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Memory Modules and Vertical-Stack Packaging

Copper leadframe, low-loop wire bonds or flip-chip interconnect, over-molded 50% size reduction compared to thin-shrink small-outline package (TSSOP) inductance (MicroLeadFrame ) and very low inductance flip-chip MicroLeadFrame MicroLeadFrame (wire bond) and flip-chip MicroLeadFrame (/i-MLF) (Amkor) Portable electronics (cell phones and personal data assistants) (PDAs), MicroLeadFrame and high-performance applications in the 5-40 GHz range [Pg.318]

Standard bumped chip carria (BCC) and electrically/thermally enhanced (BCC+) center-exposed-pad technology, overmolded Structure without interposer for low standoff height BCC (Fujitsu) Flash memory, portable electronics [Pg.318]

Copper Cl94 (taped and gold flash), wire bonded Near CSP format, excellent electrical and thermal characteristics MicroLeadFrame (MLF) and Quad Flat-Pack No-Lead (QFN) (Orient Semiconductor Electronics USA) Microwave, RF, and hand-held portable communications [Pg.318]

Exposed die-attach pad 50% reduction in inductance/capacitance compared to leaded parts. MLP (MicroLeadFrame Package) (Carsem) PDAs, Global-Positioning Systems (GPS), RF product for Bluetooth  [Pg.318]

Rigid laminate substrate (with or without soldermask), wire bonds, over-molded Small outline, low profile (1.0 mm), enhanced electrical performance over 2.4 GHz, JEDEC moisture sensitivity level (MSL) 3 Plastic thin fine pitch quad flat no lead package (P-TFQFN), plastic thin shrink small outhne no lead package (P-TSSON), and fine-pitch BGA, FBGA (National) Portable applications, flash memory [Pg.319]


See other pages where Memory Modules and Vertical-Stack Packaging is mentioned: [Pg.315]    [Pg.317]   


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And memory

Memory modules

Packaging memory

Stacked Memory

Vertical stacking

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