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Internal technology

Fig. 2.1 International Technology Roadmap for Semiconductors (ITRS). Reprinted from Prasher et al. (2005) with permission... Fig. 2.1 International Technology Roadmap for Semiconductors (ITRS). Reprinted from Prasher et al. (2005) with permission...
According to the international technology roadmap for semiconductors, chips with a wafer diameter of450 mm and a feature size of 0.05 /xm by 2011 will serve to decrease manufacturing costs [29]. In the integrated circuit (IC) manufacture process as shown in Fig. 21 [30], dielectric stacks have been formed by the ion etching on the coating of dielectric material formed on the silicon surface (Fig. 21 (a)). [Pg.245]

ITRS-2007, International Technology Roadmap for Semiconductors (2007) version (http //www.itrs.net/reports) section on emerging research materials (sub-22 nm)... [Pg.78]

International Technology Roadmap for Semiconductors. 2005 Edition. Accessed http //www.itrs.net/. [Pg.340]

Askay, I. Nanostructured ceramics through self-assembly, in Seigel, R. W., Hu, E. and Roco, M. C. (eds) R D Status and Trends in Nanoparticles, Nanostructured Materials and Nanodevices in the United States, International Technology Research Institute, Baltimore, MD, USA, 1998. [Pg.555]

Mndoor air pollution survey carried oul with founding from HK ITC and contracted to Acron International Technologies, Inc. 2data based on survey conducted by EHS Consulting Ltd Agreement CE 14/95... [Pg.374]

In Chapter 1, we discussed historic product innovations, both motivated by external market-pull and by internal technology-push motivations. Figure 12.1 shows a quadrant that was popularized by the Boston Consulting Group as the stars and dogs chart, and later popularized by Donald Stokes as Pasteur s quadrant. The horizontal axis shows the strength of external market-pull, and the vertical axis shows the level of... [Pg.340]

Branstetter, Lee G., Raymond Fisman, and C. Fritz Foley. 2003. Do Stronger Intellectual Property Rights Increase International Technology Transfer Empirical Evidence from U.S. Firm-Level Panel Data. Unpublished paper, Columbia University Business School. [Pg.295]

Prototype LIBS sorting system is firstly developed by International Technologies Lasers (ITL) Company. In present modification, the system accomplishes evaluation of conveyed rocks composition. Beta site test was successfully accomplished at 2004 on Four Corners Mine, Florida. [Pg.306]

International Technology (IT) Corporation Hybrid Thermal Treatment System (HTTS)... [Pg.716]

International Technology (IT) Corporation applies in situ air sparging for the remediation of contaminated groundwater. This technique involves blowing air into groundwater to help volatilize... [Pg.717]

At a former manufactured gas facility in Long Beach, California, International Technology Corporation s in situ air sparging apparatus was combined with its ozonation technology. Construction and operation costs for the project from 1998 to 2000 are estimated to be 1,000,000 (D19400N, pp. 5, 6). [Pg.718]

WPIM (World Patents Index Markush), produced by Derwent Publications, Ltd., contains the specific and generic structure records for compounds in the patents included in Derwent Sections B (Farmdoc), C (Agdoc), and E (Chemdoc) since 1987. Sources include patents from 29 industrialized countries as well as European and PCT patents and also items from Research Disclosure and International Technology Disclosures. The compound numbers of relevant references found in WPIM can be searched in Derwent s WPI database to retrieve the corresponding bibliographic information. [Pg.126]

The successful application of the sol-gel route has been realized in the International technological practice of many branches of the industries—electronics, optics, construction of engines, nuclear energetics, chemical, and food industry equipment. Among these materials are ferro-, piezo-, and dielectrics, solid electrolytes, refractory materials, membranes, protective and decorative coatings, and also films with special optical and electrophysical properties, like hightemperature superconductors. [Pg.6]

FIGURE 3.1 The SIA Roadmap provides direction to corporate semiconductor research laboratories (Semiconductor Industry Association, The International Technology Roadmap for Semiconductors, 1999 ed International SEMATECH, Austin, TX.)... [Pg.29]

Two other definitions provided in a2002reportby the International Technology Research Institute are ... [Pg.45]

Research. Baltimore International Technology Research Institute, 2002 Also available online at http //wtec.org/loyola/te/final/te final.pdf. Newton, David E. Recent Advances and Issues in Molecular Nanotechnology. [Pg.202]

As an example of how far technology has come, molecular electronics is discussed in the Emerging Research Devices section of the most recent International Technology Roadmap for Semiconductors [5] and new molecular wires are a large part of the emerging technology. [Pg.10]

Palma T, Riley M, Capel JE (1996) Development and evaluation of enhancements to the Hazardous Air Pollutant Exposure Model (HAPEM-MS3). Cary, NC, International Technology Corporation. [Pg.287]

The microelectronics industry is continuously reducing the feature size of integrated circuits. In 2006, a DRAM halfpitch, i.e. line widths of 70 nm will be put into practice, until 2010 a reduction to 45 nm is laid down in the International Technology Roadmap for Semiconductors [1]. An integrated circuit consists of a series of patterned functional layers (insulators, metal wires). The structure of each layer is transferred from a mask via a photolithographic process followed by etching or ion implantation. These manufacturing processes must be able to produce the required feature sizes. [Pg.82]


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See also in sourсe #XX -- [ Pg.215 ]




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