Stacked chip-scale-package

Kada M, Smith L. Advancements in stacked chip scale packaging (S-CSP), provides system-in-a-package functionality for wireless and handheld applications. Proceedings of Pan Pacific Microelectronics Symposium Conference 2000. p 1-7. 

The stacked memory, or so-called stacked chip scale package (SCSP) memory, which has been in the market for a couple of years1 -41, could be considered as... 

Figure 7.4 Intel s wire-bonded stacked Chip Scale Packaged flash memory (courtesy of Intel Corporation)141...

Intel Corporation. Intel stack Chip Scale Packaging products. Intel Flash Memory Home, [online]. Available http //www.intel.com/design/flcomp/prodbref/298051. htm. 

Figure 1.16 Stacked chip-scale package configuration.

Figure 1.16. Stacked chip-scale package configuration. (Source Amkor.)...

Stacked chips on rigid substrate Chip scale packaging efficiency integrating multiple functionality and high silicon density Thin profile fine pitch BGA (TFBGA), low profile fine pitch BGA (LFBGA) (Orient Semiconductor Electronics USA) Portable electronics requiring flash memory, SRAMs, DRAMs, and controller chips... 

FIGURE 58.10 Weibull plot of single and double-sided mounting of stacked lead-free extremely thin chip scale package (PS-etCSP ). (Reprinted with permission from Amkor Technology, Inc./ [2004] IEEE ECT )... 

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