applications in problems, but we first note several important examples. 

D. W. Hess and K. F. Jensen (eds.), Microelectronics Processing Chemical Engineering Aspects. ACS Advances in Chemistry Ser. 221. American Chemical Society, Washington, D.C., 1989. 

Microelectronics Processing Chemical Engineering Aspects Dennis W. Hess, editor, Klavs F. Jensen, editor p. cm.—(Advances in chemistry series, ISSN 0065-2393 221)... 

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