Coating methods sputtering

In all vacuum coating methods layers are formed by deposition of material from the gas phase. The coating material may be formed by physical processes such as evaporation and sputtering, or by chemical reaction. Therefore, a distinction is made between physical and chemical vapor deposition ... 

The theoretical basis for sputtering has been known for a long time but more recently commercial methods have been developed along lines similar to those in vacuum evaporation just described. Essentially, a discharge of argon gas plasma is established between an anode and cathode electrode in this instance, the source material is the cathode, and the work piece the anode. Gas ions charged positively are attracted to the cathode, where they collide with it and remove atoms of the source material—which in turn travel to the anode and form a coating of sputtered material on the work piece. 

The damaged surface of a ceramic after finishing is sometimes healed by coating. Coating methods include (1) sol—gel, (2) laser gazing, (3) chemical vapor deposition (CVD), (4) sputtering, (5) plasma spraying,... 

For forming a protective layer, dependent on the nature of the material, a vacuum vapor deposition method, a sputtering method, a plasma polymerization method, a chemical vapor deposition method or a coating method, can be applied. ... 

Physical vapour deposition (PVD) is a variety of vacuum deposition and is a general term used to describe any of a variety of methods to deposit thin fdms by the condensation of a vapourized form of the desired film material on to various workpiece surfaces (e.g., on to semiconductor wafers). The coating method involves purely physical processes such as high temperature vacuum evaporation with subsequent condensation, or plasma sputter bombardment rather than involving a chemical reaction at the surface to be coated as in chemical vapour deposition. 

There are a variety of other coating methods. Three of these are the electron beam (E beam) technique. Penning sputtering and saddle field ion beam sputtering. The methods require more... 

Another possibility of ceramic material application is the use of coatings and foams inside, for example, metallic microstructure devices. Here, well-known technologies such as CVD processes, sputtering, electrophoretic deposition, sol-gel methods in combination with spin coating, dip coating, or wash coating methods, or the use of anodic oxidation for aluminum-based devices will lead to either dense, protective ceramic coatings or porous layers used as catalyst support. 

Coating methods are electrodeposition, electroplating, physical vapor deposition (PVD), chemical vapor deposition, sputtering, spraying, and nitriding. 

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