Coating deposition magnetron sputtering

Fig. 19 —Cross-sectional morphologies of (a) TiN coating with hardness of 26 GPa, and (b) TiN/Si3N4 coating with optimum Si content of 10.8 at. % and hardness of 47.1 GPa deposited by reactive magnetron sputtering.

Fig. 22—Friction coefficients between WC ball and TiN/Si3N4 nanocomposite coatings as function of the Si content. The coatings were deposited by reactive magnetron sputtering. The friction coefficients of the TiN/Si3N4 coatings were obtained under the load of 20 N. In the case of the TiN coating and the Si3N4 coating, the load is 5 N, because the two coatings will fail and peel off from the substrate under the load of 20 N.

Fig. 23—The cutting life of the uncoated drill and the drills deposited with TiN coating and TiN/Si3N4 nanocomposite coatings drilling holes on quenched AISI 420 stainless steel. The coatings were deposited by reactive magnetron sputtering.

Monaghan, D. R, Teer, D. G., Laing, K. C., Efeoglu, I., and Ar-nell, R. D., Deposition of Graded Alloy Nitride Films by Closed Field Unbalanced Magnetron Sputtering," Surf. Coat. Technol., Vol. 5 9,1993, pp. 21 -25. 

This chapter examines the deposition of fluorinated polymers using plasma-assisted physical vapor deposition. Ultrathin coatings, between 20 and 5000 nm have been produced, using RF magnetron sputtering. The method of coating, fabrication, and deposition conditions are described. 

Wan, C. H., Lin, M. T., Zhuang, Q. H., and Lin, C. H. Preparation and performance of novel MEA with multicatalyst layer structure for PEFC by magnetron sputter deposition technique. Surface and Coatings Technology 2006 201 214-222. 

In general, the speed at which transfer and deposition take place is low, but it may be improved by magnetron sputtering, of which the types available include planar, closed field, hollow cathode, and post cathode—all giving coatings with good geometrical array. 

A crucial parameter for the productivity of an in-line sputtering system is the cycle time, with the deposition rate of the magnetron sputter process being an important parameter. The film thickness d [nm] at a given substrate transport speed vc [rnrnin can be calculated from the dynamic deposition rate ad[nmmmin 1] which is the film thickness when the substrate speed is lmmin-1. The dynamic rate can be derived from the static rate as [nmmin-1] on assuming the width b [m] of the coating zone. 

Porous structure of the outer support surface has been modified by deposition of the additional layer of metal Ni. Two vacuum condensation techniques have been used for nickel deposition dc ion magnetron sputtering and electron beam evaporation. To produce coatings on tubes additional installation for dc sputtering has been designed. 

Magnetron sputtering, one type of physical vapor deposition (PVD) method, is a powerful and flexible method that can be used to coat virtually any surface with a wide range of materials. It removes atomized materials from a solid by high-energy bombardment of its surface layers with ions or neutral particles. Prior to the... 

Zhang, W. J., Li, Y., Zhu, S. L. and Wang, F. H. (2004). Influence of argon flow rate on Ti02 photocatalyst film deposited by dc reactive magnetron sputtering. Surf. Coat. Technol. 182(2-3), 192-198. 

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