Phenolic resin—poly

The main application of poly (vinyl formal) is as a wire enamel in conjunction with a phenolic resin. For this purpose, polymers with low hydroxyl (5-6%) and acetate (9.5-13%) content are used. Similar grades are used in structural adhesive (e.g. Redux) which are also used in conjunction with phenolic resin. Poly(vinyl formal) finds some use as a can coating and with wash primers. Injection mouldings have no commercial significance since they have no features justifying their use at current commercial prices. 

Structure of phenolic resin-poly(dimethyl siloxane) copolymers. 

Alkyd resins Amino resins Epoxy resins Phenolic resins Poly(bis maleimide)... 

Thermo set polymers Alkyd resins Amino resins Epoxy resins Phenolic resins Poly(bis maleimide) Polyesters, unsaturated Thermoset resin Tohprene TOR Torelina Torlon TP 301 TPX... 

Expanded phenolic resin Poly(carbodiimide) foam Polyisocyanurate foam Expanded polystyrene, flame-retarded Fir-wood... 

Alkylated phenol derivatives are used as raw materials for the production of resins, novolaks (alcohol-soluble resins of the phenol—formaldehyde type), herbicides, insecticides, antioxidants, and other chemicals. The synthesis of 2,6-xylenol [576-26-1] h.a.s become commercially important since PPO resin, poly(2,6-dimethyl phenylene oxide), an engineering thermoplastic, was developed (114,115). The demand for (9-cresol and 2,6-xylenol (2,6-dimethylphenol) increased further in the 1980s along with the growing use of epoxy cresol novolak (ECN) in the electronics industries and poly(phenylene ether) resin in the automobile industries. The ECN is derived from o-cresol, and poly(phenylene ether) resin is derived from 2,6-xylenol. 

The thermoplastic or thermoset nature of the resin in the colorant—resin matrix is also important. For thermoplastics, the polymerisation reaction is completed, the materials are processed at or close to their melting points, and scrap may be reground and remolded, eg, polyethylene, propjiene, poly(vinyl chloride), acetal resins (qv), acryhcs, ABS, nylons, ceUulosics, and polystyrene (see Olefin polymers Vinyl polymers Acrylic ester polymers Polyamides Cellulose ESTERS Styrene polymers). In the case of thermoset resins, the chemical reaction is only partially complete when the colorants are added and is concluded when the resin is molded. The result is a nonmeltable cross-linked resin that caimot be reworked, eg, epoxy resins (qv), urea—formaldehyde, melamine—formaldehyde, phenoHcs, and thermoset polyesters (qv) (see Amino resins and plastics Phenolic resins). 

Phenolic resins are useful surface coating materials. Resols are useful for stoving lacquers for coating chemical plant, textile equipment, razor blades, brassware cuid food cans. Phenolic resins are used with poly(vinyl formal) as a flexible, tough and solvent-resistant wire enamel. Oil-soluble resins based on synthetic phenols form the basis of some gloss paints. 

Resistance to weathering. Zinc oxide and magnesium oxide stabilize poly-chloroprene against dehydrochlorination. Further, zinc oxide helps vulcanize the rubber, and magnesium oxide reacts with /-butyl phenolic resin to produce a resinate which improves heat resistance of solvent-borne polychloroprene adhesives. 

The PVF is made by acidic reaction between poly(vinyl alcohol) (PVA) and formaldehyde. The poly(vinyl alcohol) is, in turn, made by hydrolysis of poly(vinyl acetate) or transesterification of poly(vinyl acetate). Thus, residual alcohol and ester functionality is usually present. Cure reportedly occurs through reaction of phenolic polymer hydroxyls with the residual hydroxyls of the PVA [199]. The ester residues are observed to reduce bond strength in PVF-based systems [199]. This does not necessarily extend to PVF-P adhesives. PVF is stable in strong alkali, so participation of the acetals in curing is probably unimportant in most situations involving resoles. PVF is physically compatible with many phenolic resins. 

Poly(hydroxyphenyl maleimide)-b-PBA was added to thermosetting phenol resin to improve heat resistance [63]. PVC blended with poly(vinyl copolymer having cyclohexyl maleimide group)-b-PVC showed improved heat resistance and tensile strength with thermal stability during processing [64]. 

While "conventional positive photoresists" are sensitive, high-resolution materials, they are essentially opaque to radiation below 300 nm. This has led researchers to examine alternate chemistry for deep-UV applications. Examples of deep-UV sensitive dissolution inhibitors include aliphatic diazoketones (61-64) and nitrobenzyl esters (65). Certain onium salts have also recently been shown to be effective inhibitors for phenolic resins (66). A novel e-beam sensitive dissolution inhibition resist was designed by Bowden, et al a (67) based on the use of a novolac resin with a poly(olefin sulfone) dissolution inhibitor. The aqueous, base-soluble novolac is rendered less soluble via addition of -10 wt % poly(2-methyl pentene-1 sulfone)(PMPS). Irradiation causes main chain scission of PMPS followed by depolymerization to volatile monomers (68). The dissolution inhibitor is thus effectively "vaporized", restoring solubility in aqueous base to the irradiated portions of the resist. Alternate resist systems based on this chemistry have also been reported (69,70). 

Poly(methyl methacrylate) 1880 1928 Plastics (Plexiglassfi) Phenolic resins 1907 1910 Thermosets... 

They are generally used in the form of prepregs 70% fibres/30% matrix of epoxy, poly-imide or phenolic resin. 

In the development of a reactive non-chrome post-treatment, a variety of phenolic resins were synthesized and commercial phenolic resins evaluated. It was found that phenol-formaldehyde resins, creso1-forma1dehyd e condensates, ortho-novo 1 ak resins, and phenol-formaldehyde emulsions gave positive results when employed as post-treatments over zinc and iron phosphate conversion coatings. The above materials all possessed drawbacks. The materials in general have poor water solubility at low concentrations used in post-treatment applications and had to be dried and baked in place in order to obtain good performance. The best results were obtained with poly-4-vinylphenol and derivatives thereof as shown in the following structure (8,9,10)... 

Materials. Epoxy novolac, DEN-431, obtained from Dow Chemical Co. was selected as the epoxy component. A 3,3 -diazidodiphenyl sulfone synthesized in our laboratory (5) was used as the azide compound. Poly(/7-vinyl phenol) obtained from Maruzen Oil Co. was used as the phenolic resin matrix. The coating solvent was cyclohexanone. The developer used in this study was 0.1 N tetramethylammonium hydroxide aqueous solution. 

Exposure-induced Reaction Products. Gel permeation chromatograms of EP, MRS, and EAP were measured before and after exposure at 20 /uC/cm2. The results are summerized in Figures 8 to 10. In the case of EP resist, shown in Figure 8, peaks 1, 2, and 3 represent epoxy novolac dimer, trimer, and tetramer, respectively. Peak 4 represents the main component of the poly(p-vinyl phenol) resin and peak 5 indicates the presence of exposure-induced high molecular weight components in the resin. 

In general, a high-molecular-weight phenolic resin is less alkaline-soluble than a low-molecular-weight one. Therefore, these high molecular weight poly(p-vinyl phenol) components may contribute to the decrease in solubility. Furthermore, we assume that the etching type dissolution of these resists is non-fractional, as was previously shown in the case of poly (methyl methacrylate-co-acrylonitrile) (15). 

The newer open-cell foams, based on polyimides (qv), polybenzimidazoles, polypyrones, polyureas, polyphenylquinoxalines, and phenolic resins (qv), produce less smoke, are more fire resistant and can be used at higher temperatures. These materials are more expensive and used only for special applications including aircraft and marine vessels. Rigid poly (vinyl chloride) (PVC) foams are available in small quantities mainly for use in composite panels and piping applications (see Flame retardants Hrat-rrststantpot.ymf.rs). 

Some of the common types of plastics that are used are thermoplastics, such as poly(phenylene sulfide) (PPS) (see POLYMERS CONTAINING SULFUR), nylons, liquid crystal polymer (LCP), the polyesters (qv) such as polyesters that are 30% glass-fiber reinforced, and poly(ethylene terephthalate) (PET), and polyetherimide (PEI) and thermosets such as diallyl phthalate and phenolic resins (qv). Because of the wide variety of manufacturing processes and usage requirements, these materials are available in several variations which have a range of physical properties. 

Novolac and resol cold hardening oligomers habe been used 19-75-99). In the case of resol foams the process technology is not different from that used for epoxy foams. Glass, phenolic resins, carbon, polystyrene, polyacrylonitrile and poly(vinylidene chloride) microspheres have been used as fillers ... 

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