International Technology Roadmap for

Fig. 2.1 International Technology Roadmap for Semiconductors (ITRS). Reprinted from Prasher et al. (2005) with permission...

According to the international technology roadmap for semiconductors, chips with a wafer diameter of450 mm and a feature size of 0.05 /xm by 2011 will serve to decrease manufacturing costs [29]. In the integrated circuit (IC) manufacture process as shown in Fig. 21 [30], dielectric stacks have been formed by the ion etching on the coating of dielectric material formed on the silicon surface (Fig. 21 (a)). 

ITRS-2007, International Technology Roadmap for Semiconductors (2007) version (http //www.itrs.net/reports) section on emerging research materials (sub-22 nm)... 

International Technology Roadmap for Semiconductors. 2005 Edition. Accessed http //www.itrs.net/. 

FIGURE 3.1 The SIA Roadmap provides direction to corporate semiconductor research laboratories (Semiconductor Industry Association, The International Technology Roadmap for Semiconductors, 1999 ed International SEMATECH, Austin, TX.)... 

As an example of how far technology has come, molecular electronics is discussed in the Emerging Research Devices section of the most recent International Technology Roadmap for Semiconductors [5] and new molecular wires are a large part of the emerging technology. 

The microelectronics industry is continuously reducing the feature size of integrated circuits. In 2006, a DRAM halfpitch, i.e. line widths of 70 nm will be put into practice, until 2010 a reduction to 45 nm is laid down in the International Technology Roadmap for Semiconductors [1]. An integrated circuit consists of a series of patterned functional layers (insulators, metal wires). The structure of each layer is transferred from a mask via a photolithographic process followed by etching or ion implantation. These manufacturing processes must be able to produce the required feature sizes. 

Semiconductor Res. Corp., International Technology Roadmap for Semiconductors 1999 Edition. 

Fukuda T, Shimizu Y, Yoshise M, Hashimoto M, Kumagai T. Proceedings of the Third International Symposium on Advanced Science and Technology of Silicon Materials. The Japan Society for the Promotion of Science 2000. p 382. ITRS (International Technology Roadmap for Semiconductors) 2005. 

The International Technology Roadmap for Semiconductors. 2005. p 63-64. Prepared and published by the International Roadmap Committee, Semiconductor Association, can be found online at http //www.itrs.net/Links/2005ITRS/ Home2005.htm. 

The expected future impact of multiscale simulation in the semiconductor industry is suggested by some of the issues associated with the most difficult challenges in modeling and simulation, as stated in the International Technology Roadmap for Semiconductors (Table 121 of [38]) ... 

The most important requirement for future dielectric material is low dielectric constant. However, this is hardly the main requirement. Researchers have routinely shown films with k-values lower than 2.0 but these are not feasible from the point of view of manufacturing. The International Technology Roadmap for Semiconductors, which assessed the overall technology requirements for future microelectronic devices, has projected that no manufacturable dielectric with k < 2.4 will be found until 2007. The main challenge lies in the integration of these films, which undergo harsh conditions in IC fabrication. Table 1 enumerates important properties of candidate materials. The candidate material should not only satisfy these requirements, but also must have versatility and extendability for a future generation of nodes to be cost-effective. " ... 

The significance of the challenges for CMP is directly related to the ability of the industry to continue the progress of shrinking the 1C device dimensions. Perhaps the best identification of these challenges and the industry s current abilities come to us in the form of an international assessment project called the ITRS (International Technology Roadmap for Semiconductors). Observation of the road map s challenges is an excellent way to identify the critical role that CMP plays in the health and future viability of the semiconductor industry. 

International Technology Roadmap for Semiconductors ISS Korea 2002, March 22, T. Fukushima... 

Fig. 15.17. The number of implant steps per wafer as a function of technology node (as defined by the International Technology Roadmap for Semiconductors)...

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