Glass wafer

Abstract We review various methods for the photochemical grafting of organic polymers to various substrates including, organic films, membranes, planar gold, silicon wafers, glass, silica gel, silica nanoparticles, and polydimethylsiloxane micro-channels. An emphasis is placed on photoinitiated synthesis of polymer brushes from planar gold and silicon. 

Substrate material compatible with micro electronic fabrication Silicon wafer. Glass, ceramic, glass epoxy laminates (PCB), organic polymers as substrate materials instead of traditional high density non-porous graphite material (Chan et al., 2005 Yen et al., 2003 Lu et al., 2004 Apanel et al., 2004 Wozniak et al., 2004 Choban et al., 2005 Chachuat et al., 2004 Meyers et al., 2002 Kelley et al., 2002 Min et al., 2002 Savinell et al., 2(XX)). 

Light microscopy is of great importance for basic research, analysis in materials science and for the practical control of fabrication steps. Wlien used conventionally it serves to reveal structures of objects which are otherwise mvisible to the eye or magnifying glass, such as micrometre-sized structures of microelectronic devices on silicon wafers. The lateral resolution of the teclmique is detennined by the wavelength of tire light... 

Monolayers can be transferred onto many different substrates. Most LB depositions have been perfonned onto hydrophilic substrates, where monolayers are transferred when pulling tire substrate out from tire subphase. Transparent hydrophilic substrates such as glass [18,19] or quartz [20] allow spectra to be recorded in transmission mode. Examples of otlier hydrophilic substrates are aluminium [21, 22, 23 and 24], cliromium [9, 25] or tin [26], all in their oxidized state. The substrate most often used today is silicon wafer. Gold does not establish an oxide layer and is tlierefore used chiefly for reflection studies. Also used are silver [27], gallium arsenide [27, 28] or cadmium telluride wafer [28] following special treatment. 

Optical Lithography. Optical Hthography uses visible or ultraviolet light as the exposure media, and is the dominant Hthographic process used for patterning IC wafers. The linewidth limit is near 0.4 p.m, although some narrower features may be possible (34). The masks typically are made from patterned, opaque chromium films on glass. 

Results of uniaxial strain static and gas gun compression tests on syntactic foam have been conducted. The foam was buoyant and composed of hollow glass microspheres (average diameter 100 microns) embedded in an epoxy plastic. Static testing consists of compressing a 0.25 cm x 2.5 cm dia. wafer between carefully aligned 2.5 cm dia. steel pistons. Lateral expansion of the wafer is... 

DNA microarrays, or DNA chips consist of thousands of individual DNA sequences arrayed at a high density on a single matrix, usually glass slides or quartz wafers, but sometimes on nylon substrates. Probes with known identity are used to determine complementary binding, thus allowing the analysis of gene expression, DNA sequence variation or protein levels in a highly parallel format. 

A Fig. 4 a —g. Some interface analysis techniques applied to polymers. Mostly the interface of a double layer system of polymer A/polymer B on a substrate (silicon wafer (Si) or glass) is investigated. In some cases deuterated (D) versus protonated (H) polymer films are used. Techniques and abbreviations are explained in the text and in Table 2... 

Turner et al. (2004) studied the independent variables relative surface roughness, Knudsen number and Mach number and their influence on the friction factor. The micro-channels were etched into silicon wafers, capped with glass, with hydraulic diameters between 5 and 96 pm. Their surface roughness was 0.002 < ks< 0.06 pm for the smooth channels, and 0.33 < / < 1 -6 pm for the glass-capped ones. The surface roughness of the glass micro-channels was measured to be in the range 0.0014 [Pg.39]

Xu et al. (2000) investigated de-ionized water flow in micro-channels with hy-draulie diameter ranging from 30 to 344 pm at Reynolds numbers ranging from 20 to 4,000. Two test modules were used. The first test module consisted of a cover and an aluminum plate, into which a micro-channel, inlet and outlet sumps were machined. A Plexiglas plate was used to cover the channel. The second module was fabricated from a silicon wafer, and a 5 mm thick Pyrex glass was utilized to... 

A widely used glass is phosphosilicate (PSG), which is used extensively in semiconductor devices as a passivation and planarization coating for silicon wafers. It is deposited by CVD by the reaction of tetraethyl orthosilicate (TEOS) (C2H50)4Si, and trimethylphosphate PO(OCH3)3, in a molecular ratio corresponding to a concentration of 5 to 7% P. Deposition temperature is usually 700°C and pressure is 1 atm. 

Silicon wafer has been extensively used in the semiconductor industry. CMP of silicon is one of the key technologies to obtain a smooth, defect-free, and high reflecting silicon surfaces in microelectronic device patterning. Silicon surface qualities have a direct effect on physical properties, such as breakdown point, interface state, and minority carrier lifetime, etc. Cook et al. [54] considered the chemical processes involved in the polishing of glass and extended it to the polishing of silicon wafer. They presented the chemical process which occurs by the interaction of the silicon layer and the... 

Metal and polysilicon films are formed by a chemical-vapor deposition process using organometallic gases that react at the surface of the IC structure. Various metal silicide films may also be deposited in this manner by reaction with the surface of the silicon wafer to form metal silicides. Glass and pol3uner films are deposited or spin cast or both, as are photoresist films (those of a photosensitive material). This process is accomplished by applying a liquid polymer onto a rapidly rotating wafer. The exact method used varies from manufacturer to manufacturer and usually remains proprietary. 

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