Nanoparticle Thin-Film Deposition on MEMS Devices

Nanoparticle Thin-Film Deposition on MEMS Devices 

In order to prevent the irrevisible adhesion of MEMS microstructures, several studies have been performed to alter the surface of MEMS, either chemically or physically. Chemical alterations have focused on the use of organosilane self-assembled monolayers (SAMs), which prevent the adsorption of ambient moisture and also reduce the inherent attractive forces between the microstructures. Although SAMs are very effective at reducing irreversible adhesion in MEMs, drawbacks include irreproducibility, excess solvent use, and thermal stability. More recent efforts have shifted towards physical alterations in order to increase the surface roughness of MEMS devices. 

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