Silicon dioxide MEMS devices

CVD is used to produce microelectromechanical structures (MEMS), very small devices. MEMS technology allows both electrrMiic circuits and mechanical devices to be manufactured on a silicon chip. MEMS structures can be made from silicon wafers with CVD deposits of polycrystalline sUicOTi (polysDicon) films and sacrificial silicon dioxide layers that are later removed by chemical etching [14]. 

One of the earliest optical MEMS devices used the electrostatic deflection of an array of cantilever beams in combination with a galvo scanner to form a projection display system as shown in Figure 4.1 [1]. The cantilever beams were metal-coated silicon dioxide, but they could also be formed in polysilicon using the MUMPS process or in single crystal silicon in the SOIMUMPS process. 

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