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Thermoplastic imide

Polyimides for microelectronics use are of two basic types. The most commonly used commercial materials (for example, from Dupont and Hitachi) are condensation polyimides, formed from imidization of a spin-cast film of soluble polyamic acid precursor to create an intractable solid film. Fully imidized thermoplastic polyimides are also available for use as adhesives (for example, the LARC-TPI material), and when thermally or photo-crosslink able, also as passivants and interlevel insulators, and as matrix resins for fiber-reinforced-composites, such as in circuit boards. Flexible circuits are made from Kapton polyimide film laminated with copper. The diversity of materials is very large readers seeking additional information are referred to the cited review articles [1-3,6] and to the proceedings of the two International Conferences on Polyimides [4,5]. [Pg.428]

Regnlus. [Advanced Web Prods.] Poly-imide thermoplastic film heat-resistant film for wire and cable, thermoplastic composites, pressure-sensitive adhesive Ugrra, primary insulation. [Pg.310]

Ultem (Series) Poly(imide), thermoplastic General Electric... [Pg.296]

Three fully imidized thermoplastic aromatic polyimides are available today. Two, Upjohn s polyimide 2080 and... [Pg.324]

In fully imidized thermoplastic polyimides, the material is fully imidized before final processing. By its very nature, a fully imidized thermoplastic, i.e., CIBA-GEIGY s XU 218 and Upjohn s Polyimide 2080, remain soluble and fusible. As such, fully imidized thermoplastic polyimides can be molded into final parts without undergoing any further chemical reaction. Some thermal stability is, however, sacrified. [Pg.326]

M.B. Saeed, Mao-Sheng Zhan (2007) Adhesive strength of partially imidized thermoplastic polyimide films in bonded joints. International Journal of Adhesion Adhesives. 27 9-19. [Pg.83]

High temperature epoxies. Polybenzimidazole oligomers. Polyimide oligomers. Specimens bonded in vacuum bags (625 mm Hg) placed in autociave at the indicated pressure. Polyamic acid. Polyphenylquinoxaline. Poly(ether-imide). Thermoplastic polyimide. Epoxy-BMI. [Pg.218]

LARC-TPI is a linear thermoplastic PI which can be processed ia the imide form to produce large-area, void-free adhesive bonds. Mitsui Toatsu Chemicals, Inc., has obtained Hcense to produce this product commercially for appHcations such as adhesives, films, mol ding compounds, etc. These are thermooxidatively stable and show essentially no loss ia weight at 300°C ia air. Weight loss does not exceed 2—3% after isothermal aging ia air at 300°C for 550 h. [Pg.533]

Polyether Imides. Polyether imides (PEIs) are amorphous, high performance thermoplastic polymers that have been in use since 1982. The first commercial polyether imides were the Ultem series developed by the General Electric Co. The first, Ultem 1000 [61128-24-3] is prepared from phthahc anhydride, bisphenol A, and meta-phenylenediamine and has the following stmcture ... [Pg.39]

Imide-based polymers are another class of amorphous thermoplastics. [Pg.190]

Polydithiazoles Polyoxadiazoles Polyamidines Pyrolyzed polyacrylonitrile Polyvinyl isocyanate ladder polymer Polyamide-imide Polysulfone Decompose at 525°C (977°F) soluble in concentrated sulfuric acid. Decompose at 450-500°C (842-932°F) can be made into fiber or film. Stable to oxidation up to 500°C (932°F) can make flexible elastomer. Stable above 900°C (1625°F) fiber resists abrasion with low tenacity. Soluble polymer that decomposes at 385°C (725°F) prepolymer melts above 405° C (76l.°F). Service temperatures up to 288° C (550°F) amenable to fabrication. Thermoplastic use temperature —102°C (—152°F) to greater than 150° C (302°F) acid and base resistant. [Pg.320]

Kricheldorf H.R., Wollheim T., Koning C.E., Werumeus B.H.G., and Altstadt V. Thermoplastic elastomers 1. Poly(ether-ester-imide)s based on 1,4-diaminobutane, trimeUitic anhydride, 1,4-dihydroxybutane and poly(tetramethylene oxide) diols, Polymer, 42, 6699, 2001. [Pg.155]

Thermoplastics for aircraft interiors have been evaluated by this technique (10b) in accordance with the FAA specification (peak rate of heat release of 65 kilowatts per meter squared (Kw/m 2) or less). In these tests (10b) Polyether sulfone demonstrated marginal compliance. For Polyether imide (PHI) and PEI/Polydimethyl siloxane copolymers peak heat-release rates were well below the specified value. The overall trend suggested a possible correlation of peak heat release values with aromatic carbon content in the polymers evaluated. [Pg.244]

PMMA is handicapped by a low impact resistance, limited heat behaviour (except for the acrylic imides), inherent flammability, sensitivity to environmental stress cracking in the presence of certain chemicals, chemical attack by certain current solvents. For some grades, processing can be more difficult than for some other current thermoplastics. [Pg.427]

Polyamide-imide is an amorphous thermoplastic having the formula shown in Figure 4.112. [Pg.575]

Speciality thermoplastics polysulfone (PSU), PPS, fluoroplastics, PEEK, PEI, polyamide imide (PAI), liquid crystal polymers (LCP). [Pg.775]

Mitsui Chemicals is launching a new grade of carbon nanotube reinforced thermoplastic poly-imide, Aurum CNT, with supplementary specific properties such as dust reduction and antistatic behaviour. Targeted applications are, for example, processing jigs for semiconductor or hard disk manufacturing, and parts for hard disk drives. [Pg.839]

A series of solid-state reactions has been explored by Kaupp et al., in which gaseous amines were reacted with aldehydes to give imines. Analogous reactions with solid anhydrides, imides, lactones or carbonates, and isothiocyanates were used to give, respectively, diamides or amidic carboxylic salts or imides, diamides, carbamic acids, and thioureas [24]. In general the yields were found to be quantitative. Ammonia and other gaseous amines, in particular methyl-amine, have also been shown to aminolyse thermoplastic polycarbonates [25]. [Pg.76]

Amorphous polymers are characterized by the following properties They are transparent and very often soluble in common organic solvents at room temperature. The following amorphous polymers have gained industrial importance as thermoplastic materials polyfvinyl chloride), polystyrene, polyfmethyl methacrylate), ABS-polymers, polycarbonate, cycloolefine copolymers, polysulfone, poly( ether sulfone), polyfether imide). [Pg.24]

Among these methods, incorporation of thermoplastics has been highlighted as a new approach to enhance the toughness of thermosets without significantly lowering the desirable properties. Rigid thermoplastics with high Tg, such as polyethersulfone [11-16], polyether-imide [17-19], and polysulfone [20-23], were frequently used in this approach. [Pg.109]

Matrix materials for commercial composites are mainly liquid thermosetting resins such as polyesters, vinyl esters, epoxy resins, and bismaleimide resins. Thermoplastic composites are made from polyamides, polyether ether ketone (PEEK), polyphenylene sulfide (PPS), polysulfone, polyetherim-ide (PEI), and polyamide-imide (PAI). [Pg.207]


See other pages where Thermoplastic imide is mentioned: [Pg.231]    [Pg.271]    [Pg.511]    [Pg.568]    [Pg.170]    [Pg.200]    [Pg.365]    [Pg.2079]    [Pg.290]    [Pg.231]    [Pg.271]    [Pg.511]    [Pg.568]    [Pg.170]    [Pg.200]    [Pg.365]    [Pg.2079]    [Pg.290]    [Pg.728]    [Pg.251]    [Pg.39]    [Pg.39]    [Pg.516]    [Pg.589]    [Pg.341]    [Pg.34]    [Pg.408]    [Pg.460]    [Pg.193]    [Pg.272]    [Pg.165]    [Pg.426]    [Pg.65]    [Pg.82]    [Pg.83]    [Pg.158]   
See also in sourсe #XX -- [ Pg.67 , Pg.77 ]




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Blends with Thermoplastic Imides

Thermoplastic imide structure

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