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Electrochemical metal deposition bimetallic surfaces

From catalytic aspects latter structure seems to be more favourable. In this paper, through the example of Pd+Cu catalysts, we wish to present methods by which bulk metal deposition can be avoided, and bimetallic catalysts with well-designed uniform surface structure can be attained. The surface structure of bimetallic catalysts has been studied by an electrochemical polarization (EP) method and catalytic properties were analyzed by selective reduction of 4-chloronitrobenzene (CNB). [Pg.460]

In summary, the preparation of bimetallic catalysts by surface redox reaction using a reductant preadsorbed on the parent monometallic catalyst has been studied in detail. Unfortunately, the method is intricate and time consuming, especially if several successive operations are required. Furthermore, when the modifier has a standard electrochemical potential higher than that of the parent metal (AUCI4 deposited on Pt°), the overall reaction is a complex one involving a reduction by adsorbed reductant but also direct oxidation of the metallic parent catalyst. The relative rate of the two parallel reactions determines the catalytic properties of the resulting bimetallic catalyst. [Pg.223]


See other pages where Electrochemical metal deposition bimetallic surfaces is mentioned: [Pg.288]    [Pg.57]    [Pg.112]    [Pg.112]    [Pg.5]    [Pg.861]    [Pg.247]    [Pg.806]    [Pg.328]    [Pg.83]    [Pg.72]    [Pg.109]    [Pg.661]    [Pg.29]    [Pg.777]    [Pg.33]   


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Deposition surface

Electrochemical deposition

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Electrochemical metallization

Electrochemical surface

Metal bimetallic

Metal deposition

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