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Deposition surface

MetallorganicMBE (MOMBE). tire solid source Knudsen cells in conventional MBE are replaced witli gaseous beams of organometallic precursors, directed toward a heated substrate in UHV. Compared to MOCVD, MOMBE eliminates gas phase reactions tliat may complicate tire deposition surface reactions, and provides lower growtli temperatures. [Pg.2929]

Other routes to reachieving filament separation have been described and rely on mechanical or aerodynamic forces to affect separation. Figure 4 illustrates one method which utilizes a rotating deflector plane to force the filaments apart while depositing the opened filaments ia overlapping loops (25). After the splayed filaments fall to the deposition surface or forming screen, a suction from below the disposition surface holds the fiber mass in place. [Pg.165]

Electroless Electrolytic Plating. In electroless or autocatalytic plating, no external voltage/current source is required (21). The voltage/current is suppHed by the chemical reduction of an agent at the deposit surface. The reduction reaction must be catalyzed, and often boron or phosphoms is used as the catalyst. Materials that are commonly deposited by electroless plating (qv) are Ni, Cu, Au, Pd, Pt, Ag, Co, and Ni—Fe (permalloy). In order to initiate the electroless deposition process, a catalyst must be present on the surface. A common catalyst for electroless nickel is tin. Often an accelerator is needed to remove the protective coat on the catalysis and start the reaction. [Pg.528]

We have so far assumed that the atoms deposited from the vapor phase or from dilute solution strike randomly and balHstically on the crystal surface. However, the material to be crystallized would normally be transported through another medium. Even if this is achieved by hydrodynamic convection, it must nevertheless overcome the last displacement for incorporation by a random diffusion process. Therefore, diffusion of material (as well as of heat) is the most important transport mechanism during crystal growth. An exception, to some extent, is molecular beam epitaxy (MBE) (see [3,12-14] and [15-19]) where the atoms may arrive non-thermalized at supersonic speeds on the crystal surface. But again, after their deposition, surface diffusion then comes into play. [Pg.880]

Use and care of electrodes. Electrodes must be free from grease, otherwise an adherent deposit may not be obtained. For this reason an electrode should never be touched on the deposition surface with the fingers it should always be handled by the platinum connecting wire attached to the electrode. Platinum electrodes are easily rendered grease-free by heating them to redness in a flame. [Pg.512]

As shown above, a thermodynamic analysis indicates what to expect from the reactants as they reach the deposition surface at a given temperature. The question now is, how do these reactants reach that deposition surface In other words, what is the mass-transport mechanism The answer to this question is important since the phenomena involved determines the reaction rate and the design and optimization of the CVD reactor. [Pg.44]

In the case of laminar flow, the velocity of the gas at the deposition surface (the inner wall of the tube) is zero. The boundary is that region in which the flow velocity changes from zero at the wall to essentially that of the bulk gas away from the wall. This boundary layer starts at the inlet of the tube and increases in thickness until the flow becomes stabilized as shown in Fig. 2.4b. The reactant gases flowing above the boundary layer have to diffuse through this layer to reach the deposition surface as is shown in Fig. 2.3. [Pg.47]

In the case of control by surface reaction kinetics, the rate is dependent on the amount of reactant gases available. As an example, one can visualize a CVD system where the temperature and the pressure are low. This means that the reaction occurs slowly because of the low temperature and there is a surplus of reactants at the surface since, because of the low pressure, the boundary layer is thin, the diffusion coefficients are large, and the reactants reach the deposition surface with ease as shown in Fig. 2.8a. [Pg.51]

Pressure is similar to temperature as a rate limiting factor since the diffusibility of a gas is inversely related to its pressure. For instance, loweringthe pressure 760 Torr(l atm)to 1 Torr increases the gas-phase transfer of reactants to the deposition surface and the... [Pg.53]

CVD graphite can have several structural forms columnar, laminar, or isotropic. The columnar form is shown in Fig. 7.2. The crystallites are deposited with the basal planes (ab directions) essentially parallel to the deposition surface. Their structure tends to be columnar (cone-like) as a result of uninterrupted grain growth toward the reactant source. [Pg.189]

The sudden expansion of the gases, as they are heated in the arc plasma, causes the formation of a high-speed arc jet so that the atomic hydrogen and the reactive carbon species are transported almost instantly to the deposition surface and the chances of hydrogen recombination and of vapor-phase reactions are minimized. [Pg.202]

Processing. The process requires a monofilament carbon-fiber core which is heated resistively in a tubular glass reactor shown schematically in Fig. 19.1. PI A carbon monofilament is pre-coated with a 1 pm layer of pyrolytic graphite to insure a smooth deposition surface and a constant resistivity. 1 1 SiC is then deposited by the reaction of silane and a hydrocarbon. Other precursors such as SiCl4, and CH3SiCl3 are also being investigated. A fiber cross-section is shown in Fig. 19.2.P1... [Pg.470]

No slip Is used as the velocity boundary conditions at all walls. Actually there Is a finite normal velocity at the deposition surface, but It Is Insignificant In the case of dilute reactants. The Inlet flow Is assumed to be Polseullle flow while zero stresses are specified at the reactor exit. The boundary conditions for the temperature play a central role in CVD reactor behavior. Here we employ Idealized boundary conditions In the absence of detailed heat transfer modelling of an actual reactor. Two wall conditions will be considered (1) adiabatic side walls, l.e. dT/dn = 0, and (11) fixed side wall temperatures corresponding to cooled reactor walls. For the reactive species, no net normal flux Is specified on nonreacting surfaces. At substrate surface, the flux of the Tth species equals the rate of reaction of 1 In n surface reactions, l.e. [Pg.357]

A vertical CVD reactor (cf. Figure lb) consists of an axlsymmetrlc enclosure with the deposition surface perpendicular to the Incoming gas stream. The reactant gases are typically Introduced at the top and fiow down towards the heated susceptor. Thus, the least dense gas Is closest to the growth Interface which destabilizes the fiow. The result Is recirculation cells which Introduce not only film thickness and composition variations but also broaden Junctions between layers. This Is particularly of... [Pg.362]

Surface water information, including drainage patterns (overland flow, topography, channel flow pattern, tributary relationships, soil erosion, and sediment transport and deposition), surface water bodies (flow, stream widths and depths, channel elevations, flooding tendencies, and physical dimensions of surface water impoundments structures surface water/ groundwater relationships), and surface water quality (pH, temperature, total suspended solid, salinity, and specific contaminant concentrations)... [Pg.601]

In concentrated solutions, codeposition of the additive cannot compete with the rate of copper deposition. Surface roughness does develop, although apparently at a lower rate than without the additive (I9a, I9b). [Pg.249]

Reg soils are closely associated with desertic regions. They have developed on stable surfaces where coarse, gravelly desert alluvium is exposed, and are characterized by a well-developed desert pavement and exhibit some well-defined soil horizons. They occur mostly on depositional surfaces where stones and gravels have been deposited since Neogene times. The surfaces commonly consist of stony, unconsolidated sedimentary deposits in which limestone, dolomite, chalk, flint and marl predominate, together with some fines (silt and clay). Sandstone and granite debris have also been reported to contribute to Reg formation. Less frequently, they form on sedimentary bedrock (Fig. 1.5). [Pg.26]

Porstendorfer, 1984). Knutson et al. (1983) measured similar results in their chamber investigation. The results show that the values of the deposition velocity of the free radon daughters are about 100 times those of the aerosol radon progeny. But there are no information about the effective deposition surface S of a furnished room for the calculation of the plateout rates qf and qa by means of Vg and Vg. For this reason the direct measurements of the plateout rates in rooms are necessary. Only Israeli (1983) determined the plateout rates in houses with values between qf = 3-12 h"1 and qa = 0.4-2.0 h"1, which give only a low value of the... [Pg.289]

On the submicron scale, the current distribution is determined by the diffusive transport of metal ion and additives under the influence of local conditions at the interface. Transport of additives in solution may be non-locally controlled if they are consumed at a mass-transfer limited rate at the deposit surface. The diffusion of additives in solution must then be solved simultaneously with the flux of reactive ion. Diffusive transport of inhibitors forms the basis for leveling [144-147] where a diffusion-limited inhibitor reduces the current density on protrusions. West has treated the theory of filling based on leveling alone [148], In his model, the controlling dimensionless groups are equivalent to and D divided by the trench aspect ratio. They determine the ranges of concentration within which filling can be achieved. [Pg.185]

Since electroless deposition involves complexants, reducing agents, and solution stabilizers, all of which adsorb to some degree or another on the deposit surface, it is unreasonable to not expect incorporation of minute amounts of elements such as C, or S from a S containing additive, in the deposit. [Pg.253]

Often, deposition rates are higher in the full electroless solution compared to those measured at the applied Em value in the reducing agent-free solution. This could indicate that a species related to the adsorbed reducing agent facilitates electron transfer at the deposit surface in the same manner as ions such as halides in metal electrodeposition. The action of certain additives, namely exaltants, which appear... [Pg.269]

Two forms of carbon (carbidic and graphitic) have been observed by x-ray photoelectron spectroscopy (XPS) on polycrystalline cobalt foil during the disproportionation of CO by Nakamura et al.57 The dissociation of adsorbed CO occurred at temperatures higher than 60°C, and carbidic carbon and adsorbed oxygen were formed on the cobalt surface. After the surface is covered with adsorbed carbon and oxygen, no further dissociation of adsorbed CO occurs. Contrary to the dissociation of adsorbed CO, the deposition of carbon by the concerted Boudouard reaction continues on the carbidic carbon-deposited surface. The deposition of carbon increases... [Pg.60]


See other pages where Deposition surface is mentioned: [Pg.445]    [Pg.131]    [Pg.72]    [Pg.29]    [Pg.234]    [Pg.52]    [Pg.64]    [Pg.200]    [Pg.144]    [Pg.220]    [Pg.371]    [Pg.172]    [Pg.244]    [Pg.544]    [Pg.477]    [Pg.241]    [Pg.5]    [Pg.32]    [Pg.173]    [Pg.186]    [Pg.301]    [Pg.356]    [Pg.344]    [Pg.571]    [Pg.8]    [Pg.16]    [Pg.193]    [Pg.391]   
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Alloy deposition surface concentrations

Carbonaceous deposits cleaning from surfaces

Chemical deposition, superhydrophobic surfaces

Chemical solution deposition substrate surface preparation

Chemical vapor deposition polymeric surfaces

Chemical vapor deposition surface reaction control

Copper single-crystal surfaces, underpotential deposition

Deposit Morphology and Surface Analysis

Deposition at Quasi-Continuous Surfaces

Deposition at Random Site Surfaces

Deposition cold surface

Deposition of Colloid Particles at Heterogeneous Surfaces

Deposition of Particles on Surfaces

Deposition of decay products on surfaces

Deposition of radioiodine to surfaces

Deposition on surfaces

Deposition on uniformly flat surfaces

Deposition processes surface reaction control

Deposition to surfaces

Deposition velocities surfaces

Deposition, surface, dynamic

Deposition, surface, dynamic processes

Deposits on the Catalyst Surface

Deposits oxalate surface

Diffusion vs. Surface Controlled Deposition

Effect of surface deposits

Electrocatalytic Activity of Semiconductor Electrodes Modified by Surface-Deposited Metal Nanophase

Electrochemical metal deposition bimetallic surfaces

Electroless deposition noncatalytic surfaces, activation

Electroless deposition surface characterization

Electrophoretic deposition surface charge

Exploiting Surface Chemistry to Prepare Metal-Supported Catalysts by Organometallic Chemical Vapor Deposition

Film deposition, immobilization surfaces

Leaf surface deposition

Metal deposition, electrode surface

Metal deposits surface contamination

Nanostructured Polymer Surfaces by Vapor Deposition Methods

Noncatalytic surfaces, electroless deposition

Noncatalytic surfaces, electroless deposition photochemical activation

Organic Molecular Beam Deposition of Pentacene on Clean Metal Surfaces

Particle Deposition at Surface Features

Plasma deposition polymerization, surface

Plasma deposition polymerization, surface materials

Plasma deposition technique, surface

Plasma deposition, surface modification

Preparation and Deposition of Particles on Surface

Preparing and Depositing Particles on a Surface

Prevention of particle deposition on bubble surface at angles

Processes for Thin-Film Deposition and Surface Modification

Protein deposition, material surfaces

Radical-surface interactions deposition

Silicon oxide deposition, surface imaging

Silicon oxide deposition, surface imaging resists

Sonochemical Deposition of Nanoparticles on Spherical and Flat Surfaces

Surface Concentration of Depositing Ions in the Periodic Conditions

Surface Deposition Crosslinking

Surface decontamination coating deposited

Surface decontamination deposition using

Surface deposition mode

Surface deposition, dynamical

Surface deposition, dynamical processes

Surface deposition, importance

Surface deposits, identification

Surface energy deposition

Surface formation foreign materials deposition

Surface galvanostatic hydrogen deposition

Surface layers preparation deposition

Surface layers preparation liquid phase deposition, coating

Surface layers preparation physical vapor deposition

Surface migration, high-temperature depositions

Surface sol-gel deposition

Surface speciation/structure of the deposited precursor species

Surface waters acid deposition

Surface-controlled deposition

Surface-deposited products

Surface-deposition, controlled kinetic

Surface-diffusion-mediated deposition

Surface-enhanced Raman direct deposition

Surface-initiated vapor deposition

Surface-initiated vapor deposition polymerization

Surrogate surfaces deposition

Synthesis and Deposition of ICPs onto Electrode Surfaces

Synthesis of metal nanoparticles (Au, Ag, Pt, Cu) on semiconductor surface by photostimulated deposition from solution

Temperature-programmed surface carbon deposits

Vapor-deposited gold surfaces

Vapor-surface sol -gel deposition

Vycor surfaces, coke deposition

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