Epoxy one-component

Novel, toughened one-component epoxy structural adhesives based on epoxy-terminated polyurethane prepolymer incorporating an oxolidone structure were developed to provide improved toughness, fracture resistance and adhesive properties with good chemical and moisture resistance.21 The hybrid resin cures with a standard latent curing agent/accelerator. [Pg.133]

Another characteristic difference between a two-component, room temperature curing epoxy adhesive system and a one-component, heat curing system is the shelf life. The shelf life of a one-component epoxy can be 3 to 6 months when stored at room temperature and may even require refrigeration or freezing for a practical shelf life. The shelf life of each component in a two-component system is generally 6 months to 1 year. [Pg.205]

Whereas most room temperature curing epoxy adhesives are cured with aliphatic amines, polyamides, or amidoamines, most elevated-temperature curing epoxy adhesives are cured with aromatic amines, modified aliphatic amines, alcoholic and phenolic hydroxyls, acid anhydrides, Lewis acids, and a host of other curatives. Latent curing agents, such as dicyan-diamide and imidazoles, are typically used in one-component epoxy adhesives systems. [Pg.229]

In one-component epoxy adhesives, the curing agent and resin are compounded together as a single product by the adhesive formulator. The curing agent system is chosen so that it does not react with the resin until the appropriate processing conditions are applied. [Pg.233]

Dicyandiamide (sometimes referred to as dicy ) or its derivatives are used in most commercial one-component epoxy adhesives. This curative is a white crystalline solid and is easy to incorporate into an epoxy formulation as a finely ground powder. When cured with epoxy resin, dicyandiamide provides an excellent set of performance properties. [Pg.233]

TABLE 12.7 One-Component Epoxy Adhesive Cured with Dicyandiamide9... [Pg.234]

BFj-MEA cured epoxy adhesives are very economical to produce since only a small amount of catalyst is required. These adhesives have good elevated service temperature. Table 12.10 is a starting formulation for a one-component epoxy adhesive cured with a BE3 MEA catalyst. It has a shelf life of approximately 4 months at room temperature. [Pg.236]

Induction Curing Adhesives. Typically one-component epoxy adhesive systems are used for induction bonding of structural parts. However, two-component adhesives have also been used. The properly designed induction cured adhesive should provide the following application and performance properties ... [Pg.274]

Several studies have shown that a microwave cure cycle can be developed that provides equivalent performance properties to a thermal cure cycle. Table 14.9 shows the processing and performance characteristics of three commercial one-component epoxy adhesives cured via microwave and conventional thermal energy. Certain commercial epoxy adhesives could contain a large number of bubbles due to volatiles present during the cure cycle and the fast rate of cure. Therefore, specifically formulated adhesives for microwave curing may be necessary to optimize performance. [Pg.278]

Bolger, J. C., New One Component Epoxy Insulation Compounds, Insulation, October 1969. [Pg.288]

A = Polyester-urethane B = Fluorinated polyacrylate C = Polyether urethane D = Anhydride cured epoxy 1 E = Anhydride cured epoxy 2 F = One-component epoxy 1 ... [Pg.320]

Araldite AV 4600 Huntsman 15 min at 150°C Quick-cure, one-component epoxy... [Pg.470]

One-component epoxy adhesive cured with dicyandiamide... [Pg.486]

One-component epoxy resin adhesives are almost limited to industrial use (car manufacture, aircraft construction, electronics). Resin and hardener components are already mixed, due to special formulations, however, they are prevented from reacting with each other at room temperature and thus from curing (blocking, Section 3.1.4). [Pg.25]

Unicast [Emerson Cuming] One-component epoxy castir resins incL general purpose, thermally conductive, and fire retardant... [Pg.389]

In recent years, there have been some interesting developments in epoxy-modified mortar and concrete in Germany. The developments include a one-component epoxy resin system for the cement modifier and a dry mortar using epoxy resin. The former does not need any hardeners added at the construction site. The latter is produced as a dry mixture of an epoxy resin with a hardener, cement, and aggregates, and can be applied by adding only water in the field. [Pg.188]

The most commonly used adhesives in the electronics industry are thermosetting one-component epoxy resins and UV-irradiation cross-linking acrylates [7]. [Pg.866]

Flexible circuit boards consist primarily of polyimide-based carriers. The problem of bonding the copper foil on the polyimide carrier has not yet been solved satisfactorily. Due especially to their low bonding strength at elevated temperatures, the production of such materials is very limited. Nevertheless, adhesives for copper-polyimide systems were developed, where one-component epoxy resins (e.g., epoxy-polyester mixtures) and reactive hot melts (e.g., phenolic resin-nitrile rubbers) reached importance. [Pg.870]

Chem. Descrip. One-component epoxy resin, UV curing CAS 25928-94-3... [Pg.31]

Monopoxy, One-component epoxy adhesive, Elementis Performance Polymers, Div. Harcros Chemicals, Inc. [Pg.921]

Paints, varnishes and lacquers based on epoxy resins are used in various industrial applications because of their strength and durability. Two-component epoxy paints that cure at room temperature need a hardener added before their use. One-component epoxy paints that are heat-cured contain a hardener which can be activated only by heating. Polyfunctional aliphatic amines, aromatic amines, solid polyamides and anhydrides can be used as curing agents. Epoxy-ester-resin paints are formed by reacting epoxy resin with... [Pg.664]

One-component epoxies may require refrigeration. Bonds skin. [Pg.16]

Application and utilisation of these film adhesives Structural thermosetting film adhesives The film is cut to the desired size and laid on one of the substrates (refer to Fig. 92). Parts are assembled and hot pressed in an autoclave or a hot press, for instance for a one component epoxy adhesive for 30 min at 120°C, under a pressure of 100-300 kN/m for REDUX 312, or 60 min at 170°C with REDUX 308 or REDUX 322. [Pg.176]

They are placed between parts to be bonded, they melt during the oven cycle and bond the parts together. They may also act as a potting and encapsulating product. The epoxy formulation may also contain conductive particles in order to allow cure by induction or high frequency. Curing conditions are those of the one-component epoxy adhesives, i.e. from 15 to 60 min at temperatures ranging from 120 to 160°C. [Pg.179]

One-component Epoxy/PUR hybrid adhesive Combination and mixture of polyurethane and epoxy resin, where the epoxy group reacts with the latent hardener at high temperature... [Pg.478]

One-component epoxy adhesives can be formulated using DiCy as the hardener. DiCy is called a latent hardener because it is insoluble in epoxies at ambient temperatures and becomes soluble and active only if the systems are heated. These types of epoxies have become widely used in the automotive industry, for example, in hem-flange bonding. [Pg.19]

Epoxy B in Table 3 is cured with a Lewis acid salt, the monoethylamine salt of boron trifluoride (BF3MEA). The first gold- and silver-filled one-component epoxy die attach adhesives, which were sold in the U.S. in the early 1970s, contained this curing agent. When heated to 150 C, BF3MEA liberates BF3 gas, which serves as an acid catalyst to cure the epoxy. [Pg.711]

Table 3. Composition of First-Generation One-Component Epoxy Die Attach...

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