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Silicon against

Figure 7.4 X-Ray reflectivity of silicon against air calculated according to Equation (7.20), with the absorption effect ignored. Figure 7.4 X-Ray reflectivity of silicon against air calculated according to Equation (7.20), with the absorption effect ignored.
Figure 7.10 X-Ray reflectivity of silicon against air. The exact result (solid line) calculated according to Fresnel s law (7.19) is compared with the result (broken line) calculated according to (7.48) based on the kinematic approximation. Figure 7.10 X-Ray reflectivity of silicon against air. The exact result (solid line) calculated according to Fresnel s law (7.19) is compared with the result (broken line) calculated according to (7.48) based on the kinematic approximation.
Sketch a graph of the successive ionization energies of silicon against the number of electrons removed. Figure 12.21 shows the answer for this question. [Pg.446]

Figure C3.2.4. Plot of the log of photocurrent against number of methyl units in a alkylsilane based monolayer self-assembled on a n silicon electrode. The electrode is immersed in a solution witli an electron donor. Best fits of experimental data collected at different light intensities ( ) 0.3 mW cm ( ) 0.05 mW cm. From [10]. Figure C3.2.4. Plot of the log of photocurrent against number of methyl units in a alkylsilane based monolayer self-assembled on a n silicon electrode. The electrode is immersed in a solution witli an electron donor. Best fits of experimental data collected at different light intensities ( ) 0.3 mW cm ( ) 0.05 mW cm. From [10].
Oxidation of Silicon. Silicon dioxide [7631-86-9] Si02, is a basic component of IC fabrication. Si02 layers are commonly used as selective masks against the implantation or diffusion of dopants into silicon. Si02 is also used to isolate one device from another. It is a component of MOS devices, and provides electrical isolation of multilevel metalliza tion stmctures (12). A comparison of Si and Si02 properties is shown in Table 1. [Pg.346]

Siliconizing is yet another process used especially for coating of the refractory metals Ti, Nb, Ta, Cr, Mo, and W (see Refractories). These metals form siHcides which have a surface oxidation protection layer of Si02. Siliconizing is especially effective on molybdenum against air oxidation up to 1700°C. [Pg.136]

Silicon Carbide. Sihcon carbide is made by the electrofusion of siUca sand and carbon. SiUcon carbide is hard, abrasion resistant, and has a high thermal conductivity. It is relatively stable but has a tendency to oxidize above 1400°C. The siUca thus formed affords some protection against further oxidation (see Carbides). [Pg.26]

The location of a silicon metal plant is determined by balancing market costs against processing ones. Principal elements in the cost of silicon production, which ate site-dependent, are the deUvered cost of the raw materials, energy cost, and labor. Typical costs for production of silicon are given in Table 1. [Pg.535]

The fluids have also found a number of uses in medicine. Barrier creams based on silicone fluids have been found to be particularly useful against the cutting oils in metal machinery processes which are common industrial irritants. The serious and often fatal frothy bloat suffered by ruminants can be countered by the use of small quantities of silicone fluid acting as an antifoam. [Pg.828]

Fig. 4.10. Fluorescence signal from small particles or thin films deposited on a silicon substrate used as sample carrier. The intensity was calculated for particles, thin films, or sections ofdiffe-rent thickness but equal mass of analyte, and plotted against the glancing angle f. A Mo-Ka beam was assumed for excitation. Particles or films more than 100 nm thick show double intensity below the critical angle of0.1° [4.21]. Fig. 4.10. Fluorescence signal from small particles or thin films deposited on a silicon substrate used as sample carrier. The intensity was calculated for particles, thin films, or sections ofdiffe-rent thickness but equal mass of analyte, and plotted against the glancing angle f. A Mo-Ka beam was assumed for excitation. Particles or films more than 100 nm thick show double intensity below the critical angle of0.1° [4.21].
Vapor-phase decomposition and collection (Figs 4.16 to 4.18) is a standardized method of silicon wafer surface analysis [4.11]. The native oxide on wafer surfaces readily reacts with isothermally distilled HF vapor and forms small droplets on the hydrophobic wafer surface at room temperature [4.66]. These small droplets can be collected with a scanning droplet. The scanned, accumulated droplets finally contain all dissolved contamination in the scanning droplet. It must be dried on a concentrated spot (diameter approximately 150 pm) and measured against the blank droplet residue of the scanning solution [4.67-4.69]. VPD-TXRF has been carefully evaluated against standardized surface analytical methods. The user is advised to use reliable reference materials [4.70-4.72]. [Pg.192]

Fig. 11. Silicone polyurea interfacial structure against orienting medium (PSA). (From Ref. [20, copyright ownership by Overseas Publishers Association, reprinted with permission from Gordon and Breach Publishers.)... Fig. 11. Silicone polyurea interfacial structure against orienting medium (PSA). (From Ref. [20, copyright ownership by Overseas Publishers Association, reprinted with permission from Gordon and Breach Publishers.)...
PDMS based siloxane polymers wet and spread easily on most surfaces as their surface tensions are less than the critical surface tensions of most substrates. This thermodynamically driven property ensures that surface irregularities and pores are filled with adhesive, giving an interfacial phase that is continuous and without voids. The gas permeability of the silicone will allow any gases trapped at the interface to be displaced. Thus, maximum van der Waals and London dispersion intermolecular interactions are obtained at the silicone-substrate interface. It must be noted that suitable liquids reaching the adhesive-substrate interface would immediately interfere with these intermolecular interactions and displace the adhesive from the surface. For example, a study that involved curing a one-part alkoxy terminated silicone adhesive against a wafer of alumina, has shown that water will theoretically displace the cured silicone from the surface of the wafer if physisorption was the sole interaction between the surfaces [38]. Moreover, all these low energy bonds would be thermally sensitive and reversible. [Pg.689]

These alloys have corrosion resistance similar to that of copper, with mechanical properties equivalent to mild steel. Because silicon bronzes do not generate sparks under shocks, they can be used in the fabrication of explosion-proof equipment. Compared to tin bronzes, the tinless bronzes have a higher shrinkage (1.7-2.5% against 1.3-1.5% of tin bronzes) and less fluid-flow, which is an important consideration in designing. [Pg.83]

Thompson and Tracy carried out tests in a moist ammoniacal atmosphere on stressed binary copper alloys containing zinc, phosphorus, arsenic, antimony, silicon, nickel or aluminium. All these elements gave alloys susceptible to stress corrosion. In the case of zinc the breaking time decreased steadily with increase of zinc content, but with most of the other elements there was a minimum in the curve of content of alloying elements against breaking time. In tests carried out at almost 70MN/m these minima occurred with about 0-2% P, 0-2% As, 1% Si, 5% Ni and 1% Al. In most cases cracks were intercrystalline. [Pg.707]

Modification of alkyd resins with high proportions of silicones considerably reduces rates of attack, but the most spectacular extension of life is shown by fluorinated polymers such as polyvinylidene fluoride where erosion rates can be reduced to 0 -1 /tm/year. If this level of durability can be achieved an initial coating, if firmly adherent and free from any breaks, may often be expected to maintain protection over a metal substrate for the likely life of the structure. The considerably increased first cost, as compared with more conventional coatings, has to be balanced against the probable saving in maintenance costs or consequences of failure. [Pg.619]

The toxicity of lead-containing greases has led to alternative products being used for the protection of components where the product is likely to come in contact with rubber. Of those products considered silicone-based greases have been found to be particularly suitable and their application to hydraulic equipment components such as brake cylinders, where they can provide internal protection against corrosion both during transit and use, has been found particularly beneficial. [Pg.763]

Figure 17. PMC behavior in the accumulation region, (a) PMC potential curve and photocurrent-potential curve (dashed line) for silicon (dotted with Pt particles) in contact with propylene carbonate electrolyte containing ferrocene.21 (b) PMC potential curve and photocurrent-potential curve (dashed line) for a sputtered ZnO layer [resistivity 1,5 x 103 ft cm, on conducting glass (ITO)] in contact with an alkaline electrolyte (NaOH, pH = 12), measured against a saturated calomel electrode.22... Figure 17. PMC behavior in the accumulation region, (a) PMC potential curve and photocurrent-potential curve (dashed line) for silicon (dotted with Pt particles) in contact with propylene carbonate electrolyte containing ferrocene.21 (b) PMC potential curve and photocurrent-potential curve (dashed line) for a sputtered ZnO layer [resistivity 1,5 x 103 ft cm, on conducting glass (ITO)] in contact with an alkaline electrolyte (NaOH, pH = 12), measured against a saturated calomel electrode.22...

See other pages where Silicon against is mentioned: [Pg.27]    [Pg.60]    [Pg.252]    [Pg.2688]    [Pg.1623]    [Pg.723]    [Pg.406]    [Pg.266]    [Pg.27]    [Pg.60]    [Pg.252]    [Pg.2688]    [Pg.1623]    [Pg.723]    [Pg.406]    [Pg.266]    [Pg.1859]    [Pg.150]    [Pg.269]    [Pg.162]    [Pg.2463]    [Pg.66]    [Pg.230]    [Pg.404]    [Pg.543]    [Pg.50]    [Pg.256]    [Pg.21]    [Pg.526]    [Pg.697]    [Pg.700]    [Pg.100]    [Pg.173]    [Pg.1064]    [Pg.406]    [Pg.640]    [Pg.1027]    [Pg.971]    [Pg.552]    [Pg.498]   
See also in sourсe #XX -- [ Pg.31 , Pg.32 , Pg.33 , Pg.34 , Pg.35 , Pg.36 , Pg.37 , Pg.38 , Pg.39 , Pg.40 , Pg.41 , Pg.42 , Pg.43 , Pg.44 ]




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