Silicon nitride, vapor deposition

Silicon nitride is deposited by chemical vapor deposition (CVD). Two methods... 

Chemical vapor deposition (C VD) is a versatile process suitable for the manufacturing of coatings, powders, fibers, and monolithic components. With CVD, it is possible to produce most metals, many nonmetallic elements such as carbon and silicon as well as a large number of compounds including carbides, nitrides, oxides, intermetallics, and many others. This technology is now an essential factor in the manufacture of semiconductors and other electronic components, in the coating of tools, bearings, and other wear-resistant parts and in many optical, optoelectronic and corrosion applications. The market for CVD products in the U.S. and abroad is expected to reach several billions dollars by the end of the century. 

Tsu, D. V., and Lucovsky, G., Silicon Nitride and Silicon Diimide Grown by Remote Plasma Enhanced Chemical Vapor Deposition, J. Vac. Set. Technol. A, 4(3-1 ) 480-485 (May-June 1986)... 

Handbook of Chemical Vapor Deposition 3.2 Silicon Nitride... 

The reinforcing fibers are usually CVD SiC or modified aluminum oxide. A common matrix material is SiC deposited by chemical-vapor infiltration (CVI) (see Ch. 5). The CVD reaction is based on the decomposition of methyl-trichlorosilane at 1200°C. Densities approaching 90% are reported.b l Another common matrix material is Si3N4 which is deposited by isothermal CVI using the reaction of ammonia and silicon tetrachloride in hydrogen at 1100-1300°C and a total pressure of 5 torr.l" " ] The energy of fracture of such a composite is considerably higher than that of unreinforced hot-pressed silicon nitride. 

The low-pressure chemical vapor deposition of silicon nitride on silicon involves two gaseous reactants dichlorosilane and ammonia. The following reactions are believed to be important under typical conditions of P = 1 torr and T= 1000 1200 K ... 

Chemical Vapor Deposition- Deposition of silicon oxide films is accomplished by CVD equipment. Either plasma CVD or ozone oxidation is used. Blanket tungsten films are also deposited by CVD equipment to create contact and via plugs. Polysilicon and silicon nitride films are deposited in hot-wall furnaces. TiN diffusion barrier films are deposited by either sputtering or CVD, the latter giving superior step coverage. 

The other platform is dielectrics, for example, silicon dioxide, silicon nitride, silicon oxynitride, tantalum pentoxide, and titanium dioxide. They can be deposited by various methods, such as plasma-enhanced chemical vapor deposition, thermal evaporation, electron-beam evaporation, and sputtering. There are a number of dielectrics with refractive indices ranging from 1.45 to 2.4, facilitating diverse waveguide designs to satisfy different specification. Dielectrics have two other... 

J. Sun, N. Lindvall, M.T. Cole, K.B.K. Teo, A. Yurgens, Large-area uniform graphene-like thin films grown by chemical vapor deposition directly on silicon nitride, Applied Physics Letters, 98 (2011) 252107. 

The steam reformer is a serpentine channel with a channel width of 1000 fim and depth of 230 fim (Figure 15). Four reformers were fabricated per single 100 mm silicon wafer polished on both sides. In the procedure employed to fabricate the reactors, plasma enhanced chemical vapor deposition (PECVD) was used to deposit silicon nitride, an etch stop for a silicon wet etch later in the process, on both sides of the wafer. Next, the desired pattern was transferred to the back of the wafer using photolithography, and the silicon nitride was plasma etched. Potassium hydroxide was then used to etch the exposed silicon to the desired depth. Copper, approximately 33 nm thick, which was used as the reforming catalyst, was then deposited by sputter deposition. The reactor inlet was made by etching a 1 mm hole into the end... 

This approach allows the deposition of thin films at low temperatures. By comparison, polymer deposition generally requires very high temperatures. For instance, the chemical vapor deposition of silicon nitride requires a temperature of about 900°C, whereas the plasma chemical deposition requires a temperature of only 350°C. 

A review article on the CVD processes used to form SiC and Si3N4 by one of the pioneers in this area, Erich Fitzer [Fitzer, E., and D. Hegen, Chemical vapor deposition of silicon carbide and silicon nitride—Chemistry s contribution to modem silicon ceramics, Angew. Chem. Int. Ed. Engl, 18, 295 (1979)], describes the reaction kinetics of the gas-phase formation of these two technical ceramics in various reactor arrangements (hot wall, cold... 

Dielectric Deposition Systems. The most common techniques used for dielectric deposition include chemical vapor deposition (CVD), sputtering, and spin-on films. In a CVD system thermal or plasma energy is used to decompose source molecules on the semiconductor surface (189). In plasma-enhanced CVD (PECVD), typical source gases include silane, SiH4, and nitrous oxide, N20, for deposition of silicon nitride. The most common CVD films used are silicon dioxide, silicon nitride, and silicon oxynitrides. 

The wafers were coated with silicon dioxide (400 nm thickness) and silicon nitride by low pressure chemical vapor deposition (LPCVD) alternately. The chips were fabricated by photolithography and etching. The catalyst (for the application Pt) was introduced as a wire (150 pm thickness), which was heated resistively for igniting the reaction. The ignition of the reaction occurred at 100 °C and complete conversion was achieved at a stochiometric ratio of the reacting species generating a thermal power of 72 W (Figure 2.28). 

Franz et al. [93] developed a palladium membrane micro reactor for hydrogen separation based on MEMS technology, which incorporated integrated devices for heating and temperature measurement. The reactor consisted of two channels separated by the membrane, which was composed of three layers. Two of them, which were made of silicon nitride introduced by low-pressure chemical vapor deposition (0.3 pm thick) and silicon oxide by temperature treatment (0.2 pm thick), served as perforated supports for the palladium membrane. Both layers were deposited on a silicon wafer and subsequently removed from one side completely... 

Characterization of low-pressure chemical vapor deposited and thermally grown silicon nitride films. J. Appl. Phys. 53(1 ) 404 (1982). 

Passivation is needed to insulate the backplane from the OLED stacks everywhere except the ITO and bonding contact areas. Unlike poly-Si and a-Si H backplanes, on which both organic and inorganic passivation layers can easily work, the device passivation technique needs extra consideration for pentacene TFTs. We explored several different materials for passivation of pentacene TFTs, including poly(vinyl alcohol) (PVA), room temperature plasma-enhanced chemical vapor deposition silicon nitride (RT PECVD SiN), and vapor-deposited parylene. 

Matsumura H., Low temperature depostition of silicon nitride by the catalytic chemical vapor deposition method, Jpn. J. Appl. Phys. 28 (1989) pp.2157-2160. 

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