Stacked Memory

The stacked memory, or so-called stacked chip scale package (SCSP) memory, which has been in the market for a couple of years1 -41, could be considered as 

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A binary decoder, a binary adder, and a stack memory can be built. 

If the 2.5-D technology is available, it s possible to re-organize the RDRAM chip so that the signal path can be significantly reduced. Suppose we need to design a memory system composed of four RDRAM chips. In the conventional solution, the four chips will be serially connected as shown in Fig. 3.5. In a 2.5-D stacked memory system illustrated in Fig. 3.6, the DRAM cells can now be placed into four layers and vertically stacked. The memory bus will be through inter-chip contacts, which have only a vertical height of <50 pm. As a result, 2.5-D stacked Rambus DRAM has a considerable potential to achieve superior performance at a relatively low cost. 

Keywords 2.5-D Integration, stacked memory, CPU, graphics processing unit (GPU), DRAM, mixed-signal, image sensor, radar-in-cube. 

In this approach, entire wafers or segments of wafers containing ICs are stacked. Interconnections are formed from vias in the silicon. In vertically stacking memory chips or other IC chips, the chips are first thinned to several mils (4 mils or less), then adhesive bonded, and electrically interconnected directly from chip-to-chip, either from the edges or through vias in the silicon. In these approaches, both electrically conductive and electrically insulative adhesives are used. Thermally conductive preform adhesives or thin thermoplastic films are used to bond and isolate the chips within the stack and to dissipate heat. Several processes are available to vertically stack and interconnect chips of the same size and function such as SRAM, flash, and DRAM memory chips. Other processes have been developed to vertically stack chips of different sizes and functions, or to horizontally interconnect different chips in one layer, then vertically stack the layers. ... 

In this model (Fig. 1.17), each cam track can be considered as an input tape containing input symbols of an algorithm written on the tape. The needle butt is the reading head of the controlling automaton with a stack memory which reads the input symbols and produces an output symbol. The output symbol, which is the direction and the distance of the needle movement, determines the operation to be performed by the needle latch represented by the operational automaton A2. The space under the hook and on the needle stem provides storage of the knitted structural elements and their transfer to the wale or to another needle. The needle can have a hook and a latch at the opposite ends these type of needles is used for the manufacture of purl structures. The structural elements therefore can be moved to the space under the hook from both sides of the needle. According to this, automaton A2 has a memory for the storage of symbols, i.e. the structural elements, in the form of a double-ended... 

Memory cube, a three-dimensional module consisting of stacked memory devices such as DRAMs or SRAMs. 

At the present time, most packaging of this type is in the form of stacked memory in CSPs, and the stacking is done only to save space. However, it is a growing trend that can be appiied to any eiectronic system where volume density is of concern. Stacked die packaging is iiiustrated in the top view of Eig. 4.8, while the bottom view shows how packaged devices can be stacked. 

Fig. 4. A tiny fault-space plot excerpt from a stack memory area of the mutex i benchmark (from top to bottom color coding as in Fig. 1) Ground-truth results (100% FI experiments), results from sampling 0.73 % of all experiments (gray areas are unknown results, i.e., def/use classes that were not sampled or known a priori), and reconstructed results with also a total of 0.73 % (including training set) of all experiments for the eCos/baseline benchmarks.

AUTOSAR is a software standard for the automotive industry providing the specification of the basic software components, such as several protocol stacks, memory management. 

Push-down Automata push-down automata generalize finite automata by introducing an internal memory. Just as for finite automata, push-down automata have a finite input alphabet and a finite set of intermediate states, a subset of which constitutes the set of its output (or accepting) states. The difference is that push-down automata have an additional stack-space, consisting of some or all of the symbols of the machine s alphabet (along with perhaps some additional symbols to be used as internal markers) which they can use to store information for later use. We can therefore generalize our definition for finite automata (equation 6.4) to ... 

I almost have to dream myself back and forth to recapture all the interesting happenings during my first five and a half years at Edgewood. I ve got a stack of reports, a pile of data sheets filled with rows and columns of numbers, personal and official letters, family and workplace photographs and... my memories. 

Hada H, Amanuma K, et al (2004) Capacitor-on-metal/via-stacked-plug (CMVP) memory cell technologies and application to a nonvolatile SRAM. Ferroelectric Random Access Memories Fundamentals and Applications 93, 215-232... 

Hammond, 1C S., Tull, L. E. and Stack-man, R. W. (2004) On the delay-dependent involvement of the hippocampus in object recognition memory. Neurobiol Learn Mem 82, 26-34. 

She sets up the turntables, stacks the records along the carpet below. Skirts around them apprehensive, leaves the room and shuts the door. For three days she speaks to no one, enough food to avoid the shop. She walks along the beach, watches the tides come and go, looks into her memory for riffs she once played or knew by heart from other bands favourite songs. But there is nothing. 

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