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Chassis wire

Because of the ease with which they can be soldered, electroplated tin—lead coatings of near eutectic composition (62 wt % tin) are extensively used in the electronics industry for coating printed circuit boards and electrical coimectors, lead wires, capacitor and condenser cases, and chassis. [Pg.61]

Electronic connectors may connect internally or externally. Internal connections may be between a component and a printed circuit board or wire (Fig. la) a printed circuit board and a wire or another printed circuit board which is in a chassis (Fig. lb) and between chassis in the same cabinet (Fig. [Pg.23]

Intercormection and packaging allow electronic devices to be usefully incorporated into products. The manufactrrre of complex electronic systems reqtrires that htmdreds of thousands of electronic components be efficiently cormected with one another in an extremely small space. In the past, this was accomplished by hand wiring discrete components on a chassis... [Pg.59]

Example Suppose we measure 2pA going from right to left in one wire. And we measure 5p A going from left to right in the other wire. We don t know the current through the chassis ground (earth). What are the CM and DM components involved ... [Pg.248]

Which would mean that we have a current of 3 tA flowing through earth (chassis ground) connection. And we have 3.5pA flowing in and out of the two wires. [Pg.248]

When the ignition switch is on, a relay turns the inverter on, the relay lead contains a 20 amp in-line fuse. This relay only turns the inverter on and off and has no other function. The inverter is connected to the battery via a positive wire and a negative wire (not the chassis). The inverter is not grounded to the car at any point and instead, is carefully insulated to ensure that accidental grounding never occurs. [Pg.1]

Prior to 1950, these industries were based on vacuum tube technology, and most electronic gear was assembled on metal chassis with mechanical attachment, soldering, and hand wiring. All the components of pretransistor electronic products—vacuum tubes, capacitors, inductors, and resistors— were manufactured by mechanical processes. A rapid evolution occurred after the invention of the transistor and the monolithic integrated circuit. Today s electronic equipment is filled with integrated circuits, interconnection boards, and other devices that are all manufactured by chemical processes. The medium used for the transmission of information and data over dis-... [Pg.374]

Capacitance, stray— is the undesired and unintentional capacitance parts of an experimental setup or instrument, as, e.g., an electrical conducting wire and the chassis. [Pg.68]

Being electronic, the usual remains may be found in the debris resistors, capacitors, relay parts, chassis, etc. In a unit operated by alternating current as shown in figure 37, the power transformer, Tl, may be discernible. These components arc often enclosed in steel cases, and usually have laminated cores of heavy steel. The core, if all the wiring is removed, will look something like this. (Fig. 38)... [Pg.328]

The double bonds in SBR can be cross-linked by vulcanization as described for natural rubber. SBR is used primarily for making tires. Other copolymers are used to make car bumpers, body and chassis parts, wire insulation, sporting goods, sealants, and caulking compounds. [Pg.1093]

N02), a 2 ohm 10 W resistor, five female AC plugs, chassis mount (for the mechanical pumps, diffusion pump heater, CuO tube heater, etc.), five tineon lamps, 125 V, 0.3 W, five SPST 10 A power switches, a fuse holder, an amphenol 5 pin hex chassis mount female connector (to receive male connector with wires from alligator clips attached to leads on Toepler pump), a 6 foot power cord,... [Pg.83]

When the transistor is mounted on the chassis for thermal reasons, there is a technique that is used to actually try and cancel the current injected through the heatsink capacitance. This is done by placing another winding, equivalent to the main winding, and opposite in phase (though it can be of much thinner wire). [Pg.393]

There are two ways of going about this. Either way we are assuming that the mosfet heatsink is tied to the chassis. At one end of the parasitic capacitor Cp we are applying the trapezoid that best describes a typical drain waveform. This causes a CM noise current Icm to flow through the earth wire. We assume that the parasitic capacitances and/or X-caps cause this current to split up equally between the L and N wires. So we have Icm/2 in each of these two wires. [Pg.433]

The use of EPDM rubbers for the manufacture of automobile and truck tires has not been successful, mainly because of poor tire cord adhesion and poor compatibility with most other rubbers. However, EPDM rubbers have become widely accepted as a moderately heat-resisting material with good weathering, oxygen, and ozone resistance. They find extensive use in nontire automobile applications, including body and chassis parts, car bumpers, radiator and heater hoses, weatherstrips, seals, and mats. Other applications include wire and cable insulation, appliance parts, hoses, gaskets and seals, and coated fabrics. [Pg.414]


See other pages where Chassis wire is mentioned: [Pg.283]    [Pg.283]    [Pg.250]    [Pg.66]    [Pg.23]    [Pg.53]    [Pg.255]    [Pg.23]    [Pg.66]    [Pg.413]    [Pg.240]    [Pg.83]    [Pg.157]    [Pg.158]    [Pg.135]    [Pg.335]    [Pg.359]    [Pg.370]    [Pg.383]    [Pg.380]    [Pg.394]    [Pg.240]    [Pg.260]    [Pg.127]    [Pg.274]    [Pg.398]    [Pg.341]    [Pg.106]    [Pg.106]   


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Chassis

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