Surface preparation for adhesion

As a result of their properties, melamines are often used as decorative laminates. The melamine resins cure via an addition reaction mechanism so no reaction by-products can be produced on postcure as with the phenolic resins. The specific surface preparation for adhesive bonding and the preferred adhesives for bonding melamine and urea parts are similar to those suggested for phenolic resins. 

Landrock, A. H., Processing Handbook on Surface Preparation for Adhesive Bonding, Picatinny Arsenal Technical Report 4883, Picatinny Arsenal, Dover, NJ, December 1975. 

Chromic acid anodising, sealed with dichromate. Sulphuric acid anodising, sealed with dichromate Surface preparation for adhesive bonding. Limited film thickness, more or less porous layer due to copper dissolutioiL Provides limited protection against corrosion Aeronautical and mechanical applications... 

There is a vast literature on surface preparation for adhesive bonding and readers will find detailed discussions both elsewhere in this volume and in various reference books (Kinloch 1987 Adams 2005). Here, only some aspects specific to marine applications and the marine environment will be discussed. Modern boat structures are generally composite, mainly for... 

Du Pont has three types of Tedlar film, Type A, with one side treated for bonding Type B, with both sides bondable and Type S, which is untreated and is used as a release film (www2.dupont.com). Type B is used in laminating to metals, plastics, wood, and other materials it requires no further surface preparation for adhesive bonding. The methods for preparing the untreated film for adhesive bonding are similar to those of polyolefins and lluoropolymers (see Chapter 6). 

Landrock AH. Processing handbook on surface preparations for adhesive bonding. Picatinny Arsenal Technical Report 4883 December 1974. 

In early studies, the durability of Ti-6A1-4V bondments was determined as a function of surface preparation for several adherend preparations and several adhesives... 

Mazza, J.J. and Kuhbander, R.J., Grit blast/silane (GBS) aluminum surface preparation for structural adhesive bonding, WL-TR-94-4111. Materials Laboratory, Air Force Materiel Command, September 1999. 

Designs should therefore avoid, as far as possible, all features that allow water (whether seawater, rainwater or moisture from any source) to be applied, entrapped or retained. These conditions are not only corrosive towards bare metals they also adversely affect the life of protective coatings both directly and by the fact that it is often difficult at areas subject to these conditions to give sound and adequate surface preparation for good paint adhesion and subsequent performance. 

The application of surface treatments to mbbers should produce improved wettability, creation of polar moieties able to react with the adhesive, cracks and heterogeneities should be formed to facilitate the mechanical interlocking with the adhesive, and an efficient removal of antiadherend moieties (zinc stearate, paraffin wax, and processing oils) have to be reached. Several types of surface preparation involving solvent wiping, mechanical and chemical treatments, and primers have been proposed to improve the adhesion of vulcanized SBR soles. However, chlorination with solutions of trichloroisocyanuric acid (TCI) in different solvents is by far the most common surface preparation for mbbers. 

Several environment-friendly surface preparation for the treatment of mbber soles with radiations have been recently studied. These treatments are clean (no chemicals or reactions by-products are produced) and fast, and furthermore online bonding at shoe factory can be produced, so the future trend in surface modification of substrates in shoe industry will be likely directed to the industrial application of those treatments. Corona discharge, low-pressure RF gas plasma, and ultraviolet (UV) treatments have been successfully used at laboratory scale to improve the adhesion of several sole materials in shoe industry. Recently, surface modification of SBR and TR by UV radiation has been industrially demonstrated in shoe industry... 

A number of prebonding surface preparations for bonding beryllium and its alloys with epoxy adhesives have been suggested in the literature. One procedure is to degrease the substrate with trichloroethylene, followed by immersion in the solution listed below for 5 to 10 min at 23°C. 

Alkyd parts are generally very rigid, and the surfaces are hard and stiff. Surface preparation for alkyd parts consists of simple solvent cleaning and mechanical abrasion. Epoxies, urethanes, cyanoacrylates, and thermosetting acrylics are commonly used as structural adhesives. 

Cagle, C. V., Surface Preparation for Bonding Beryllium and Other Adherends, in Handbook of Adhesive Bonding, C. V. Cagle, ed., McGraw-Hill, New York, 1973. 

Use A sealant and adhesive removal solvent, useful for surface preparation for prepaint and prebonding, general surface cleaning and degreasing. 

Our initial work in fracto-emission examined a number of details of the EE and PIE accompanying fracture in oxide coatings which served as surface preparations for the adhesive bonding of aluminum. This work can be found... 

Based on the data shown in Figs. 1-8 and similar results obtained on the other candidate adhesives CAA (10 Volts) was selected as the surface preparation for use in the remaining studies of this program. These data were also used to select the adhesive systems for continued evaluation. 

The method used for testing durability of adhesive bonds was developed at 3M by W.D. Sell (16) and is called "sustained load stress durability". The metal substrates were 2024T-3 clad or bare aluminum alloy, 5052T-4 bare aluminum alloy or 1010 cold rolled steel. The surface preparation for the aluminum alloys was either the "optimized" FPL-etch" or the H PO -anodization process (12). The steel was solvent wiped. If a primer was used, it was cured before application of the adhesive. Film... 

Careful surface preparation before adhesive application is essential for consistent and successful bonding to most substrates (see Pre-treatment of metals prior to bonding), and this certainly applies to copper, which has a reputation for being difficult to bond. Part of the difficulty is the friability of the black copper(ll) oxide, which forms on the surface in air at temperatures in the range 200-500 °C. At ambient temperatures, a thin layer of copper(I) oxide is present. 

---