DuPont Kapton® polyimide

DuPont Kapton Polyimide Film, DuPont DeNemours Literature. 

DuPont Pyralux coverlay act as polymer foil. The composites are made of DuPont Kapton polyimide film, coated on one side with a proprietary B-staged modified acrylic adhesive. 

Toray-DuPont Product Bulletin for Kapton polyimide film. 

Since the commercialization of Kapton polyimide film by DuPont, more than 30 years ago, a great number of polyimides have been described covering a very... 

The following commercial polymeric substrates have been investigated low density polyethylene (PE, Dow Chemical Canada Inc.) polyimide (PI, DuPont Kapton H), polytetrafluoroethylene (PTFE, DuPont Teflon), polycarbonate (PC, Mobay Corp.) and surface-lubricated (with glycerol ester) polyvinylchloride (FVC, Canadian Occidental Petroleum Ltd). After plasma treatment, the samples were exposed to ambient atmosphere for 10 - 30 minutes while being transferred to the following... 

Kapton Polyimide Film" Summary of Properties, DuPont Technical Bulletin, E-50533 (1982). 

Polyimides for microelectronics use are of two basic types. The most commonly used commercial materials (for example, from Dupont and Hitachi) are condensation polyimides, formed from imidization of a spin-cast film of soluble polyamic acid precursor to create an intractable solid film. Fully imidized thermoplastic polyimides are also available for use as adhesives (for example, the LARC-TPI material), and when thermally or photo-crosslink able, also as passivants and interlevel insulators, and as matrix resins for fiber-reinforced-composites, such as in circuit boards. Flexible circuits are made from Kapton polyimide film laminated with copper. The diversity of materials is very large readers seeking additional information are referred to the cited review articles [1-3,6] and to the proceedings of the two International Conferences on Polyimides [4,5]. 

The initial applications of polyimldes were as varnishes and overcoat enamels as wire Insulation. Polyimldes provided significant Improvement in high temperature cut through resistance as well as excellent dielectric properties. They continue In use today both as homopolymers and copolymers with amides and ester moieties. Paralleling this technology was the development by duPont of Kapton polyimide film. Kapton enjoys a strong position as a class 22 f organic film. These applications represent the major portion of polyimide consumption. 

Kapton Polyimide film, DuPont Kel-F Monochlorotrifluoroethylene, DuPont... 

Polyimides are made similarly from diamines and dianhydrides. Dupont s Kapton polyimide was the first commercially significant polyimide. It is made from pyromellitic dianhydride and oxydianiline. Kapton has good heat and strength properties and is used for specialty applications including space applications. It is used in electronics and in both film and tape applications. 

Only one type of electrical grade polyimide is available in film form and this is manufactured by DuPont under the trade name Kapton . Kapton polyimide is formed by the polycondensation of pyromellitic dianhydride and 4,4 -diamino diphenylether. The reaction proceeds via the intermediate formation of the polyamic acid as described in Section... 

Specialty polymers Aerospace composites Primaset BADCY, PT-resins Matrimid Kapton Avimid 2,2-Bis(4-cyanatophenyl) propane and oligomers, Novolac cyanates Nonmelting polyimides Lonza, Switzerland Ffuntsman, USA DuPont, USA Mitsui, Japan... 

Aromatic polyimides have excellent thermal stability in addition to their good electrical properties, light weight, flexibility, and easy processability. The first aromatic polyimide film (Kapton, produced by DuPont) was commercialized in the 1960s and has been developed for various aerospace applications. The structure of a typical polyimide PMDA/ODA prepared from pyromellitic dianhydride (PMDA) and 4,4 -oxydianiline (ODA), which has the same structure as Kapton, is shown in (1). Aromatic polyimides have excellent thermal stability because they consist of aromatic and imide rings. 

Table 15.2 shows the characteristics of the high-fluorine-content 6FDA/TFDB polyimide and KAPTON (nonfluorinated PMDA/ODA type polyimide, DuPont). The Tg of 6FDA/TFDB (335°C) is a little lower than that of PMDA/ODA because of its flexible -C(CF3)2- groups. However, 6FDA/TFDB has a high decomposition temperature of 569°C. 

Laminates have been extensively studied by PA-FTIR and are the subject of extensive investigations by the new much more complex step-scan PA-FTIR techniques. Kapton film is often used to illustrate the analysis of this type of sample. Kapton 200FN919 film is a DuPont product which consists of a 25 pm layer of polyimide laminated between 12.7 pm layers of Teflon. If a high mirror velocity is used then a spectrum of only the Teflon layer is obtained. On the other hand if a slow mirror velocity is used a composite spectrum of the Teflon and polyimide layer is obtained. The difference spectrum (low mirror velocity spectrum minus high mirror velocity spectrum) represents that of the polyimide layer. As illustrated in Figure 2.16 the difference spectrum closely resembles the PA FTIR spectrum of polyimide except for the regions where the strong C-F bands of the Teflon are present. 

The chemical and physical properties of each of these window materials vary widely. For example, polyimide is flexible, semitransparent, and chemically inert, but it has an upper working temperature of 673 K (for information about the properties of Kapton see http //www2.dupont. com/Kapton/en US / assets / downloads / pdf/ summaryofprop.pdf). Beryllium is stiff, has a low density, high thermal conductivity, and a moderate coefficient of thermal expansion it can be machined and is very stable mechanically and thermally. It also retains useful properties at both elevated and cryogenic temperatures. However, it does require a few safety-related handling requirements that are well documented (for detailed environmental safety and health information about beryllium see http //www.brushwellman.com). Nonetheless, as is stated in the Brush Wellman literature (for detailed environmental safety and health information about beryllium see http //www.brushwellman.com), "handling beryllium in solid form poses no special health risk."... 

Materials. Biaxially oriented polypropylene (PP) films of 50 um thickness were obtained from 3M and have been described (2). PMDA-ODA (PI) was Kapton H polyimide from Dupont. Copper-plated PTFE films were obtained from Spire Corporation (Bedford, MA). They were prepared using the Ion Beam Enhanced Deposition (IBED) process in which a 100 nm thick Cu film was vapor-deposited onto a PTFE substrate in the presence of a beam of 400 eV Ar+ ions of 25 uA/cm2 (IQ). Shortly before SIMS analysis, the Cu film was removed slowly by peeling at 90° in ambient conditions. Metal-coated PI films were prepared by sputtering 50 nm Cr and 1 um Cu onto a 50 um thick Kapton film on both sides. Thermal annealing was performed in a vacuum chamber at 2xl0 6 torr using a quartz lamp as the heating source. The samples were held for 15 min at the desired temperature and then cooled down to ambient temperature inside the chamber for about 2 hours. Just prior to SIMS analysis, the metal films were peeled slowly at 90° and then immediately introduced into the vacuum chamber of the instrument. 

Starting materials and solvents were purchased from Aldrich Chemical Co. acetonitrile (ACN), N,N-dimethylformamide (DMF), and N-methyl-2-pyrrolidone (NMP) were obtained anhydrous in Sure/Seal bottles and used as received. The polyamic acid of PMDA-ODA (2545 Pyralin) was supplied by DuPont. The soluble polyimide XU-218, derived from 3,3, 4,4 -benzophenone tetracarboxylic dianhydride (BTDA) and diamino-1,1,3-trimethyl-3-phenylindan isomers (DAPI) was purchased from Ciba-Geigy Corp. The acetylene terminated imide oligomer powder (Thermid MC-600) derived from BTDA, aminophenylacetylene, and 1,3-bis (2-aminophenoxy) benzene (APB) was obtained from National Starch and Chemical Company. Kapton Type II (PMDA-ODA) films were obtained from DuPont Co., Apical polyimide films were obtained from Allied Corp., and Upilex Type-S and Type-R polyimide films derived from 3,3, 4,4 -biphenyl tetracarboxylic dianhydride (BPDA) plus p-phenylenediamine (PDA) and ODA, respectively were obtained from ICI Americas Inc. 

Samples of polyamic acid were obtained commercially (DuPont) as concentrated solutions or were synthesized in this laboratory in N-methylpyrrolidone (NMP), with the polymerization solutions stored under argon until use (7). All dilute solutions were prepared by dilution from the concentrated solution with distilled NMP. Cured polyimide samples were either commercially available films (Kapton), or were cured in this laboratory from either commercial or laboratory synthesized polyamic acids, using a thermal or a combination chemical/thermal cure. Solvents used were all reagent grade, and at times were redistilled before use. 

Kapton . [DuPont] Polyimide film, unreinforced or Teflon, carbon-filled heat seal ai lics. low dielec, film for military applies. 

Type R and B fiber trademark of Thermo Electric s Thermoplastic Elastomer and Polyimide fiber, respectively. b Nylon, Teflon, and Kapton are trademarks of the E. I. duPont Co. 

In tape-automated bonding (TAB), the semiconductor die, fabricated with bumped interconnect pads, are positioned in apertures of a polymer-film tape, generally polyimide (Kapton , a registered trademark of DuPont), then gang-bonded to cantilevered beams that are formed by photodelineated metal pads on the tape. The tape (film) has sprocket holes along its sides similar to movie film and, like movie film, is handled on reels in automatic equipment for high-speed assembly. ... 

Kapton DuPont s trade name for its fanuly of polyimide plastic films. 

---