Soldering Techniques

Peter, J. (2006), Ancient soldering techniques, Przeglad Spawalnictwa 78, 19-22. 

Flame-retarded grades are widely used for various computer connectors and circuit board components. Representative applications are edge card connectors, grid arrays and memory modules. Non-flame-retarded grades find use in automotive under-the-hood applications, typically connectors and related parts. As higher temperature soldering techniques become more common in the automotive industry, the use of high-temperature plastics such as PCT is expected to increase. It is also possible to formulate unreinforced PCT with crystallization aids and... 

When soldering delicate electronic parts, always be sure to use a "heat sink" to absorb any excess heat that might damage the component. Also be sure to use proper soldering technique and a light touch so a good connection can be made. 

Another new method of solder bumping is based on injection-molded solder technique. This technology, which is known as C4NP (C4-new process) was developed... 

Figure 8 shows power output characteristics of FGM thermoelectric sample shown in Figure 7. Voltage-Current plot and Power-Current plot show the difference in the direction of temperature gradient applied to the sample. Output power with forward temperature gradient is 6% larger than that with reversed temperature gradient. The most likely explanation of this asymmetry can be found in a graded structure of the sample. But there is room for argument on this result because there seems a problem on reproducibility of both the material properties and the soldering technique. In this study the expected enhancement on conversion efficiency is rather small, it seems necessary to solve the problem mentioned above.

Polyalkyl methacrylates decompose at temperatures accessible to rapid soldering techniques. 

To reduce the thermal stress for components as well as for thermoplastic base substrates, conductive adhesives and selective soldering can be used. In working with adhesives, good interconnections with a maximum temperature of only about lOCfC can be established. This temperature is necessary to harden the epoxy material. In the selective soldering technique, the heat is transferred only to places where interconnections have to be made between the component s termination and the pad on the substrate. This reduces the overall thermal stress situation for the whole 3D MID. 

New soldering techniques that avoid cleaning as a process have been developed and introduced in the electronic industry. 

The majority of food cans are now made without lead or tin solder, thus metal cans are no longer manufactured by tin-coated three-piece and side-soldered techniques. Modem cans are made either from two pieces (body and one end piece) or from three pieces with a welded side seam. This necessitated the utilization of improved can interior coating. Polymeric materials are used as barriers for coating metal containers to provide protection for various food substrates from attack by aggressive components of ambient environments. The fundamental function of the... 

A subsequent experiment involved the analysis of gold nanoshell effectiveness as laser-tissue welding agents in in vivo rat models. The experiment was conducted on two 4—5 cm, fullthickness incisions made on the backs of twenty rats. For each rat, one incision was closed with the nanoshell-soldering technique while the other was closed with pol)q)ropylene sutures, which served as the control. On days 0,5,10,21, and 32, four rats (at each time point) were euthanized and incision areas were removed for mechanical testing and histological analysis. 

FIGURE 40.30 Hand-soldering techniques using point, tweezers, and hot-bar tips to perform repair or rework procedures. (Courtesy of OK International and Electronic Products and Technologies.)... 

Indium and some of its alloys can wet to glass, quartz, and other normally unsolderable inorganic substrates with the aid of an ultrasonic soldering tool. Ultrasonic soldering will be discussed in the chapter on soldering techniques. 

Because of safety and environmental concerns and comphance with the Montreal Protocol for the reduction of ozone-depleting chemicals, this soldering technique had fallen out of favor. With the advent of Pb-free soldering, there is increased interest in vapor-phase soldering for SMT applications, but it is likely that it will remain a niche application. Due to its continued diminished status, vapor-phase reflow is covered only briefly. 

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