Passive film electrode potential

Corrosion protection of metals can take many fonns, one of which is passivation. As mentioned above, passivation is the fonnation of a thin protective film (most commonly oxide or hydrated oxide) on a metallic surface. Certain metals that are prone to passivation will fonn a thin oxide film that displaces the electrode potential of the metal by +0.5-2.0 V. The film severely hinders the difflision rate of metal ions from the electrode to tire solid-gas or solid-liquid interface, thus providing corrosion resistance. This decreased corrosion rate is best illustrated by anodic polarization curves, which are constructed by measuring the net current from an electrode into solution (the corrosion current) under an applied voltage. For passivable metals, the current will increase steadily with increasing voltage in the so-called active region until the passivating film fonns, at which point the current will rapidly decrease. This behaviour is characteristic of metals that are susceptible to passivation. 

The values in Table 2.16 show how the potentials obtained under service conditions differ from the standard electrode potentials which are frequently calculated from thermodynamic data. Thus aluminium, which is normally coated with an oxide film, has a more noble value than the equilibrium potential 3 + / = — 1-66V vs. S.H.E. and similar considerations apply to passive stainless steel (see Chapter 21). 

In the polarization curve for anodic dissolution of iron in a phosphoric acid solution without CP ions, as shown in Fig. 3, we can see three different states of metal dissolution. The first is the active state at the potential region of the less noble metal where the metal dissolves actively, and the second is the passive state at the more noble region where metal dissolution barely proceeds. In the passive state, an extremely thin oxide film called a passive film is formed on the metal surface, so that metal dissolution is restricted. In the active state, on the contrary, the absence of the passive film leads to the dissolution from the bare metal surface. The difference of the dissolution current between the active and passive states is quite large for a system of an iron electrode in 1 mol m"3 sulfuric acid, the latter value is about 1/10,000 of the former value.6... 

Figure 5 shows the relationship between the passive film thickness of an iron electrode and the electrode potential in an anodic phosphate solution and a neutral borate solution.6,9 A passive film on an iron electrode in acidic solution is made up of an oxide barrier layer that increases its thickness approximately linearly with increasing electrode potential, whereas in a neutral solution, there is a precipitated hydroxide layer with a constant thickness outside the oxide barrier layer. 

Once a passive film is formed on a metal surface, as long as the electrode potential remains in the passive potential region, the surface is stable, i.e., scarcely dissolved. However, if there are film-destructive anions like chloride ions in solution, the passive film is locally broken, so that local dissolution of the metal substrate proceeds at the same place. 

According to Eq. (23), the critical pore radius r greatly decreases with increasing electrode potential. It is seen that above a certain critical potential AE b the active barrier as well as the critical pore radius decreases steeply with anodic potential. This critical potential AE is the lowest potential of pore formation and below this potential the passive film is stable against electrocapillary breakdown because of an extremely high activation barrier and the large size of pore nucleus required. 

Figure 18 shows the dependence of the activation barrier for film nucleation on the electrode potential. The activation barrier, which at the equilibrium film-formation potential E, depends only on the surface tension and electric field, is seen to decrease with increasing anodic potential, and an overpotential of a few tenths of a volt is required for the activation energy to decrease to the order of kBT. However, for some metals such as iron,30,31 in the passivation process metal dissolution takes place simultaneously with film formation, and kinetic factors such as the rate of metal dissolution and the accumulation of ions in the diffusion layer of the electrolyte on the metal surface have to be taken into account, requiring a more refined treatment. 

In the potential region where nonequilibrium fluctuations are kept stable, subsequent pitting dissolution of the metal is kept to a minimum. In this case, the passive metal apparently can be treated as an ideally polarized electrode. Then, the passive film is thought to repeat more or less stochastically, rupturing and repairing all over the surface. So it can be assumed that the passive film itself (at least at the initial stage of dissolution) behaves just like an adsorption film dynamically formed by adsorbants. This assumption allows us to employ the usual double-layer theory including a diffuse layer and a Helmholtz layer. 

After a constant potential step beyond the pitting potential is applied to a nickel electrode in NaCl solution, the current transient shown in Fig. 39 is observed. The J vs. 1/VT plot according to Eq. (104) is shown in Fig. 40. From the linear portion corresponding to Eq. (104), the slope of the plot can be described as a function of the surface coverage 6 of the passive film in the following... 

The corrosion of stainless steel in 0.1 mol-1 NaCl solutions at open circuit potential was studied in detail by Bruesch et al. [106] using XPS in combination with a controlled sample transfer system [38]. It was verified by XPS analysis that the passivating film contains chromium oxide. The position and the height of the Cr concentration maximum depends critically on the bulk chromium content of the steel. Significant variations in the electrode passivation properties were observed at a Cr concentration of 12%, while the film behaviour was found to be rather independent of the other components like Mo, Ni, Cu. From the fact that the film structures and... 

When the electrolyte solutions are not too reactive, as in the case of ethereal solutions, there is no massive formation of protective surface films at potentials above Li intercalation potential, and most of the solvent reduction processes may occur at potentials lower than 0.3 V vs. Li/Li+. Hence, the passivation of the electrodes is not sufficient to prevent cointercalation of solvent molecules. This leads to an exfoliation of the graphite particles into amorphous dust (expholiated graphene planes). This scenario is demonstrated in Figure 2a as the reduction of the 002 diffraction peak21 of the graphite electrode, polarized cathodically in an ethereal solution. 

The state in which the anodic dissolution of metals proceeds from the bare metal stirface at relatively low electrode potentials is called the active state the state in which metal dissolution is inhibited substantially by a superficial oxide film at higher electrode potentials is called the passive state-, the state in which the anodic dissolution of metals increases again at stiU higher (more anodic) potentials is called the transpassive state. 

In the active state, the dissolution of metals proceeds through the anodic transfer of metal ions across the compact electric double layer at the interface between the bare metal and the aqueous solution. In the passive state, the formation of a thin passive oxide film causes the interfadal structure to change from a simple metal/solution interface to a three-phase structure composed of the metal/fUm interface, a thin film layer, and the film/solution interface [Sato, 1976, 1990]. The rate of metal dissolution in the passive state, then, is controlled by the transfer rate of metal ions across the film/solution interface (the dissolution rate of a passive semiconductor oxide film) this rate is a function of the potential across the film/solution interface. Since the potential across the film/solution interface is constant in the stationary state of the passive oxide film (in the state of band edge level pinning), the rate of the film dissolution is independent of the electrode potential in the range of potential of the passive state. In the transpassive state, however, the potential across the film/solution interface becomes dependent on the electrode potential (in the state of Fermi level pinning), and the dissolution of the thin transpassive film depends on the electrode potential as described in Sec. 11.4.2. 

Thus, in the stationary state, the rate of anodic transfer of metal ions across the metal/film interface equals the rate of anodic transfer of metal ions across the film/solution interface this rate of metal ion transfer represents the dissolution rate of the passive film. The thickness of the passive film at constant potential remains generally constant with time in the stationary state of dissolution, although the thickness of the film depends on the electrode potential and also on the dissolution current of the passive film. 

In the range of potential of the passive state the passive oxide film is in the state of band edge level pinning at the film/solution interface hence, the potential A( )h across the film/solution interface remains constant irrespective of the electrode potential of the passive metal. With increasing anodic polarization and in the... 

Fig. 11-11. Potential at a film/solution interface and potential dfp in a passive film as a fimction of anodic potential of a passive metal electrode in the stationary state the interface is in the state of band edge level pinning to the extent that the Fermi level e, is within the band gap, but the interface changes to the state of Fermi level pinning as e, coincides with the valence band edge Cy.

In the case of nickel electrodes on which the passive film is a p-f pe nickel oxide (NiO), the energy gap ( 0.2 eV) between the valence band edge and the Fermi level at the flat band potential is small so that the transpassivation potential Etp is relatively close to the flat band potential as in Fig. 11-13. 

A1 is thermodynamically unstable, with an oxidation potential at 1.39 V. Its stability in various applications comes from the formation of a native passivation film, which is composed of AI2O3 or oxyhydroxide and hydroxide.This protective layer, with a thickness of 50 nm, not only stabilizes A1 in various nonaqueous electrolytes at high potentials but also renders the A1 surface coating-friendly by enabling excellent adhesion of the electrode materials. It has been reported that with the native film intact A1 could maintain anodic stability up to 5.0 V even in Lilm-based electrolytes. Similar stability has also been observed with A1 pretreated at 480 °C in air, which remains corrosion-free in LiC104/EC/ DME up to 4.2 However, since mechanical... 

The third aspect to consider is the electrochemical stability of the material used. For the oxygen reduction reaction, the electrode potential is highly anodic and at this potential, most metals dissolve actively in acid media or form passive oxide films that will Inhibit this reaction. The oxide forming metals can form non-conducting or semi-conducting oxide films of variable thickness. In alkaline solutions, the range of metals that can be used is broader and can include non-precious or semi-precious metals (Ni, Ag). 

An interesting example of the kinetic effect in semiconductor photocorrosion is photopassivation and photoactivation of silicon (Izidinov et al., 1962). Silicon is an electronegative element, so it should be dissolved spontaneously and intensively in water with hydrogen evolution. But in most of aqueous solutions the surface of silicon is covered with a nonporous passivating oxide film, which protects it from corrosion. The anodic polarization curve of silicon (dashed line in Fig. 20) is of the form characteristic of electrodes liable to passivation as the potential increases, the anodic current first grows (the... 

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