Soldering selective

For environments in which tin is less readily corroded than lead, corrosion resistance of the alloy decreases as the lead content increases the decrease may, in some circumstances, be sharp at a particular composition. In the more corrosive media, such as nitrite solution, a sharp increase of corrosion rate is observed as the lead content increases beyond 30waters with low contents of dissolved salts, the corrosion rate increases slowly with lead content up to about 70% and then rises more steeply, but in the general run of supply waters the ability of lead to form protective insoluble anodic products is helpful to the durability of solder. Selective dissolution of tin has been... 

An advantage of through-hole technology is reduced cost in some appUcations. That cost benefit may be realized by lower labor costs in some parts of the world that support hand assembly, which is relatively easy with the larger components and products, and lower board densities. Even when fully automated—either by wave soldering, selective soldering, or paste-in-hole/reflow—the capital equipment and manufacturing costs can stiU be lower than those required for surface-mount assembly. 

FIG. 89 Seiko Epson lead-free solder selection for reflow, wave, and manual (repair) soldering. (From Ref. 50.)... 

TABLE 27 Lead-Free Solders Selected by the IDEALS Lead-... 

Alloy selection depends on several factors, including electrical properties, alloy melting range, wetting characteristics, resistance to oxidation, mechanical and thermomechanical properties, formation of intermetaUics, and ionic migration characteristics (26). These properties determine whether a particular solder joint can meet the mechanical, thermal, chemical, and electrical demands placed on it. 

Only about 10 elements, ie, Cr, Ni, Zn, Sn, In, Ag, Cd, Au, Pb, and Rh, are commercially deposited from aqueous solutions, though alloy deposition such as Cu—Zn (brass), Cu—Sn (bronze), Pb—Sn (solder), Au—Co, Sn—Ni, and Ni—Fe (permalloy) raise this number somewhat. In addition, 10—15 other elements are electrodeposited ia small-scale specialty appHcations. Typically, electrodeposited materials are crystalline, but amorphous metal alloys may also be deposited. One such amorphous alloy is Ni—Cr—P. In some cases, chemical compounds can be electrodeposited at the cathode. For example, black chrome and black molybdenum electrodeposits, both metal oxide particles ia a metallic matrix, are used for decorative purposes and as selective solar thermal absorbers (19). 

Fluxes. Fluxes, composed mostly of salts or oxides of metals, serve to protect underlying metal from the air. This prevents the formation of surface oxides that impede fusion and the formation of a strong solder joint. Fluxes may also act to selectively leach elements from the surface of the underlying metal. The result is a surface free of obstacles to fusion, and of a composition readily wetted by the solder. 

Soldered joints, especially those to be used in a static environment, are, if insufficient care is taken, liable to corrosion by residues of flux, which by their nature as oxide removers are potentially corrosive. It is, however, possible to select fluxes which are active when hot but give non-corrosive residues when cold. 

Cadmium is easier to solder and has a lower contact resistance than zinc, and for such reasons it may be selected for certain applications. However, account must be taken of the toxic nature of cadmium and cadmium vapour. 

In condensed moisture, there is sufficient corrosion of zinc to give protection at pores in a coating on steel without the formation of as much zinc corrosion product as would develop on a wholly zinc surface. In solder-ability the coating is tin-like when new or stored dry, but the selective corrosion of zinc in humid conditions may produce a layer obstructive to easy soldering. 

A screening study for evaluating and selecting components of the tinplate container—tinplate, enamel, end-sealing compound, and side-seam solder—which were irradiated at designated doses and temperatures... 

Manufacture of Printed Wiring Boards. Printed wiring boards, or printed circuit boards, are usually thin flat panels than contain one or multiple layers of thin copper patterns that interconnect the various electronic components (e.g. integrated circuit chips, connectors, resistors) that are attached to the boards. These panels are present in almost every consumer electronic product and automobile sold today. The various photopolymer products used to manufacture the printed wiring boards include film resists, electroless plating resists (23), liquid resists, electrodeposited resists (24), solder masks (25), laser exposed photoresists (26), flexible photoimageable permanent coatings (27) and polyimide interlayer insulator films (28). Another new use of photopolymer chemistry is the selective formation of conductive patterns in polymers (29). 

To reduce expense, efforts are made to exploit integrated thin film technologies. For example, arrays have been produced via thin film deposition of the pyroelectric onto a sacrificial layer, e.g. a suitable metal or polysilicon, which is then selectively etched away. Thermal isolation of the pyroelectric element is achieved through engineering a gap between it and the ROIC silicon wafer. Yias in the supporting layer permit electrical connections to be made between the detector and the wafer via solder bonds. Imaging arrays have been produced in this way incorporating sputtered PST and sol-gel formed PZT films. 

The environmental impact of waste disposal and of chemical use in Europe has led to three legislative actions that, in today s global economy, greatly affect flame-retardant use and research. These actions go by the acronyms of RoHS (Reduction of Hazardous Substances), WEEE (Waste Electrical and Electronic Equipment), and REACH (Registration, Evaluation, Authorisation, and Restriction of Chemical substances). These actions are discussed in detail in Chapter 22, but need to be mentioned here as they are clear examples of how changing regulations affect flame-retardant use, selection, and new fire-safety developments. The first one, RoHS, refers to how new items are manufactured, and specifically bans chemicals and elements of environmental and toxicological concern in Europe. One fall-out item of RoHS is the move from a lead-based solder on circuit... 

We will describe two mesoscale, self-assembling systems in which the interactions between objects are based on capillary forces. The first is based on polyhedral polydimethylsiloxane (PDMS) objects at a perfluorodecalin (PFD)/H20 interface. These objects have their faces patterned to be either hydrophobic or hydrophilic, and they assemble via lateral capillary forces that originate from interactions between these faces (Fig. 4. la). The second system uses polyhedral objects that are suspended in water and have selected faces covered with a water-insoluble liquid - either a hydrophobic organic liquid or a liquid metal solder these objects assemble via capillary forces into three-dimensional (3D) structures (Fig. 4.1b). 

Figure 4.18. Schematic sketching the experimental procedure used in 3D mesoscale self-assembly. Molding of a polyurethane prepolymer in a PDMS master generated polyhedra. Lubricant was added to the polyhedra in a water-filled Morton flask the use of liquid solder as a lubricant required the covering of selected faces with solder-coated copper tape. Axial rotation of the flask provided the agitation needed to cause collisions between liquid-coated pieces. The schematic depicts the formation and self-...

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