Stacked devices

Figure 8.6 shows a typical cross section of the 18 MeV component of the electron beam, after de-convolution of experimental data from the radiochromic film-stack device SHEEBA [76],... 

Microplate stacking device, e. g., Twister 1 (Zymark, Hopkinton, MA, USA)... 

For this purpose, Bruiser has already coupled the microplate stacking device Twister 1 to its microplate reader [22]. In this combination, which is controlled by OPUS software, 40 IR microplates can be measured automatically. To load samples with high throughput, the Microlab 4000 SP autosampler can be used. Both formats (96 and 384) of the Bruker silicon microplates are suitable for automatic loading of various types of samples (proteins, cells, culture media). 

There were 1004 fossil-fueled units with a total capacity of about 18 thousand MW which were installed in 1940 or earlier but were still in operation in 1970. Some of these units were installed in the first two decades of this century. These units were estimated to be 56% coal-fired, 28% oil-fired, and 16% gas-fired. Assuming that one-half of each of the types of older units will be retired by 1975, then 281 coal-fired, 141 oil-fired, and 80 gas-fired units will be retired. In addition 90 coal-fired and 30 gas-fired units are expected to be converted to oil-fired units. Consequently, by 1975 there will be 960 coal-fired and 1050 oil-fired for a total of 2010 units which will require some form of sulfur emission control either through stack devices to remove sulfur dioxide from flue gases or through low sulfur fuels. 

As a recently developed technology, a novel automation concept has been presented which is based on a mover, a stacking device, and a reader or washer (Twister, Zymark). In comparison to the above mentioned systems, assays based on the Twister concept are only semi-automated. The outstanding benefit is the simplification of feeding, handling, set-up, as well as the small laboratory space... 

First, the proper switching function of the device was verified. Both device parts were tested and each of them showed bistable behaviour as it can be seen for device part A11 in Figure 27.13. The NDR region and the threshold bias were shifted to higher voltages and appeared at 10-14 V as compared with a few volts in the stacked devices. Additionally, the current did not rise as fast and abruptly at the threshold voltage. 

A successful harvest method was identified utihzing a continuous centrifugation in a Westfalia CSC-6 disc-stack device with a hydrohermatic feed system (HHFS). A continuous centrifuge allows the discharge of the pelleted cellular material to be ejected at precise time intervals while continuously and separately discharging the supernatant. This feed system reduces the... 

There are three basic membrane oxygenator configurations the stacked or layered devices, the spiral coil device, and the capillary design. The stacked devices include Lande-Edwards (25), the General Electric-Pierce (33), and the Travenol (34) oxygenators. A spiral-coil design has been developed in our laboratory at the National Institutes of Health and is commercially available (24). A capillary device is made by Dow Chemical Co. 

Fig. 1. 22 Stacked linear contractile actuator configurations. From left to right. Stacked device wherein alternating layers of elastomer and electrode are stacked together helical device where two complementary helical elastomer strips and electrodes are interlocked folded device where a single strip of elastomer with electrodes on the top and bottom is folded upon itself [258]. Proc SPIE 2007, reprinted with permission...

Present solid-state (photovoltaic) mul-tijunction photovoltaics exist in one of two modes, either splitting (in which the solar spectrum is optically separated before incidence on the cells) or stacked devices. The latter mode has been developed as either monoKthic (integrated) or mechanically (discrete cells layered with transparent adhesive) stacked cells. Most monoKthic stacked multijunction photovoltaics under development use III-V semiconductors in at least one of the layers and take advantage of the variations in band gap and close lattice match achieved with other related III-V alloys. For example, GalnP has been used as a wide gap top cell, or GaSb and GalnAsP as small gap lower cells, for III-V top-layer multijunction cells other cells use silicon or CIS cells as a lower layer [12-15]. 

Sophisticated control systems are available to manage existing variables. They are needed to handle rapid tooling changes, withdrawal and stacking devices, interactive control systems, and vacuum cooling incorporating steam condensers and/or a central vacuum system. 

Photovoltages of the components cells are additive in the stacked device, providing higher useable photopotential. 

UF membranes are made commercially in sheet, capillary, and tubular forms. Sheet membrane is used in plate-and-frame devices, stack devices, and spiral elements. Capillary membranes are generally 0.4-1 mm diameter, are self-supporting, and are pressurized from inside. Usually, drey are made with a skin on both inside and outside surfaces so that they can be pressure reversed for cleaning. Tubular devices ate cast on supports and ate generally in the 10-25 mm diameter range. 

As indicated in the previous sections, CMP has found many applications in the manufacturing of More than Moore devices. In this chapter, examples will be discussed where polishing processes have to be employed for the manufacturing of power devices, MEMS and MOEMS chips, and micro-displays. The described applications are exemplary and do not claim completeness. Wafer bonding will be covered with examples from the fields of stacked devices and wafer-level packaging (WLP), while TSVs will be treated in more depth in a separate chapter in this book. 

Wafer bonding is a technology to combine two substrates in order to achieve a mechanically stable connection between them. The technology is apphed for substrate production, for example, for the fabrication of silicon on insulator wafers or compound semiconductor wafers and for device fabrication, for example, for the fabrication of MEMS/MOEMS devices as described in previous sections, for stacking devices in 3D integration, or for wafer-level packaging. 

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