Memory Modules and Vertical-Stack Packaging

Copper leadframe, low-loop wire bonds or flip-chip interconnect, over-molded 50% size reduction compared to thin-shrink small-outline package (TSSOP) inductance (MicroLeadFrame ) and very low inductance flip-chip MicroLeadFrame MicroLeadFrame (wire bond) and flip-chip MicroLeadFrame (/i-MLF) (Amkor) Portable electronics (cell phones and personal data assistants) (PDAs), MicroLeadFrame and high-performance applications in the 5-40 GHz range 

Standard bumped chip carria (BCC) and electrically/thermally enhanced (BCC+) center-exposed-pad technology, overmolded Structure without interposer for low standoff height BCC (Fujitsu) Flash memory, portable electronics 

Copper Cl94 (taped and gold flash), wire bonded Near CSP format, excellent electrical and thermal characteristics MicroLeadFrame (MLF) and Quad Flat-Pack No-Lead (QFN) (Orient Semiconductor Electronics USA) Microwave, RF, and hand-held portable communications 

Exposed die-attach pad 50% reduction in inductance/capacitance compared to leaded parts. MLP (MicroLeadFrame Package) (Carsem) PDAs, Global-Positioning Systems (GPS), RF product for Bluetooth  

Rigid laminate substrate (with or without soldermask), wire bonds, over-molded Small outline, low profile (1.0 mm), enhanced electrical performance over 2.4 GHz, JEDEC moisture sensitivity level (MSL) 3 Plastic thin fine pitch quad flat no lead package (P-TFQFN), plastic thin shrink small outhne no lead package (P-TSSON), and fine-pitch BGA, FBGA (National) Portable applications, flash memory 

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