Metal Deposition Techniques

Semiconductor fabrication techniques have also been successfully applied to the construction of conventional transducers sensitive to hydrogen peroxide, oxygen, and carbon dioxide, A hydrogen peroxide-sensitive silicon chip was made by using metal deposition techniques (28,29). The combination of the hydrogen peroxide-sensitive transducer and enzyme-immobilized membranes gave a miniaturized and multifunctional biosensor. Similarly, an oxygen- and a carbon dioxide-sensitive device was made cmd applied to the construction of biosensors (25, 30, 31). 

Additional evidence of oxygen being involved as pait of the metal polymer link was obtained by examining the thiclmess of the metal oxide layer on the outer surface of the metal and at the metal/polymer interface prior to and subsequent to the heat-tieatment step. Analysis of the backside of the intetphase region was accomplished via dissolution of the polymer substrate The data in Table VI show that the oxide thicknesses were nominally equal at the air and polymer sides of the structure. The oxide thicknesses were independent of metal deposition technique although the presence of the palladium catalyst employed for electroless deposition complicated the analyses. X-ray photoelectron spectroscopy identified the oxide species as cuprous oxide 10,17. Excellent adhesion was obtained once the oxide thickness exceeded 3 nm at the metal/polyetherimide interfacial zone. 

Metal Deposition Technique Heat Treatment Time (h) Copper Oxide Thickness (nm) Peel Strength (g/inm)... 

Because the developer also attacks the exposed dielectric laterally, sloped-wall vias are produced. Consequently, metallization of these vias entail a metal deposition technique that fully covers the sloped wall. In addition, vias in the adjacent layers must be staggered, which decreases the interconnect density. Besides being a simple process, ease of reworking is another advantage of the utilization of a photosensitive polymer dielectric. Being able to easily remove the xmwanted dielectric layer before hard baking avoids the stripping process. 

Easily decomposed, volatile metal carbonyls have been used in metal deposition reactions where heating forms the metal and carbon monoxide. Other products such as metal carbides and carbon may also form, depending on the conditions. The commercially important Mond process depends on the thermal decomposition of Ni(CO)4 to form high purity nickel. In a typical vapor deposition process, a purified inert carrier gas is passed over a metal carbonyl containing the metal to be deposited. The carbonyl is volatilized, with or without heat, and carried over a heated substrate. The carbonyl is decomposed and the metal deposited on the substrate. A number of papers have appeared concerning vapor deposition techniques and uses (170—179). 

The isolation of zinc, over 90% of which is from sulfide ores, depends on conventional physical concentration of the ore by sedimentation or flotation techniques. This is followed by roasting to produce the oxides the SO2 which is generated is used to produce sulfuric acid. The ZnO is then either treated electrolytically or smelted with coke. In the former case the zinc is leached from the crude ZnO with dil H2SO4, at which point cadmium is precipitated by the addition of zinc dust. The ZnS04 solution is then electrolysed and the metal deposited — in a state of 99.95% purity — on to aluminium cathodes. 

Satisfactory service of an electroplated article is not achieved, however, unless adequate care is given to the choice of deposited metal, its thickness, the technique of application, and the design of the article. The choice of metal deposit is primarily determined by the basis metal, i.e. the metal from which the article is made, and the actual conditions to which the plated article will be subjected during service. In addition, however, attractive appearance and reasonable cost are also important considerations. 

Additional metal layers can create bimetallic corrosion cells if discontinuities appear in service. The layer of copper beneath cadmium plate on aluminium (using a zincate plus cuprocyanide deposit technique) can cause corrosion troubles. When aluminium is plated with nickel and chromium, rapid service corrosion in the zinc layer causes exfoliation. 

In this lecture we recall the basic principles of the two main coating families dielectric and metallic coatings. In a second part, we describe the coatings deposition techniques and we address their performances and limitation. Most of the examples given in this lecture have been developed for the gravitational waves interferometers VIRGO and LJGO (see Ch. 18). 

The relative extinction-coefficients for Agi,2,s determined by pho-toaggregation procedures were found not to be strongly matrix-dependent (see Table VIII). Moreover, the results for Agj were in good agreement with those obtained by quantitative, metal-atom deposition-techniques. 

The conversion of protein-made nanostructnres, e.g., microtnbnles, into conducting nano-wires was also recently investigated [11] Metallization of microtnbnles, by an electrolyte nickel deposition technique, initiated by molecnlar palladinm catalysts, was described. 

Samples of high area powders and of supported metals may be applied to the CaF2 support plate by a spraying technique, previously described In detall(ll). In Figure 1, we show a half plate design In which a supported metal deposit, produced by H2 reduction of metal Ions held on the support, occupies one half of the plate while the pure support occupies the other half. 

FIGURE 36.1 Schematic illustration of some electrochemical techniques employed for surface nanostructuring (a) tip-induced local metal deposition (b) defect nanostructuring (c) localized electrochemical nucleation and growth d) electronic contact nanostructuring. 

The synthesis of MNCGs can be obtained by sol-gel, sputtering, chemical vapor-deposition techniques. Ion implantation of metal or semiconductor ions into glass has been explored since the last decade as a useful technique to produce nanocomposite materials in which nanometer sized metal or semiconductor particles are embedded in dielectric matrices [1,2,4,23-29]. Furthermore, ion implantation has been used as the first step of combined methodologies that involve other treatments such as thermal annealing in controlled atmosphere, laser, or ion irradiation [30-32]. 

---