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TPI Thermoplastic Polyimide

Larc-TPI, Thermoplastic polyimide resin, Mitsui Chemicals America, Inc. [Pg.916]

Fig. 19.1 The plastics pyramid according to thermal literature data of common polymers preferred materials for HT-PEM applications are in the upper right region TPI thermoplastic polyimide, PES polyether sulfone, P P)SU poly(phenylene)sulfone, PE E)K polyether(ether) ketone, LCP liquid crystal polymer, e.g., Vectra, PPS polyphenylene sulfide, PTEE polytetrafluoroethylene. Fig. 19.1 The plastics pyramid according to thermal literature data of common polymers preferred materials for HT-PEM applications are in the upper right region TPI thermoplastic polyimide, PES polyether sulfone, P P)SU poly(phenylene)sulfone, PE E)K polyether(ether) ketone, LCP liquid crystal polymer, e.g., Vectra, PPS polyphenylene sulfide, PTEE polytetrafluoroethylene.
St. Clair [36] synthesized and evaluated the properties of a semi-2-IPN comprising Thermid 600 (an acetylene terminated imide oligomer from National Starch and Chemical Company) and LaRC-TPI (a thermoplastic polyimide with a Tg of 257 °C). The composition having the ratio of 65 35 of thermosetting Thermid 600 to LaRC-TPI showed the best flexural strength at ambient temperature [36]. [Pg.316]

LARC TPI Langley Research Center Thermoplastic Polyimide... [Pg.139]

Polyimides for microelectronics use are of two basic types. The most commonly used commercial materials (for example, from Dupont and Hitachi) are condensation polyimides, formed from imidization of a spin-cast film of soluble polyamic acid precursor to create an intractable solid film. Fully imidized thermoplastic polyimides are also available for use as adhesives (for example, the LARC-TPI material), and when thermally or photo-crosslink able, also as passivants and interlevel insulators, and as matrix resins for fiber-reinforced-composites, such as in circuit boards. Flexible circuits are made from Kapton polyimide film laminated with copper. The diversity of materials is very large readers seeking additional information are referred to the cited review articles [1-3,6] and to the proceedings of the two International Conferences on Polyimides [4,5]. [Pg.428]

Abbreviations for Table 2.19 PHMA - poly-n-hexyl methacrylate, STVPh - polystyrene-co-vinylphenol, PFSt - poly(o-fluorostyrene-co-p-fluorostyrene), P(S-co-BrS) - poly(styrene-co-4-bromostyrene), N-TPI - new thermoplastic polyimide , PPrA - poly-n-propyl acrylate, PPeA - poly-n-pentyl acrylate,... [Pg.177]

LARC-2 (LARC-TPI) - This is a thermoplastic polyimide supplied by NASA Langley which was added to Phase II portion of the program. All other adhesive system candidates, except PPQf were not suitable for full evaluations of Phase II, and to maintain two systems in this study LARC-TPI was screened to Phase I requirements then added to Phase II. This polymer is the reaction product of pyromellitic dianhydride (PMDA) and 3,3, 4,4 -benzophenone tetra-... [Pg.497]

One of the most successful thermoplastic polyimides has been LARC-TPI, developed by the National Aeronautics and Space Administration (NASA) in the United States. The polymer is commercially available. Table 3 shows some of the very reasonable properties obtained from this adhesive. As indicated, the abihty both to maintain mechanical properties at elevated temperatures and indeed retain mechanical integrity for long periods of time are clearly apparent. [Pg.339]

LARC-TPI Gulf Oil Company/Mitsui Toatsu Chemicals Thermoplastic polyimide. [Pg.336]

Fig. 33 summarises the typical data discussed in the present section in order to compare the best performing polyimide adhesives at temperatures exceeding 200°C. It can be seen that condensation polyimides (Nolimid 380 and FM 34B ) seem to work better in ageing tests between 260 and 300°C. The thermoplastic polyimides Larc lA and Larc-TPI exhibit excellent adhesive properties between 200 and 232°C, whereas the BMI FM 32 can be used up to 200-230°C. [Pg.285]

CIBA-GEIGY s XU 218, are commercially available. An experimental thermoplastic polyimide, Larc-TPI, is not... [Pg.324]

Hot-melt-type (thermoplastic) polyimide films have been developed as high-heat-resistant adhesive materials. Mitsui Chemical s TPI, DuPont s Kapton KJ, Ube s Upicel, and Kaneka s Pixeo are typical examples. These are coated on dimensionally stable polyimide films to ensure good physical performance. [Pg.1471]

DuPont makes a PI they call a thermoplastic polyimide (TPI). The structure of this polymer is shown in Fig. 1A1 and might be called a PEI. It is covered in this separate section. [Pg.186]

Fully imidized aromatic thermoplastic polyimides (TPI) are linear polymers with good thermomechanical performance, used in high-temperature (>230°C) applications. Pis based on aromatic diamines and dianhydrides exhibit excellent heat resistance. In addition to their outstanding high-temperature resistance (Sancaktar et al. 1984 Sancaktar and Schenck 1985 Sancaktar and Dembosky 1986), toughness and good dielectric properties, low flammability, and high radiation resistance are desirable characteristics for this class of adhesives. [Pg.279]

Larc TPI Thermoplastic polyamic acid 20 and polyimide 22 (Fig. 9.11) Adhesive film... [Pg.216]

St. Clair et used the concept of sequential semi-IPNs to produce two unique IPNs which are based on acetylene-terminated imide oligomers and thermoplastic polyimides, particularly a material designated LARC-TPI. Pater and others used the concept of simultaneous semi-IPNs to make semi-IPNs which are based on PMR-15 mixed with such materials as LARC-TPI, NR150B2 and Thermid 600 polyimides. Other examples of semi-IPNs which fit into the category of high temperature materials include thermoplastic modified bismaleimides (BMI). As one example, BMI has been mixed with condensation polyimides such as PI20280 or with terminated poly (arylene ether ketone) oligomers. The observed miscibility in semi-IPNs which are based on thermoplastic BMIs was found to be further improved when a BMI and thermoplastic both prepared from aromatic diamines were blended. ... [Pg.9]


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